Abstract: To secure a sufficient interfacial strength in a solder bonding portion even after a high-temperature process such as reflow bonding. The device includes a base including a first surface, an electrode located on the first surface of the base, and a bonding portion located on the electrode. The bonding portion includes a first layer, a second layer, and a third layer in order from the electrode side. The first layer includes Mo as a main component. The second layer includes ?-Sn as a main component. The third layer includes solder.
Abstract: A mobile wireless communication device (mobile device) receives a Minimization of Drive Test (MDT) configuration comprising criteria for performing event-based logging. The mobile device determines if the criteria have been met and, in response to a determination that the criteria have been met, performs an MDT in accordance with the MDT configuration. The MDT results are logged in the memory as an MDT log. The mobile device transmits, to a base station, a log availability indicator indicating the availability of the event-based MDT log.
Abstract: Provided is a measuring apparatus that may measure a vibration amount weighted by cartilage conduction characteristics of the human ear and thus allows for accurate evaluation of an electronic device having a vibrator. A measuring apparatus for evaluating an electronic device that delivers a sound through vibration transmission from a vibrator retained in a housing held against the human ear includes an ear simulator simulating the human ear and a vibration detector disposed on an artificial eardrum formed in the ear simulator.
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