Abstract: A process for improving the performance of the sliding rheostat of 5G communication high-frequency signal board with the sliding rheostat slides along between two bonding pads, includes the following steps: outer layer etching; resin plugging: a. plugging the resinous ink into the pre-plugging position; b: baking, baking on the baking plate of the oven after the plugging is finished; board polishing: using a ceramic brush to process the plugged board, then using a non-woven fabric blush to polish the surface that is polished by ceramic brush. The present invention provides a process for improving the performance of the sliding rheostat of 5G communication high-frequency signal board. The resin plugging method is used to plug the gap between the conductors of the sliding rheostat, so as to prevent the sliding rheostat from being unable to slide due to the altitude difference between conductors of the high-frequency signal board.

Abstract: A gold-plating etching process for 5G high-frequency signal boards is carried out according to the following steps: the outer dry film, the plug gold-plating, the film removing, and the alkaline etching. The alkaline etching solution comprises 100 to 150 g/L of cupric chloride, 90 to 120 g/L of ammonium chloride, and ammonia. The pH value is 9.6 to 9.8. The ratio of the ammonia and the alkaline etching solution is (550-800):1000. The present invention provides a gold-plating etching process of 5G high-frequency signal boards. The alkaline etching procedure is performed right after gold-plating, eliminating the outer etching process after gold-plating. Costs of the outer film pressing, the exposure, and the development can be saved. The flow rate is improved. Requirements of 5G communication circuit boards are satisfied. That is, the transmission speed of 5G communication high-frequency signal boards of the present invention is fast.

Abstract: A process for improving the performance of the sliding rheostat of 5G communication high-frequency signal board with the sliding rheostat slides along between two bonding pads, includes the following steps: outer layer etching; resin plugging: a. plugging the resinous ink into the pre-plugging position; b: baking, baking on the baking plate of the oven after the plugging is finished: board polishing: using a ceramic brush to process the plugged board, then using a non-woven fabric blush to polish the surface that is polished by ceramic brush. The present invention provides a process for improving the performance of the sliding rheostat of 5G communication high-frequency signal board. The resin plugging method is used to plug the gap between the conductors of the sliding rheostat, so as to prevent the sliding rheostat from being unable to slide due to the altitude difference between conductors of the high-frequency signal board.

Abstract: A gold-plating etching process for 5G high-frequency signal boards is carried out according to the following steps: the outer dry film, the plug gold-plating, the film removing, and the alkaline etching The alkaline etching solution comprises 100 to 150 g/L. of cupric chloride, 90 to 120 g/L of ammonium chloride, and ammonia. The pH value is 9.6 to 9.8. The ratio of the ammonia and the alkaline etching solution is (550-800):1000. The present invention provides a gold-plating etching process of 5G high-frequency signal boards. The alkaline etching procedure is performed right after gold-plating, eliminating the outer etching process after gold-plating. Costs of the outer film pressing, the exposure, and the development can be saved. The flow rate is improved. Requirements of 5G communication circuit boards are satisfied. That is, the transmission speed of 5G communication high-frequency signal boards of the present invention is fast.