Patents Assigned to Kunshan Aplus Tec. Corporation
  • Patent number: 11369023
    Abstract: The invention discloses a composite LCP high-frequency high-speed double-sided copper foil substrate, which includes at least one LCP core layer, at least one extremely low dielectric adhesive layer, and two copper foil layers. The LCP core layer and the extremely low dielectric adhesive layer are located between the two copper foil layers. The invention has not only good electrical performance but also low roughness, stable dk/df performance in high temperature and humid environment, ultra-low water absorption, good UV laser drilling ability, low spring force suitable for high density assembly, and excellent mechanical properties. Besides, in current technology, only a thickness limited to a maximum of about 50 ?m can be obtained in the coating method. In the preparation method of the invention, a substrate having a thickness of 100 ?m or more can be easily obtained.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: June 21, 2022
    Assignee: KUNSHAN APLUS TEC. CORPORATION
    Inventors: Chihming Lin, Weichih Lee, Chienhui Lee
  • Patent number: 10645799
    Abstract: A high-frequency and high-transmission speed FPC with FRCC. The FPC includes FRCC and a double-sided board laminated again each other. The FRCC includes a third copper foil layer, a second ultra-low dielectric adhesive layer and a second insulating layer located between the third copper foil layer and the second ultra-low dielectric adhesive layer. One surface of the third copper foil layer is an inner surface. The double-sided board includes a first copper foil layer, a second copper foil layer and a first insulating layer located between the first copper foil layer and the second copper foil layer. An inner surface of the first copper foil layer has an Rz value of 0.05-0.5 ?m. An inner surface of the second copper foil layer has an Rz value of 0.1-1.10 ?m. The FPC has a good electrical property, a simple structure, a cost advantage, a brief preparation process, and a low thermal expansion coefficient.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: May 5, 2020
    Assignee: KUNSHAN APLUS TEC. CORPORATION
    Inventors: Bo-sian Du, Chihming Lin, Chienhui Lee
  • Patent number: 10609815
    Abstract: The invention discloses a high-haze colored ultra-thin high-frequency cover film and a preparation method thereof, including a colored ink layer and a high-frequency adhesive layer. The colored ink layer is located above the high-frequency adhesive layer, and the colored ink layer is provided with at least one layer. A hardness of the colored ink layer is HB-5H. A glossiness of the colored ink layer ranges from 0 to 60% (60°). A roughness of the colored ink layer is 50-1000 nm. A thickness of the colored ink layer is 1-10 microns, and a thickness of the high-frequency adhesive layer is 3-25 microns. The high-haze colored ultra-thin high-frequency cover film provided by the present invention includes a colored ink layer and a high-frequency adhesive layer, and the upper portion and the lower portion are respectively attached to the release film or the release layer of the release paper.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: March 31, 2020
    Assignee: KUNSHAN APLUS TEC.CORPORATION
    Inventors: Lichih Yang, Weichih Lee, Chienhui Lee, Chihming Lin
  • Publication number: 20190215947
    Abstract: A high-frequency and high-transmission speed FPC with FRCC. The FPC includes FRCC and a double-sided board laminated again each other. The FRCC includes a third copper foil layer, a second ultra-low dielectric adhesive layer and a second insulating layer located between the third copper foil layer and the second ultra-low dielectric adhesive layer. One surface of the third copper foil layer is an inner surface. The double-sided board includes a first copper foil layer, a second copper foil layer and a first insulating layer located between the first copper foil layer and the second copper foil layer. An inner surface of the first copper foil layer has an Rz value of 0.05-0.5 ?m. An inner surface of the second copper foil layer has an Rz value of 0.1-1.10 ?m. The FPC has a good electrical property, a simple structure, a cost advantage, a brief preparation process, and a low thermal expansion coefficient.
    Type: Application
    Filed: August 31, 2018
    Publication date: July 11, 2019
    Applicant: Kunshan Aplus Tec. Corporation
    Inventors: Bo-sian DU, Chihming LIN, Chienhui LEE
  • Publication number: 20180343738
    Abstract: The invention discloses a high-haze colored ultra-thin high-frequency cover film and a preparation method thereof, including a colored ink layer and a high-frequency adhesive layer. The colored ink layer is located above the high-frequency adhesive layer, and the colored ink layer is provided with at least one layer. A hardness of the colored ink layer is HB-5H. A glossiness of the colored ink layer ranges from 0 to 60% (60°). A roughness of the colored ink layer is 50-1000 nm. A thickness of the colored ink layer is 1-10 microns, and a thickness of the high-frequency adhesive layer is 3-25 microns. The high-haze colored ultra-thin high-frequency cover film provided by the present invention includes a colored ink layer and a high-frequency adhesive layer, and the upper portion and the lower portion are respectively attached to the release film or the release layer of the release paper.
    Type: Application
    Filed: October 27, 2017
    Publication date: November 29, 2018
    Applicant: Kunshan Aplus Tec. Corporation
    Inventors: Lichih YANG, Weichih LEE, Chienhui LEE, Chihming LIN
  • Publication number: 20180332710
    Abstract: The invention discloses a composite LCP high-frequency high-speed double-sided copper foil substrate, which includes at least one LCP core layer, at least one extremely low dielectric adhesive layer, and two copper foil layers. The LCP core layer and the extremely low dielectric adhesive layer are located between the two copper foil layers. The invention has not only good electrical performance but also low roughness, stable dk/df performance in high temperature and humid environment, ultra-low water absorption, good UV laser drilling ability, low spring force suitable for high density assembly, and excellent mechanical properties. Besides, in current technology, only a thickness limited to a maximum of about 50 ?m can be obtained in the coating method. In the preparation method of the invention, a substrate having a thickness of 100 ?m or more can be easily obtained.
    Type: Application
    Filed: December 28, 2017
    Publication date: November 15, 2018
    Applicant: Kunshan Aplus Tec. Corporation
    Inventors: Chihming LIN, Weichih LEE, Chienhui LEE