Patents Assigned to Kun Hsin Technology
  • Patent number: 8860045
    Abstract: An embodiment of the present invention provides a light emitting device including: a transparent substrate; a wiring layer disposed on the transparent substrate; a plurality of light emitting diode chips disposed on the transparent substrate and electrically connected to the wiring layer; and an opposite substrate disposed on the transparent substrate to sandwich the light emitting diode chips and the wiring layer, wherein no wiring layer is disposed on a surface of the opposite substrate facing the light emitting diode chips.
    Type: Grant
    Filed: August 4, 2012
    Date of Patent: October 14, 2014
    Assignee: Kun Hsin Technology
    Inventor: Kun-Chuan Lin