Patents Assigned to Kulite Semiconductor Products, Inc.
  • Patent number: 11162862
    Abstract: A pressure transducer is disclosed that includes an absolute pressure sensor assembly, a differential pressure sensor assembly, a main pressure port in communication with the absolute pressure sensor assembly and the differential pressure sensor assembly, a reference pressure port in communication with the differential pressure sensor assembly, and a compensation circuit in communication with the absolute pressure sensor assembly and the differential pressure sensor assembly. The compensation circuit is configured to reduce an error in an output of the differential pressure sensor assembly (due to absolute pressure) by at least a portion of an output received from the absolute pressure sensor assembly.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: November 2, 2021
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Wolf S. Landmann, Louis DeRosa
  • Patent number: 11060935
    Abstract: A reconfigurable pressure transducer assembly having an input tube filter assembly is provided. The resonant frequency and dampening characteristics associate with the pressure transducer assembly may be configured by the input tube filter assembly. The input tube filter assembly includes one or more inserts disposed in an input tube channel, the one or more inserts including one or more bores of selectable dimensions and extending therethrough from a first end to a second end. The one or more inserts define an effective input tube bore, and the input tube filter assembly is tunable by selection of the selectable dimensions of the one or more inserts.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: July 13, 2021
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Robert Gardner
  • Patent number: 10969289
    Abstract: The disclosed technology relates to a field serviceable pressure scanner suitable for high-pressure sensing applications and replacement of large pressure transmitter panels. The pressure scanner includes a housing having a mounting plate comprising a plurality of through-hole bores extending from a front to back side for mating with corresponding transducer ports of the pressure sensors, and a plurality of input ports disposed on the front side of the mounting plate and in communication with the corresponding plurality of through-hole bores. The pressure scanner assembly includes two or more field-replaceable (swappable) pressure sensors seal mounted to the back side of the mounting plate, each pressure sensor comprising one or more sensor ports, each of the one or more sensor port in communication with corresponding through-hole bores in the mounting plate, and a multi-channel data acquisition system configured to receive pressure signals from the two or more field-replaceable pressure sensors.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: April 6, 2021
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Joseph R. VanDeWeert, Steve Kleiber
  • Patent number: 10942076
    Abstract: The invention is an improved sensor assembly including a housing; a first header and a second header coupled to the housing; a first transducer coupled to the first header and a second transducer coupled to the second header. The first transducer is configured to measure a first pressure to generate a first pressure signal. The second transducer is configured to measure a second pressure to generate a second pressure signal. The first transducer and the second transducer are positioned in the housing such that a first temperature of the first transducer is about equivalent to a second temperature of the second transducer during operation of the sensor assembly.
    Type: Grant
    Filed: July 17, 2019
    Date of Patent: March 9, 2021
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Robert Gardner, Richard Martin
  • Patent number: 10871415
    Abstract: Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: December 22, 2020
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Alexander A. Ned, Leo Geras, Sorin Stefanescu
  • Patent number: 10837854
    Abstract: The disclosed technology includes a transducer assembly having a first transducer element. The transducer assembly includes a first filter element adjacent to least of portion of the first transducer element such that a first cavity is defined between the first filter element and the first transducer element. The first filter element includes a plurality of machined passageways in communication with the first cavity. The transducer assembly also includes an inlet passage having a first end in communication with a first external portion of the transducer assembly and a second end in communication with the plurality of machined passageways.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: November 17, 2020
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Robert Gardner, Louis DeRosa
  • Patent number: 10825719
    Abstract: A method for fabricating silicon-on-insulator (SOI) semiconductor devices, wherein the piezoresistive pattern is defined within a blanket doped layer after fusion bonding. This new method of fabricating SOI semiconductor devices is more suitable for simpler large scale fabrication as it provides the flexibility to select the device pattern/type at the latest stages of fabrication.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: November 3, 2020
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Alexander A. Ned, Sorin Stefanescu, Joseph R. VanDeWeert
  • Patent number: 10788386
    Abstract: Header construction and techniques are disclosed that utilize header layers that provide support for electrical interconnections. A sensor header assembly includes: an upper header layer having upper through holes arranged in a first configuration; a lower header layer having lower through holes arranged in a second configuration axially offset relative to the first configuration; depressions extending from the lower header layer top surface and partially through the lower header layer, each depression defining a footprint corresponding to the first configuration of the corresponding upper through holes of the upper header layer; upper header pins extending through the corresponding upper through holes and at least partially into the corresponding lower level depressions; and lower header pins extending through the corresponding lower through holes and in electrical communication with the corresponding upper header pins.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: September 29, 2020
    Assignee: KULITE SEMICONDUCTOR PRODUCTS, INC.
    Inventors: Alexander A. Ned, Scott Goodman
  • Patent number: 10768068
    Abstract: A pressure scanner assembly having at least one replaceable sensor plate, wherein each of the replaceable sensor plates has at least one pressure sensor adapted to transmit a signal substantially indicative of a sensed pressure condition. A memory chip, which stores correction coefficients for each of the pressure sensor to compensate for thermal errors, may be installed on each of the replaceable sensor plates. The signals from the pressure sensors are multiplexed and may be outputted in analog or digital form. The pressure scanner assemblies described herein have sensor plates that can be interchanged with other sensor plates of the same or different pressure range without disrupting the electronic configuration of the pressure scanner assembly or having to recalibrate and/or update the memory chip installed thereon.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: September 8, 2020
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Richard Martin, Louis DeRosa, Joseph R. VanDeWeert
  • Patent number: 10749516
    Abstract: Systems and methods are disclosed for a two lead electronic switch adapted to replace a mechanical switch. In one embodiment, a device is provided that includes a sensor and an electronic circuit having a voltage limiting circuit. The electronic circuit is configured to deactivate/activate the voltage limiting circuit to operate the electronic circuit in a first/second state in response to determining that an output of the sensor is less/more than a threshold voltage. The circuit includes first and second terminals configured to receive a switch voltage used to provide power for the device. The device sets the switch voltage to a first voltage level operative to power the electronic circuit and the sensor while the electronic circuit is operating in the first state and to a second voltage level operative to power the electronic circuit and the sensor while the electronic circuit is operating in the second state.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: August 18, 2020
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Wolf S. Landmann
  • Patent number: 10697827
    Abstract: Certain implementations of the disclosed technology may include systems and methods for extending a frequency response of a transducer. A method is provided that can include receiving a measurement signal from a transducer, wherein the measurement signal includes distortion due to a resonant frequency of the transducer. The method includes applying a complementary filter to the measurement signal to produce a compensated signal, wherein applying the complementary filter reduces the distortion to less than about +/?1 dB for frequencies ranging from about zero to about 60% or greater of the resonant frequency. The method further includes outputting the compensated signal.
    Type: Grant
    Filed: October 30, 2014
    Date of Patent: June 30, 2020
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Joe VanDeWeert, Adam Hurst, Joseph Carter, Douglas R. Firth, Alan R. Szary
  • Patent number: 10656036
    Abstract: The present invention provides a self-heated pressure sensor assembly and method of utilizing the same. The self-heated pressure sensor assembly regulates and maintains the temperature of the pressure sensor, regardless of the external temperature environment, without an external heater as in prior art embodiments. Exemplary embodiments of the pressure sensor assembly incorporate a resistance heater that is built into the sensing chip of the pressure sensor assembly. The pressure sensor assembly also utilizes the resistance of the pressure sensing elements to monitor the temperature of the assembly, which works alongside the resistance heater to maintain a stable temperature within the pressure sensor assembly.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: May 19, 2020
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Wolf S. Landmann, Joseph R. VanDeWeert
  • Patent number: 10634570
    Abstract: Systems and methods are disclosed for a switched, multiple range sensor system including multiple transducers. In one embodiment, a method is provided that includes receiving and measuring at a first transducer and a second transducer, a pressure to generate a respective first and second pressure signal; amplifying the first and second pressure signals with corresponding first and second fixed-gain amplifier to generate first and second amplified pressure signals; selecting for monitoring, the first or second amplified pressure signal; converting the selected amplified pressure signal to an intermediate digital pressure signal; measuring, at a thermal sensor associated with the selected amplified pressure signal, a temperature; compensating, based on the measured temperature, the intermediate digital pressure signal to generate a compensated digital pressure output signal; and outputting the compensated digital pressure output signal.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: April 28, 2020
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Joseph VanDeWeert, Haig Norian
  • Patent number: 10620073
    Abstract: This disclosure provides example methods, devices, and systems for a sensor having a Helmholtz resonator. In one embodiment, a system may comprise a sensing element; a header coupled to the sensing element; a housing coupled to the header; an adapter coupled to the housing; a screen disposed in an opening of the housing, wherein a first cavity is disposed between the screen and the sensing element and a second cavity is disposed between the adapter and the sensing element, and the screen in combination with the first cavity and the second cavity form a Helmholtz resonator.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: April 14, 2020
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Robert Gardner, Joseph VanDeWeert, Adam Hurst
  • Patent number: 10620075
    Abstract: Certain implementations of the disclosed technology may include systems, methods, and apparatus for assigning a distinct identifier (ID) to a pressure transducer based on resistor values. Embodiments include electrically identifying the distinct ID, and compensating the pressure transducer based on the distinct ID. According to an example implementation, a method is provided that can include coupling a transducer ID measurement assembly with a transducer assembly; measuring, by the transducer ID measurement assembly, a plurality of divided voltages between a plurality of configurable ID switches and a reference resistor; determining, with a processor, a distinct ID associated with the transducer assembly based on the plurality of measured divided voltages; retrieving one or more compensation parameters based on the distinct ID; and compensating, with the one or more compensation parameters, a measurement signal of the transducer assembly.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: April 14, 2020
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Wolf Landmann
  • Patent number: 10605685
    Abstract: Certain implementations of the disclosed technology include systems and methods for providing header assemblies for use with pressure sensors in high-temperature environments. Certain example implementations include a header assembly. The header assembly can include a header portion having a first side and a second side, the header portion including one or more bores extending through the header portion from the first side to the second side. In certain example implementations, one or more platinum header pins are disposed within and extending through the one or more bores of the header portion. In certain example implementations, the header assembly can include one or more brazing portions corresponding to the one or more platinum header pins. In certain example implementations, the platinum header pins are configured for electrical communication with corresponding electrodes of a leadless transducer element.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: March 31, 2020
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Alexander Ned, Sorin Stefanescu, Scott Goodman
  • Patent number: 10451511
    Abstract: A header assembly for a pressure sensor and methods for manufacturing and using the same are provided. In one example embodiment, a header insert may include a base; a hollow protrusion coupled to the base and having a metalized inner surface and a metalized outer surface, wherein the metalized outer surface of the hollow protrusion is used to couple to a header and the metalized inner surface of the hollow protrusion is used to couple to a header pin; and wherein a seal is formed between the header, the header insert and the header pin.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: October 22, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Richard Martin, Louis DeRosa, Robert Gardner
  • Patent number: 10436662
    Abstract: Systems and methods are disclosed for packaging sensors for use in high temperature environments. In one example implementation, a sensor device includes a header; one or more feedthrough pins extending through the header; and a sensor chip disposed on a support portion of the header. The sensor chip includes one or more contact pads. The sensor device further includes one or more wire bonded interconnections in electrical communication with the respective one or more contact pads and the respective one or more feedthrough pins. The sensor device includes a first sealed enclosure formed by at least a portion of the header. The first sealed enclosure is configured for enclosing and protecting at last the one or more wire bonded interconnections and the one or more contact pads from an external environment.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: October 8, 2019
    Assignee: KULITE SEMICONDUCTOR PRODUCTS, INC.
    Inventors: Alexander A. Ned, Leo Geras, Sorin Stefanescu
  • Patent number: 10387352
    Abstract: Certain implementations of the disclosed technology may include systems and methods for multibit code communications that can provide more than one bit per input port. In an example implementation, a method is provided that can include measuring an input voltage at an input port in communication with a device. The method can include comparing the measured input voltage with a plurality of predetermined reference voltage levels, and determining, based on the comparing, a device ID. The method can further include outputting the device ID. Certain implementations may further include compensating a signal associated with the device based on the identified device ID.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: August 20, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventor: Wolf Landmann
  • Patent number: 10371590
    Abstract: This disclosure provides example methods, devices, and systems for a sensor having thermal gradients. In one embodiment, a system may comprise a sensor assembly including a housing; a first header and a second header coupled to the housing; a first transducer coupled to the first header, wherein the first transducer is configured to measure a first pressure to generate a first pressure signal; a second transducer coupled to the second header, wherein the second transducer is configured to measure a second pressure to generate a second pressure signal; and wherein the first transducer and the second transducer are positioned in the housing such that a first temperature of the first transducer is about equivalent to a second temperature of the second transducer during operation of the sensor assembly.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: August 6, 2019
    Assignee: Kulite Semiconductor Products, Inc.
    Inventors: Louis DeRosa, Robert Gardner, Richard Martin