Patents Assigned to KOOLMICRO INC.
  • Cooling apparatus, semiconductor device including the apparatus, and manufacturing method thereof
    Patent number: 12727478
    Abstract: A cooling apparatus may include a microchannel structure including a plurality of microchannels and a manifold disposed over the plurality of microchannels. The microchannel structure may be directly bonded to a chip and dissipate heat generated in the chip during an operation of the chip. The microchannel structure may further include a base over which the plurality of microchannels are disposed and a plurality of fins spaced apart from each other and disposed over the base.
    Type: Grant
    Filed: March 15, 2023
    Date of Patent: September 1, 2026
    Assignee: KOOLMICRO INC.
    Inventors: Yeong Lyeol Park, Kyo Sung Choo