Abstract: Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below. In the formula, R1's each represent a hydrocarbon group having 1 to 10 carbon atoms; R2's each represent a hydrogen atom, Formula (1a), or Formula (1b), where at least one of R2's is Formula (1a) or Formula (1b); and n represents the number of repetitions of 0 to 5.

Abstract: To provide an epoxy resin composition that exhibits excellent low dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, a phenol resin and an epoxy resin for providing the composition, and a method for producing such a resin. A phenol resin containing a dicyclopentenyl group and represented by the following general formula (1): wherein each R1 independently represents a hydrocarbon group having 1 to 8 carbon atoms; each R2 independently represents a hydrogen atom or a dicyclopentenyl group, and at least one R2 is a dicyclopentenyl group; i is an integer of 0 to 2; and n represents the number of repetitions and an average value thereof is a number of 10 to 10.

Abstract: To provide a thermosetting resin composition that provides a cured product excellent in low-dielectric properties, high heat resistance, high adhesiveness, and the like. The thermosetting resin composition includes an aromatic polyhydroxy compound represented by the following formula (1), and a maleimide compound. In the formula, R1 independently represents a hydrocarbon group having 1 to 8 carbon atoms, R2 independently represents a hydrogen atom or a dicyclopentenyl group, and at least one R2 is a dicyclopentenyl group; and n represents the number of repetitions and an average value thereof is a number of 1 to 5.

Abstract: To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application. An epoxy resin composition containing an epoxy resin and a curing agent, wherein the epoxy resin is partially or fully an epoxy resin represented by the following general formula (1). Each R1 represents a hydrocarbon group having 1 to 8 carbon atoms, each R2 represents a hydrogen atom or a dicyclopentenyl group, and at least one R2 is a dicyclopentenyl group; and m represents a number of 0 to 5.

Abstract: To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application. An epoxy resin composition containing an epoxy resin and a curing agent, wherein the curing agent is partially or fully a polyvalent hydroxy resin represented by the following general formula (1). Each R1 independently represents a hydrocarbon group having 1 to 8 carbon atoms, each R2 independently represents a hydrogen atom or a dicyclopentenyl group, and at least one R2 is a dicyclopentenyl group; and n represents a number of repetitions of 0 to 5.

Abstract: Provided is a resin material showing a high thermal conductivity and having high heat resistance while having a low dielectric constant and a low dielectric loss tangent. The material is a polyfunctional vinyl resin, which is represented by the following general formula (1): where R1s each independently represent a hydrocarbon group having 1 to 8 carbon atoms, R2s each independently represent a hydrogen atom or a dicyclopentenyl group, and at least one thereof represents a dicyclopentenyl group, Xs each independently represent a hydrogen atom or a vinyl group-containing aromatic group represented by the formula (1a), and at least one thereof represents a vinyl group-containing aromatic group, “n” represents a number of repetitions, and the average thereof is a number of from 1 to 5, and Ar represents an aromatic ring.

Abstract: To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, as well as an active ester resin that provides the epoxy resin composition. An active ester resin having a polyaryloxy unit containing a dicyclopentenyl group and represented by the following formula (1), and a polyarylcarbonyl unit. Here, R1 represents a hydrocarbon group having 1 to 8 carbon atoms, R2 represents a hydrogen atom, or formula (1a) or formula (1b), and at least one R2 is formula (1a) or formula (1b); and n represents a number of repetitions of 1 to 5.

Abstract: The present disclosure relates to a method of preparing a furan monomer having a bifunctional hydroxymethyl group (2, 5-bis(hydroxymethyl) furan (BHMF)). The method includes converting furfuryl alcohol to a low-molecular weight furan mixture extracting and purifying the furan monomer having a bifunctional hydroxymethyl group from the low-molecular weight furan mixture.

Abstract: Provided are an epoxy resin composition, which exhibits excellent low dielectric properties, and imparts excellent copper foil peel strength and interlayer cohesive strength when used in printed circuit plate applications; and a phenolic resin or an epoxy resin, which are for forming the epoxy resin composition. The phenolic resin is represented by General Formula (1) below. In the formula, R1's each represent a hydrocarbon group having 1 to 10 carbon atoms; R2's each represent a hydrogen atom, Formula (1a), or Formula (1b), where at least one of R2's is Formula (1a) or Formula (1b); and n represents the number of repetitions of 0 to 5.

Abstract: Provided are an anisotropic conductive film, a display device including the same and/or a semiconductor device including the same, the film comprising a conductive layer, wherein the conductive layer is formed of a conductive layer composition containing conductive particles, the conductive particles have a saturation magnetization value and specific gravity satisfying following formulae (1) and (2): (1) about 10 emu/g?saturation magnetization value?about 20 emu/g; and (2) about 2.8?specific gravity?about 3.2.

Abstract: A composition for an antifogging coating includes isosorbide epoxy represented by Formula 1 below, a hardener, a hardening accelerator, and a silane coupling agent, wherein n is 0.2 to 7.

Abstract: A self-extinguishing epoxy resin for an epoxy molding compound (EMC) represented by Formula 1 is disclosed. The epoxy resin (composition) has excellent flame retardancy without using a halogen flame retardant or a phosphorous flame retardant. Upon comparison with NC-3000 that is one of the most widely and commercially available products of Nippon Kayaku Co., Ltd., the epoxy resin composition is a self-extinguishing epoxy resin for a high-end EMC having better or similar flame retardancy, excellent dimensional stability due to lower shrinkage rate, and ideal physical property balance with lower flexural modulus and higher glass transition temperature.

Abstract: An epoxy resin represented by general formula (I) satisfying numerical formula (1) with hydrolytic halogen of 0.05 wt. % or less, said epoxy resin produced as follows: after dissolving 0.8 to 1.3 mole of epihalohydrin to 1 mole of divalent phenol in a solvent, a pre-reaction is performed over 30 to 70 minutes by adding dropwise 0.25-0.35 mole of 30˜50% aqueous solution of alkali metal hydroxide over 30 to 70 minutes thereto, and thereafter, 0.65-0.75 mole of the remaining 30˜50% aqueous solution of alkali metal hydroxide is added dropwise over about 1 hour to complete the reaction over 1 to 3 hours. 0.5?X/Y?1.

Abstract: An epoxy resin represented by general formula (I), which satisfies numerical formula (1) mentioned below and comprises hydrolytic halogen of 0.05 wt. % or less, said epoxy resin being produced by the procedure as follows: after dissolving 0.8 to 1.3 mole of epihalohydrin to 1 mole of divalent phenol in a solvent, a pre-reaction is performed over 30 to 70 minutes by adding dropwise 0.25-0.35 mole of 30˜50% aqueous solution of alkali metal hydroxide over 30 to 70 minutes thereto, and thereafter, 0.65-0.75 mole of the remaining 30˜50% aqueous solution of alkali metal hydroxide is added dropwise over about 1 hour to complete the reaction over 1 to 3 hours. wherein n is an integer of 0 or more; A1 and A2 are residue of divalent phenol, and can be same or different; both R1 and R2 are H or wherein, X: epoxy equivalent (g/eq); Y: phenolic hydroxyl group equivalent (g/eq).

Abstract: Epoxy resin represented by general formula (I), wherein n is an integer of 0 or more, A1 and A2 are residue of divalent phenol, and A1 and A2 can be same or can be different and both R1 and R2 are H or which is synthesized from divalent phenol and epihalohydrine, and satisfies numerical formula (1), 0.3?X/Y?2.0??formula (1) wherein, X; epoxy equivalent (g/eq) Y; phenolic hydroxyl group equivalent (g/eq) further, amount of hydrolytic halogen is 0.05 wt. % or less.

Abstract: The present invention relates to a powder coating composition containing a low temperature curable epoxy resin, and more particularly to a powder coating composition containing a low temperature curable epoxy resin, which can be readily cured at a low temperature, thereby capable of being applied to coating objects that are noneconomic al in terms of workability at an elevated temperature, or are thermally sensitive. The present invention provides a powder coating composition comprising 100 parts by weight of a low temperature curable epoxy resin; 30 to 500 parts by weight of curing.

Abstract: The present invention relates to a powder coating composition containing a low temperature curable epoxy resin, and more particularly to a powder coating composition containing a low temperature curable epoxy resin, which can be readily cured at a low temperature, thereby capable of being applied to coating objects that are noneconomical in terms of workability at an elevated temperature, or are thermally sensitive. The present invention provides a powder coating composition comprising 100 parts by weight of a low temperature curable epoxy resin; 30 to 500 parts by weight of a bisphenol-A curing agent or a polyester curing agent; 0.1 to 20 parts by weight of a defoaming agent; and 0.1 to 20 parts by weight of a leveling agent.

Abstract: The present invention relates to a powder coating composition containing a low temperature curable epoxy resin, and more particularly to a powder coating composition containing a low temperature curable epoxy resin, which can be readily cured at a low temperature, thereby capable of being applied to coating objects that are noneconomical in terms of workability at an elevated temperature, or are thermally sensitive. The present invention provides a powder coating composition comprising 100 parts by weight of a low temperature curable epoxy resin; 30 to 500 parts by weight of curing.

Abstract: Disclosed is an epoxy resin modified with phosphorus and silicon having an synergistically improved flame retardant property, prepared by reacting an epoxy resin with phosphorus and silicon. The contents of phosphorus and silicon in the epoxy resin are 2.0 wt % to 3.2 wt % and 0.5 wt % to 2.2 wt %, respectively. The epoxy resin according to the present invention will be applicable to the preparation of electrical circuit boards.

Abstract: The invention provides a silicone-modified epoxy resin obtained through condensation polymerization of a methoxy group silicone intermediate to a bisphenol-based epoxy resin, and its preparing method and a composition comprising the said silicone-modified epoxy resin. The silicone-modified epoxy resin is excellent in heat resistance and of value for use in coatings for hot appliances such as oven.