Abstract: A bare semiconductor circuit die carrier is provided for use in the test of semiconductor circuits, the carrier, comprising: a substrate defining an opening and an outer perimeter; a multiplicity of I/O pads disposed about the perimeter; an interconnect circuit which includes a composite of a multiplicity of individual electrical conductors which are formed in a polymer dielectric; wherein the interconnect circuit overlays a top surface of the substrate and extends across the opening so as to form a flexible membrane that spans the opening; a multiplicity of die contact pads connected to the conductors are disposed about the flexible membrane with particles deposited on the die contact pads; a fence upstanding from the membrane and sized to receive a test die; a top cap that rests upon the die when the die is received within the fence; a bottom cap that rests against a bottom surface of the substrate; and a fastener for securing the top cap to the bottom cap with the die disposed therebetween.

Abstract: An improved automatic wire feed system for supplying a fine wire to a capillary bonding tool or to a wedge bonding tool is provided. The wire feed system includes a novel wire feed slack loop device which is mounted on the wire bonder between the bonding tool and the source of fine wire. The novel wire feed slack loop device comprises a pair of sector plates which are closely spaced apart from each other to provide an air space therebetween for receiving the fine wire. Compressed air is supplied to the air space between the sector plates and is directed radially outward by a diffuser shim plate which forces the wire to form into a uniform circular shape in the air space. Sensor means are provided at the outer perimeter of the sector plates which sense the position of the fine wire and supplies a signal to control means which turns off the rotation of the drive motor.

Abstract: Electrodes and lead-out terminals of semiconductor devices employ fine wire interconnections which require forming into a predetermined configuration. The method of the present invention provides several novel steps in a sequence of steps which causes the interconnection wire to be shaped in an extremely desirable configuration free of slack. The method is characterized by first preforming a portion of the wire in a direction opposite the direction of the desired interconnection and subsequently reforming the preformed portion of wire while the remainder of the interconnection wire is being formed in tension.