Patents Assigned to KWO GER Metal Technology, Inc.
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Patent number: 8403540Abstract: A lighting device includes a housing, and a light-emitting module mounted in an accommodation chamber inside the housing and carrying a set of light-emitting devices on a circuit board thereof for emitting light, a plurality of refracting prisms for refracting a part of the light emitted by the light-emitting devices horizontally toward two opposing sides through the light transmissive peripheral wall of the top cover shell of the housing and two opposing double-beveled reflectors for reflecting the other part of the light emitted by the light-emitting devices toward the outside through the light transmissive peripheral wall of the top cover shell of the housing in the same opposing directions. Thus, the invention extends the luminous range of the light-emitting devices, enhances the luminance and reduces light loss.Type: GrantFiled: July 21, 2010Date of Patent: March 26, 2013Assignee: Kwo Ger Metal Technology, Inc.Inventors: Chin-Yuan Cheng, Hong-Long Chen
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Patent number: 8342711Abstract: A light-emitting unit adapter module includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a light-emitting unit mountable in the mounting base, and a holding-down device fastenable to the mounting base to hold down the light-emitting unit, keeping the tubular electrodes of the light-emitting unit in positive contact with the electrode pins of the circuit board for power input and the heat sink of the light-emitting unit suspending outside the mounting base for quick dissipation of waste heat during operation of the light-emitting devices of the light-emitting unit.Type: GrantFiled: May 24, 2010Date of Patent: January 1, 2013Assignee: Kwo Ger Metal Technology, Inc.Inventors: Hsuan-Chih Lin, Hong-Long Chen
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Patent number: 8342716Abstract: A LED head sink module includes a LED module, which comprises a circuit substrate, a LED chip installed in the circuit substrate, a packing cup molded on the circuit substrate around the LED chip and a lens molded on the packing cup over the LED chip, a heat sink, which has a base and a flat mounting block located on the bottom side of the base for stopping against the circuit substrate of the LED module for absorbing waste heat, a bracket, which has a center opening that receives the circuit substrate of the LED module, first retaining members for fastening to a retaining portion at the periphery of the packing cup and second retaining members for fastening to the flat mounting block of the heat sink, and a water seal sandwiched between the LED module and the bracket to seal off outside moisture and dust.Type: GrantFiled: April 16, 2010Date of Patent: January 1, 2013Assignee: KWO GER Metal Technology, Inc.Inventor: Hsuan-Chih Lin
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Patent number: 8205664Abstract: A combination heat sink form of a stack of radiation fins is disclosed. Each radiation fin has retaining flanges at two opposite lateral sides for securing another radiation fin. Each retaining flange has a bottom neck perpendicularly extending from the respective radiation fin, two pairs of vertically spaced retaining fingers respectively extending from two opposite lateral sides of the bottom neck in a parallel manner relative to the respective radiation fin for securing another radiation fin, a top retaining notch defined between the two pairs of vertically spaced retaining fingers above the bottom neck for accommodating the bottom neck of another radiation fin, and a retaining gap defined between each two vertically spaced retaining fingers for receiving another radiation fin.Type: GrantFiled: May 19, 2008Date of Patent: June 26, 2012Assignee: Kwo Ger Metal Technology, Inc.Inventor: Chun-Hao Deng
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Patent number: 8193012Abstract: A method of fabricating a LED module by: bonding one or multiple LED chips and multiple conducting terminals to a circuit substrate, and then molding a packing cup on the circuit substrate over by over molding for enabling the LED chip(s) and the conducting terminals to be exposed to the outside of the packing cup, and then molding a lens on the packing cup and the LED chip(s) by over-molding. By means of directly molding the lens on the packing cup and the LED chip(s), no any gap is left in the lens, avoiding deflection, total reflection or light attenuation and enhancing luminous brightness and assuring uniform distribution of output light.Type: GrantFiled: May 13, 2010Date of Patent: June 5, 2012Assignee: KWO Ger Metal Technology, Inc.Inventor: Hsuan-Chih Lin
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Patent number: 8038328Abstract: A light-emitting device pressure ring structure includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a holder member insertable in the mounting base, a light-emitting unit fixedly mounted in the holder member with a bottom heat sink thereof suspending outside the holder member and tubular electrodes thereof connectable to the electrode pins of the circuit board for power input, and a pressure ring cap detachably threaded onto the mounting base to hold down the holder member and to keep the heat sink of the light-emitting unit outside the mounting base for quick dissipation of waste heat from the light-emitting devices of the light-emitting unit.Type: GrantFiled: May 24, 2010Date of Patent: October 18, 2011Assignee: KWO GER Metal Technology, Inc.Inventors: Hsuan-Chih Lin, Hong-Long Chen
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Publication number: 20100315815Abstract: A light-emitting unit adapter module includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a light-emitting unit mountable in the mounting base, and a holding-down device fastenable to the mounting base to hold down the light-emitting unit, keeping the tubular electrodes of the light-emitting unit in positive contact with the electrode pins of the circuit board for power input and the heat sink of the light-emitting unit suspending outside the mounting base for quick dissipation of waste heat during operation of the light-emitting devices of the light-emitting unit.Type: ApplicationFiled: May 24, 2010Publication date: December 16, 2010Applicant: KWO GER METAL TECHNOLOGY, INC.Inventors: Hsuan-Chih LIN, Hong-Long Chen
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Publication number: 20100032136Abstract: A cooler module formed of a heat sink and a cooling fan is disclosed. A heat receiving base member of the heat sink has a flat bottom center contact surface and a plurality of bottom sloping surfaces (or one tapered bottom surface) obliquely upwardly extended from the border of the flat bottom center contact surface to the border of the heat receiving base member for spreading heat in all directions rapidly and evenly.Type: ApplicationFiled: March 12, 2009Publication date: February 11, 2010Applicant: KWO GER METAL TECHNOLOGY, INCInventors: HONG-LONG CHEN, YI-FU CHEN
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Publication number: 20090284920Abstract: A combination heat sink form of a stack of radiation fins is disclosed. Each radiation fin has retaining flanges at two opposite lateral sides for securing another radiation fin. Each retaining flange has a bottom neck perpendicularly extending from the respective radiation fin, two pairs of vertically spaced retaining fingers respectively extending from two opposite lateral sides of the bottom neck in a parallel manner relative to the respective radiation fin for securing another radiation fin, a top retaining notch defined between the two pairs of vertically spaced retaining fingers above the bottom neck for accommodating the bottom neck of another radiation fin, and a retaining gap defined between each two vertically spaced retaining fingers for receiving another radiation fin.Type: ApplicationFiled: May 19, 2008Publication date: November 19, 2009Applicant: KWO GER METAL TECHNOLOGY. INC.Inventor: Chun-Hao Deng
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Publication number: 20080035311Abstract: A cooler system includes a metal holder base, a mounting structure that secures the metal holder base to a circuit board, a curved heat pipe, which has a mounting portion fastened to one through hole on the metal holder base and a cooling portion extending from the mounting portion to the outside of the metal holder base and the circuit board at an angle, and a heat sink fastened to the cooling portion of the heat pipe outside the metal holder base and the circuit board in a parallel relationship relative to the circuit board for dissipation heat absorbed by the heat pipe from a heat source at the circuit board into the outside open air far from the circuit board efficiently.Type: ApplicationFiled: August 11, 2006Publication date: February 14, 2008Applicant: KWO GER METAL TECHNOLOGY, INC.Inventor: Ting-Wei Hsu
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Patent number: 7104311Abstract: A heat sink assembly formed of a number of radiation fins arranged in a stack, each radiation fin having two mounting flanges arranged in parallel at two opposite sides, each mounting flange having a dovetail mounting hole on the middle and a dovetail bottom mounting lug, the dovetail bottom mounting lugs of one radiation fin being engaged into the mounting holes of another radiation fin.Type: GrantFiled: October 17, 2005Date of Patent: September 12, 2006Assignee: KWO GER Metal Technology, Inc.Inventor: Chia-Ru Teng