Abstract: A mould assembly with a heating device comprises: an upper mould with an upper joint surface, a lower mould, two conductive plates and two conductive wires. The lower mould includes a conductive layer, a lower joint surface which is formed on the conductive layer and faces the upper joint surface, an insulating surface which is formed on the conductive layer and faces in an opposite direction from the lower joint surface, an insulating formed on the insulating surface. The two conductive plates are disposed on the conductive layer of the lower mould. The two conductive wires are connected to the conductive plates and each have a resistivity lower than a resistivity of the conductive layer. The mould assembly with a heating device is low cost and capable of making the temperature distribution on the surface of the mould assembly more uniform.

Abstract: A notebook computer includes a plurality of securing holes formed on a bottom surface thereof and a plurality of footpads mounted to the bottom surface of the notebook computer through the securing holes. Each footpad includes an inner element and an outer element, and the outer element is moulded on the inner element and has a large friction coefficient. The inner element has at least one securing post formed on a top surface thereof for respectively insertion into the securing hole of the notebook computer. The footpad is formed by an integrated injection moulding process in which the inner element is first moulded, and then the outer element is moulded on the inner element. The moulding efficiency is improved. Further, the footpad features anti-slipping due to the large friction coefficient of the outer element.