Abstract: A high-frequency and high-transmission speed FPC with FRCC. The FPC includes FRCC and a double-sided board laminated again each other. The FRCC includes a third copper foil layer, a second ultra-low dielectric adhesive layer and a second insulating layer located between the third copper foil layer and the second ultra-low dielectric adhesive layer. One surface of the third copper foil layer is an inner surface. The double-sided board includes a first copper foil layer, a second copper foil layer and a first insulating layer located between the first copper foil layer and the second copper foil layer. An inner surface of the first copper foil layer has an Rz value of 0.05-0.5 ?m. An inner surface of the second copper foil layer has an Rz value of 0.1-1.10 ?m. The FPC has a good electrical property, a simple structure, a cost advantage, a brief preparation process, and a low thermal expansion coefficient.

Abstract: The invention discloses a high-haze colored ultra-thin high-frequency cover film and a preparation method thereof, including a colored ink layer and a high-frequency adhesive layer. The colored ink layer is located above the high-frequency adhesive layer, and the colored ink layer is provided with at least one layer. A hardness of the colored ink layer is HB-5H. A glossiness of the colored ink layer ranges from 0 to 60% (60°). A roughness of the colored ink layer is 50-1000 nm. A thickness of the colored ink layer is 1-10 microns, and a thickness of the high-frequency adhesive layer is 3-25 microns. The high-haze colored ultra-thin high-frequency cover film provided by the present invention includes a colored ink layer and a high-frequency adhesive layer, and the upper portion and the lower portion are respectively attached to the release film or the release layer of the release paper.

Abstract: The invention discloses a composite LCP high-frequency high-speed double-sided copper foil substrate, which includes at least one LCP core layer, at least one extremely low dielectric adhesive layer, and two copper foil layers. The LCP core layer and the extremely low dielectric adhesive layer are located between the two copper foil layers. The invention has not only good electrical performance but also low roughness, stable dk/df performance in high temperature and humid environment, ultra-low water absorption, good UV laser drilling ability, low spring force suitable for high density assembly, and excellent mechanical properties. Besides, in current technology, only a thickness limited to a maximum of about 50 ?m can be obtained in the coating method. In the preparation method of the invention, a substrate having a thickness of 100 ?m or more can be easily obtained.