Patents Assigned to Kontron Modular Computers S. A.
  • Patent number: 10404668
    Abstract: The present disclosure relates to a computing unit for securely performing an operation on encrypted data in an Internet of Things, IoT, environment. The computing unit comprises a secure element, at least one processor and at least one memory, wherein the at least one memory contains instructions executable by the at least one processor such that the computing unit is operable to obtain (S302) encrypted data collected by a sensor provided in the IoT environment, pass (S304) the encrypted data to the secure element requesting the secure element to decrypt the encrypted data and to perform an operation on the decrypted data, and obtain (S306) an encrypted or non-encrypted result of the operation from the secure element.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: September 3, 2019
    Assignee: Kontron Modular Computers S.A.S
    Inventors: Serge Tissot, Amina Belkorchi, Thomas Richard
  • Patent number: 8570749
    Abstract: An auxiliary device for conductively removing the heat produced by one or more components on an electronic card includes a heat sink covering all or part of the card. The device includes at least a first heat-conducting element mounted to absorb the heat produced by the one or more components, a movable second heat-conducting element, a heat pipe connecting the first element with the second element, and clamping means designed to press the movable second element against a cold wall.
    Type: Grant
    Filed: February 8, 2011
    Date of Patent: October 29, 2013
    Assignee: Kontron Modular Computers S.A.
    Inventor: Serge Tissot
  • Publication number: 20120069526
    Abstract: An auxiliary device for conductively removing the heat produced by one or more components on an electronic card includes a heat sink covering all or part of the card. The device includes at least a first heat-conducting element mounted to absorb the heat produced by the one or more components, a movable second heat-conducting element, a heat pipe connecting the first element with the second element, and clamping means designed to press the movable second element against a cold wall.
    Type: Application
    Filed: February 8, 2011
    Publication date: March 22, 2012
    Applicant: KONTRON MODULAR COMPUTERS S.A.
    Inventor: Serge TISSOT
  • Publication number: 20090236081
    Abstract: The present invention relates to a device for preheating a component cooled by conduction and/or by convection. The component is in contact with a heat conductor and the device includes a heater to heat the part, the device further including at least one heat pipe having fluid within, to connect a heat dissipater with the heat conductor, the dissipater and the part furthermore being thermally insulated from one another. Freezing of fluid in the heat pipe facilitates preheating of the component at low temperature. The invention applies notably to the starting of components subjected to low temperatures, for example, components installed in systems on board aircraft.
    Type: Application
    Filed: March 17, 2009
    Publication date: September 24, 2009
    Applicant: Kontron Modular Computers S. A.
    Inventors: Philippe Oconte, Serge Tissot, Michel Ritondale