Patents Assigned to KOREA E&S CO., LTD.
  • Printed circuit board and method for manufacturing the same
    Patent number: 9161460
    Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: October 13, 2015
    Assignees: SAMSUNG ELECTRO-MECHANICS CO., LTD., KOREA E & S CO., LTD.
    Inventors: Hyung Gi Ha, Jae Won Jung, Yong Hwan Kim, Jong Jin Lee, Ja Ho Koo, Young Hwan Shin, Dong Kyu Lee
  • PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20120168212
    Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate having a metal pattern for a circuit; and a surface roughness provided on the metal pattern, wherein the surface roughness has a first surface roughness in an anchor structure and a second surface roughness having a black oxide layer in a needle structure formed on the first surface roughness.
    Type: Application
    Filed: November 30, 2011
    Publication date: July 5, 2012
    Applicants: KOREA E&S CO., LTD., SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Gi HA, Jae Won JUNG, Yong Hwan KIM, Jong Jin LEE, Ja Ho KOO, Young Hwan SHIN, Dong Kyu LEE