Patents Assigned to Kycera Corporation
  • Circuit board and structure using the same
    Patent number: 8350161
    Abstract: According to one of the invention, a circuit board comprises a conductive layer. The conductive layer includes a first land portion, a second land portion apart from the first land portion in a plan view, and a line portion connecting the first land portion and the second land portion to each other. The line portion includes lead portions through which a current is to flow and an opening portion arranged between the lead portions. The opening portion penetrates the conductive layer in a thickness direction.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: January 8, 2013
    Assignee: Kycera Corporation
    Inventors: Kimihiro Yamanaka, Manabu Ichinose, Satoshi Nakamura