Patents Assigned to KSM COMPONENT CO., LTD
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Patent number: 11456158Abstract: A ceramic structure including a first conductive structure embedded therein and a second conductive structure embedded at a different depth from the first conductive structure is disclosed. In the ceramic structure, the first conductive structure and the second conductive structure are electrically connected to each other by an electrically conductive connection member capable of compensating for a vertical shrinkage rate of a ceramic sheet shape while being embedded therein when sintering the ceramic structure.Type: GrantFiled: June 4, 2020Date of Patent: September 27, 2022Assignee: KSM COMPONENT CO., LTD.Inventor: Joo Hwan Kim
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Patent number: 11355377Abstract: One embodiment of the present invention discloses an electrostatic chuck made of an aluminum nitride sintered body, wherein the aluminum nitride sintered body comprises aluminum nitride and a composite oxide formed along the grain boundaries of the aluminum nitride, wherein the composite oxide comprises at least two kinds of rare earth metals which have a solid-solution relationship with each other, and wherein the composite oxide comprises a collection area having a higher oxygen content than a surrounding area.Type: GrantFiled: May 15, 2018Date of Patent: June 7, 2022Assignee: KSM COMPONENT CO., LTD.Inventors: Yun Ho Kim, Joo Hwan Kim
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Patent number: 11251061Abstract: Disclosed are: an electrostatic chuck having a high volume resistivity so as to reduce a leakage current, thereby improving the adsorption and desorption response characteristics of a semiconductor wafer; and a manufacturing method therefor. The electrostatic chuck is a sintered body in which an electrode is impregnated so as to fix a semiconductor wafer by electrostatic force, and comprises alumina, a sintering aid, and a rare earth composite oxide comprising two to five different rare earth metals, has adsorption and desorption response characteristics of a semiconductor wafer of two seconds or less, and has a volume resistivity at room temperature of 1.0E+16 ?·cm to 1.0E+17 ?·cm.Type: GrantFiled: October 31, 2019Date of Patent: February 15, 2022Assignees: KSM COMPONENT CO., LTD., FLOWSERVE KSM CO., LTD.Inventors: Yun Ho Kim, Joo Hwan Kim, Ki Ryong Lee
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Publication number: 20210360748Abstract: Provided are a plate type heater and a vapor deposition apparatus including the same including: a ceramic plate substrate; a heating wire layer located on the inside or on an upper surface of the ceramic plate substrate; a power supply line; and a bridge located on the heating wire layer and connecting the heating wire and the power supply line, wherein the bridge connects the heating wire and the power supply line by curving a bridge material having a length of 1.2 to 5 times based on the shortest distance between the heating wire and the power supply line.Type: ApplicationFiled: May 12, 2021Publication date: November 18, 2021Applicant: KSM COMPONENT CO., LTD.Inventor: Joo Hwan Kim
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Publication number: 20210285104Abstract: A shower head for a chemical vapor deposition system and a chemical vapor deposition device including the shower head are disclosed. The shower head includes a chamber; a process gas inlet for the chamber; a second gas distributor plate provided at the bottom of the chamber; and a first gas distributor plate stacked on the upper surface of the second gas distributor plate, wherein the first gas distributor plate includes multiple gas distribution holes, the second gas distributor plate includes multiple gas injection holes, and a distribution channel is arranged at the boundary surface between the first gas distributor plate and the second gas distributor plate so as to distribute a process gas, introduced through each gas distribution hole of the first gas distributor plate, to 2 to 8 gas injection holes of the second gas distributor plate.Type: ApplicationFiled: July 3, 2019Publication date: September 16, 2021Applicant: KSM COMPONENT CO., LTD.Inventor: Joo Hwan KIM
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Publication number: 20210249260Abstract: Disclosed are: an electrostatic chuck having a high volume resistivity so as to reduce a leakage current, thereby improving the adsorption and desorption response characteristics of a semiconductor wafer; and a manufacturing method therefor. The electrostatic chuck is a sintered body in which an electrode is impregnated so as to fix a semiconductor wafer by electrostatic force, and comprises alumina, a sintering aid, and a rare earth composite oxide comprising two to five different rare earth metals, has adsorption and desorption response characteristics of a semiconductor wafer of two seconds or less, and has a volume resistivity at room temperature of 1.0E+16 ?·cm to 1.0E+17 ?·cm.Type: ApplicationFiled: October 31, 2019Publication date: August 12, 2021Applicants: KSM COMPONENT CO., LTD., FLOWSERVE KSM CO., LTD.Inventors: Yun Ho KIM, Joo Hwan KIM, Ki Ryong LEE
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Publication number: 20200388469Abstract: A ceramic structure including a first conductive structure embedded therein and a second conductive structure embedded at a different depth from the first conductive structure is disclosed.Type: ApplicationFiled: June 4, 2020Publication date: December 10, 2020Applicant: KSM COMPONENT CO., LTD.Inventor: Joo Hwan KIM
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Publication number: 20200219747Abstract: One embodiment of the present invention discloses an electrostatic chuck made of an aluminum nitride sintered body, wherein the aluminum nitride sintered body comprises aluminum nitride and a composite oxide formed along the grain boundaries of the aluminum nitride, wherein the composite oxide comprises at least two kinds of rare earth metals which have a solid-solution relationship with each other, and wherein the composite oxide comprises a collection area having a higher oxygen content than a surrounding area.Type: ApplicationFiled: May 15, 2018Publication date: July 9, 2020Applicant: KSM COMPONENT CO., LTD.Inventors: Yun Ho KIM, Joo Hwan KIM
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Patent number: 10004113Abstract: Provided is a heating wire arrangement for a ceramic heater, which is an arrangement of a heating wire on a ceramic substrate in a ceramic heater and emits heat. The heating wire arrangement for the ceramic heater includes a heating wire that is a metal wire member extending in a longitudinal direction and is two-dimensionally arranged on a virtual two-dimensional (2D) plane that is substantially parallel to a top surface of the ceramic substrate. Thus, a uniform heat density may be maintained and a rapid temperature ramp-up may be enabled, unlike a conventional heating wire of a three-dimensional (3D) type.Type: GrantFiled: May 10, 2013Date of Patent: June 19, 2018Assignee: KSM Component Co., LTDInventor: Yun Ho Kim
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Publication number: 20150173127Abstract: Provided is a heating wire arrangement for a ceramic heater, which is an arrangement of a heating wire on a ceramic substrate in a ceramic heater and emits heat. The heating wire arrangement for the ceramic heater includes a heating wire that is a metal wire member extending in a longitudinal direction and is two-dimensionally arranged on a virtual two-dimensional (2D) plane that is substantially parallel to a top surface of the ceramic substrate. Thus, a uniform heat density may be maintained and a rapid temperature ramp-up may be enabled, unlike a conventional heating wire of a three-dimensional (3D) type.Type: ApplicationFiled: May 10, 2013Publication date: June 18, 2015Applicant: KSM COMPONENT CO., LTDInventor: Yun Ho Kim
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Patent number: D849810Type: GrantFiled: May 23, 2016Date of Patent: May 28, 2019Assignee: KSM Component Co., LTDInventor: Joo Hwan Kim
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Patent number: D1012997Type: GrantFiled: March 15, 2021Date of Patent: January 30, 2024Assignee: KSM COMPONENT CO., LTD.Inventor: Joo Hwan Kim
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Patent number: D1012998Type: GrantFiled: March 15, 2021Date of Patent: January 30, 2024Assignee: KSM COMPONENT CO., LTD.Inventor: Joo Hwan Kim
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Patent number: D1013750Type: GrantFiled: March 15, 2021Date of Patent: February 6, 2024Assignee: KSM COMPONENT CO., LTD.Inventor: Joo Hwan Kim