Abstract: An assembly of passive backplane modules that allows a variety of active boards of the same or of different architectures to be used in the same chassis. This technology differs from any others in that it presents a second level of modularity, in addition of the usual one which is putting active boards in a passive backplane. Here, in addition, several backplane modules of different types allow different architectures to be used on a slot by slot basis. Furthermore, wiring requirements to link those backplane modules are reduced to a strict minimum.