Abstract: The following description relates to a method of low temperature sintering a catalyst layer that formed on one side of a counter electrode using a laser. It is possible to prepare a counter electrode for a dye-sensitized solar cell (DSSC) based on a flexible substrate easily because the method can be applied to a conducting substrate made of plastic materials as well as a conducting glass substrate.

Abstract: The present invention relates to a non-volatile electrical phase change memory device comprising a substrate, a first interlayer dielectric film deposited on the substrate, a bottom electrode layer formed on the first dielectric layer, a second interlayer dielectric film formed on the bottom electrode layer, a phase change material layer deposited on the second interlayer dielectric film, and a top electrode layer formed on said phase change material layer, the bottom electrode layer being brought into contact with the phase change material layer through a contact hole which is formed in the second interlayer dielectric film and filled with the phase change material or bottom electrode material, so that the phase change layer and the bottom electrode layer come into close contact with each other, wherein an interfacial control layer is formed at the interface of the contact hole between the phase change layer and the bottom electrode layer, said interfacial control layer having strong chemical bonds with t

Abstract: An electrical or electronic device and a thin-film type battery are vertically integrated and interconnected for reducing the area occupied thereby, enabling a higher degree of device integration and simplifying their fabrication. An insulating layer is formed on the device, with vertical conductors extending respectively from a pair of terminals of the device through the insulating layer. Electrode conductors are formed on the insulating layer in contact with the respective vertical conductors and serve as the cathode and anode electrodes of a thin-film battery fabricated thereon.

Abstract: An electrostatic thermal bonding method for bonding a pair of glass substrates, is capable of solving the problems such as a contamination of a device and incomplete vacuum packaging due to gas generated during the bonding of glass substrates utilizing a conventional epoxy or frit. The electrostatic thermal bonding method uses a silicon-glass bonding mechanism. First, a silicon thin film is deposited on a metal thin film formed on a side of one glass substrate, and the two glass substrates are brought face to face with each other by bringing the silicon thin film into contact with the surface of the other glass substrate. A predetermined direct current voltage is applied between the metal thin film and the other glass substrate under a predetermined temperature, thereby the bonding between glass substrates is performed. In the glass-glass bonding method utilizing the silicon thin film, the direct current voltage in the range of 0 to 1000V is applied under a bonding temperature between 100 to 500° C.

Abstract: A tactile feedback apparatus using an electromagnetic attraction for a remote control robot employs tactile data obtained during operation between a gripper attached to a robot arm of an externally controlled robot and the gripper's target so as to be transferred to an operator stationed in a central control room, thereby enabling the robot system to effectively carry out sophisticated tasks. The tactile feedback apparatus enables a successive tactile control by use of an electromagnetic attraction, and an array type fabrication, and by optimizing a production design to broaden a tactile feedback area, there may be provided a small tactile feedback device for representing a relatively improved tactility per unit, and further by aligning the tactile feedback devices in a 5.times.5 array mode on a skin of 15.times.15 mm.sup.2, there is obtained a contact location thereof.