Abstract: A casing includes a main body made of a conductive composite material and a local portion located adjacent to a wireless device. The local portion has a non-conductive layer and a conductive composite material layer. The thickness of the conductive composite material layer is thinner than that of the main body that is immediately adjacent to the conductive composite material layer. Signal emitting and signal receiving of the wireless device is not affected by the thickness of the conductive composite material layer of the local portion. The part of the local portion that has a thickness thinner than a thickness of the adjacent main body is installed with the non-conductive layer. The non-conductive layer is tightly connected with the conductive composite material layer of the local portion and the main body that is immediately adjacent to the non-conductive layer.

Abstract: A housing structure for an electronic device and a manufacturing method thereof are disclosed. The housing structure includes a composite material panel. An inner surface of the composite material panel is coated with a film medium layer. One surface of the film medium layer is adhered to the inner surface of the composite material panel, and the other surface of the film medium layer is adhered with a plastic member. The method combines the composite material panel and the plastic member by way of the film medium layer as a medium to achieve the purpose of injection molding and adhering the plastic member on the composite material panel, and thereby obtaining the housing structure for an electronic device. In comparison with the prior art, the method can overcome the disadvantages of the composite material panel not able to be formed as a structural member having complicated structures.

Abstract: A casing includes a main body made of a conductive composite material and a local portion located adjacent to a wireless device. The local portion has a non-conductive layer and a conductive composite material layer. The thickness of the conductive composite material layer is thinner than that of the main body that is immediately adjacent to the conductive composite material layer. Signal emitting and signal receiving of the wireless device is not affected by the thickness of the conductive composite material layer of the local portion. The part of the local portion that has a thickness thinner than a thickness of the adjacent main body is installed with the non-conductive layer. The non-conductive layer is tightly connected with the conductive composite material layer of the local portion and the main body that is immediately adjacent to the non-conductive layer.