Abstract: Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions, such as copper nanoparticle paste compositions, may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer. Adherence of the monolithic metal bodies within the vias may be promoted by a coating upon the walls of the vias. A tin coating, for example, may be particularly suitable for promoting adherence of a monolithic metal body comprising copper.

Abstract: Electronic assemblies may be fabricated with interconnects of different types present in multiple locations and comprising fused copper nanoparticles. Each interconnect or a portion thereof comprises a bulk copper matrix formed from fusion of copper nanoparticles or a reaction product formed from copper nanoparticles. The interconnects may comprise a copper-based wire bonding assembly, a copper-based flip chip connection, a copper-based hermetic seal assembly, a copper-based connector between an IC substrate and a package substrate, a copper-based component interconnect, a copper-based interconnect comprising via copper for establishing electrical communication between opposite faces of a package substrate, a copper-based interconnect defining a heat channel formed from via copper, and any combination thereof.

Abstract: Electronic assemblies may be fabricated with interconnects of different types present in multiple locations and comprising fused copper nanoparticles. Each interconnect or a portion thereof comprises a bulk copper matrix formed from fusion of copper nanoparticles or a reaction product formed from copper nanoparticles. The interconnects may comprise a copper-based wire bonding assembly, a copper-based flip chip connection, a copper-based hermetic seal assembly, a copper-based connector between an IC substrate and a package substrate, a copper-based component interconnect, a copper-based interconnect comprising via copper for establishing electrical communication between opposite faces of a package substrate, a copper-based interconnect defining a heat channel formed from via copper, and any combination thereof.

Abstract: Metal nanoparticle agglomerates may aid in promoting infection control over an extended period of time when adhered to a touch or contact surface of personal protective equipment, such as gloves or garments. Gloves may comprise a body having one or more touch surfaces when worn, and metal nanoparticle agglomerates adhered to a material defining the one or more touch surfaces. The gloves may further comprise an identifying tag associated with the material. The identifying tag may be electronically identifiable, which may track, for example, how long the gloves have been in use, whether the gloves have been worn, conditions under which the gloves have been worn, and/or locations where the gloves have been worn. Other personal protective equipment and garments may similarly comprise metal nanoparticle agglomerates adhered to at least a portion of a material shaped for wear, optionally including an identifying tag associated with the material.

Abstract: Protective coverings having metal nanoparticle agglomerates adhered thereto may be applied to a surface subject to infection. The protective coverings may comprise a base substrate, and metal nanoparticle agglomerates thereof adhered to the base substrate. The base substrate may be configured for attachment to the surface subject to infection. The surface subject to infection may be a mask or facial covering in a particular example. The base substrate may be conformable to the surface subject to infection and optionally include mechanical connectors and/or a contact adhesive upon at least one side thereof to promote surface attachment. The protective coverings may be applied to a contaminated touch surface as a temporary protective layer until disinfection has taken place. Alternately, the protective coverings may be used in routine infection control procedures. The protective coverings may be formed by applying a spray formulation comprising metal nanoparticle agglomerates upon a suitable base substrate.

Abstract: Spray formulations comprising metal nanoparticle agglomerates dispersed in an aerosolizable fluid medium may be utilized to promote disinfection of various types of surfaces and/or to facilitate reuse of masks and other types of personal protective equipment. The spray formulations may be dispensed using an aerosol propellant, or by mechanical pumping or gas compression. Metal nanoparticles, such as copper and/or silver nanoparticles, may be present in the spray formulations and aid in inactivating pathogens such as viruses and bacteria once the spray formulations have been deposited upon a surface. An adhesive may be present in the spray formulations to promote adherence of metal nanoparticle agglomerates to the surface.

Abstract: Metal nanoparticle agglomerates in various forms may be utilized to promote infection control. Antiseptic substrates may comprise a base substrate and metal nanoparticle agglomerates adhered thereto. Metal nanoparticle agglomerates upon the antiseptic substrates may be contacted with a skin penetration, a skin injury, a burn, a site to be subjected to a skin penetration, or an active skin infection to provide infection control against at least one infective agent. The antiseptic substrates may also facilitate water purification in some cases. Antiseptic fluid formulations comprising a fluid medium having metal nanoparticle agglomerates dispersed therein may be configured for topical or oral use and may similarly afford infection control. Creams, ointments, balms, salves, gels, and liquids or liquid suspensions containing metal nanoparticle agglomerates may be effective for promoting infection control and/or for treating an active infection.

Abstract: Metal nanoparticle agglomerates may convey biocidal activity to surfaces upon which they are deposited and become adhered, such as various air filtration media. Air filtration media may comprise a plurality of fibers having a plurality of metal nanoparticle agglomerates adhered thereto. The metal nanoparticle agglomerates may comprise a plurality of fused, partially fused, or unfused metal nanoparticles that are associated with one another upon a surface of the plurality of the fibers. Suitable metal nanoparticles for promoting biocidal activity against various pathogens, such as viruses and bacteria, may include copper nanoparticles and/or silver nanoparticles. Masks, inline filters, and air filtration systems may incorporate the air filtration media.

Abstract: Printed circuit boards may be formed using ceramic substrates with high thermal conductivity to facilitate heat dissipation. Metal nanoparticles, such as copper nanoparticles, may be used to form conductive traces and fill through-plane vias upon the ceramic substrates. Multi-layer printed circuit boards may comprise two or more ceramic substrates adhered together, wherein each ceramic substrate has one or more conductive traces defined thereon and the one or more conductive traces are formed through consolidation of metal nanoparticles. The one or more conductive traces in a first ceramic substrate layer are in electrical communication with at least one second ceramic substrate layer adjacent thereto.

Abstract: Metal nanoparticle agglomerates may render the surface of an article biocidal toward microorganisms. Articles having a biocidal surface may comprise a coating comprising metal nanoparticle agglomerates adhered via an adhesive to at least a portion of a surface of the article. A coating formulation comprising metal nanoparticle agglomerates may be applied to the surface of an article to accomplish the foregoing.

Abstract: Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer.

Abstract: According to embodiments of the present invention, a method of interconnecting nanowires is provided. The method includes providing a plurality of nanowires, providing a plurality of nanoparticles, and fusing the plurality of nanoparticles to the plurality of nanowires to interconnect the plurality of nanowires to each other via the plurality of nanoparticles. According to further embodiments of the present invention, a nanowire network and a transparent conductive electrode are also provided.

Abstract: According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.

Abstract: According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.

Abstract: Electronic assemblies may be fabricated with interconnects of different types present in multiple locations and comprising fused copper nanoparticles. Each interconnect or a portion thereof comprises a bulk copper matrix formed from fusion of copper nanoparticles or a reaction product formed from copper nanoparticles. The interconnects may comprise a copper-based wire bonding assembly, a copper-based flip chip connection, a copper-based hermetic seal assembly, a copper-based connector between an IC substrate and a package substrate, a copper-based component interconnect, a copper-based interconnect comprising via copper for establishing electrical communication between opposite faces of a package substrate, a copper-based interconnect defining a heat channel formed from via copper, and any combination thereof.

Abstract: Metal nanoparticles and compositions derived therefrom can be used in a number of different applications. Methods for making metal nanoparticles can include providing a first metal salt in a solvent; converting the first metal salt into an insoluble compound that constitutes a plurality of nanoparticle seeds; and after forming the plurality of nanoparticle seeds, reacting a reducing agent with at least a portion of a second metal salt in the presence of at least one surfactant and the plurality of nanoparticle seeds to form a plurality of metal nanoparticles. Each metal nanoparticle can include a metal shell formed around a nucleus derived from a nanoparticle seed, and the metal shell can include a metal from the second metal salt. The methods can be readily scaled to produce bulk quantities of metal nanoparticles.

Abstract: Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions, such as copper nanoparticle paste compositions, may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer. Adherence of the monolithic metal bodies within the vias may be promoted by a coating upon the walls of the vias. A tin coating, for example, may be particularly suitable for promoting adherence of a monolithic metal body comprising copper.

Abstract: According to embodiments of the present invention, a method of interconnecting nanowires is provided. The method includes providing a plurality of nanowires, providing a plurality of nanoparticles, and fusing the plurality of nanoparticles to the plurality of nanowires to interconnect the plurality of nanowires to each other via the plurality of nanoparticles. According to further embodiments of the present invention, a nanowire network and a transparent conductive electrode are also provided.

Abstract: Vias may be established in printed circuit boards or similar structures and filled with a monolithic metal body to promote heat transfer. Metal nanoparticle paste compositions may provide a ready avenue for filling the vias and consolidating the metal nanoparticles under mild conditions to form each monolithic metal body. The monolithic metal body within each via can be placed in thermal contact with one or more heat sinks to promote heat transfer.

Abstract: An ink adapted for forming conductive elements is disclosed. The ink includes a plurality of nanoparticles and a carrier. The nanoparticles comprise copper and have a diameter of less than 20 nanometers. Each nanoparticle has at least a partial coating of a surfactant configured to separate adjacent nanoparticles. Methods of creating circuit elements from copper-containing nanoparticles by spraying, tracing, stamping, burnishing, or heating are disclosed.