Patents Assigned to KUANG-CHI INSTITUTE OF ADVANCE TECHNOLOGY
  • Publication number: 20130154901
    Abstract: The present invention provides an artificial microstructure including a first metal wire, a second metal wire parallel to the first metal wire, at least one first metal wire branch and at least one second metal wire branch. The at least one first metal wire branch and the at least one second metal wire branch are distributed in an interlacement arrangement. One end of the at least one first metal wire branch is connected to the first metal wire; the other end is a free end facing towards the second metal wire. One end of the at least one second metal wire branch is connected to the second metal wire, and the other end of the at least one second metal wire is a free end facing towards the first metal wire. The present invention also discloses a metamaterial with the artificial microstructures.
    Type: Application
    Filed: October 27, 2011
    Publication date: June 20, 2013
    Applicant: KUANG-CHI INSTITUTE OF ADVANCE TECHNOLOGY
    Inventors: Ruopeng Liu, Lin Luan, Chaofeng Kou, Fanglong He