Abstract: A crystal vibration element includes a plate shaped crystal blank including a pair of long sides and pair of short sides when viewed on a plane, and a pair of excitation electrodes superimposed on the two major surfaces of the crystal blank. When viewed on a plane, each of the pair of excitation electrodes includes a pair of short edges extending along a pair of short sides on inner sides of the pair of short sides, and a pair of long edges extending along a pair of long sides on inner sides of the pair of long sides. The pair of short edges are shaped as straight line parallel to the pair of short sides, while the pair of long edges are shaped outwardly bulging when viewed on a plane.

Abstract: A crystal blank includes a vibrating arm which extends in a direction intersecting the polarization direction. In at least one of the upper surface and lower surface which are parallel to the direction of extension of the vibrating arm and run along polarization direction, the vibrating arm is provided with two recesses (grooves) in the width direction of the surface thereby having a pair of outer walls which are positioned on the two sides of the two recesses and a middle wall which is positioned between the two recesses. In the middle wall, the apex part is located at a position lower than the apex part of each of the pair of outer walls and is thinner than each of the pair of outer walls at the same heights.

Abstract: The crystal element includes: a mesa-shaped crystal piece in a substantially rectangular shape in a plan view including an oscillation section having a first protruded section and a second protruded section; excitation electrodes provided on both main surfaces of the oscillation section; leading sections provided side by side along a prescribed side of the crystal piece; and a wiring section connecting between the excitation electrodes and the leading sections. The first protruded section and the second protruded section include sloping side faces. The side face of the first protruded section located on the +X-side overlaps with the side face of the second protruded section located on the +X side, and the side face of the first protruded section located on the ?X-side overlaps with the side face of the second protruded section located on the ?X side.

Abstract: A vibration element includes a crystal blank, a pair of excitation electrodes, and pair of extraction electrodes. The crystal blank is an AT cut crystal blank including a mesa part and an outer circumferential part which is thinner than the mesa part and surrounds the mesa part. The pair of excitation electrodes is provided on the two major surfaces of the mesa part. The pair of extraction electrodes include pad parts which are provided at the end parts of the crystal blank in the longitudinal direction on one major surface of the outer circumferential part and are connected to the pair of excitation electrodes. The length in the longitudinal direction of the crystal blank is less than 1000 ?m. When the resonance frequency is F (MHz) and t=1670/F, the distance “y” (?m) between each of the pad parts and the mesa part satisfies 0.048F+1.18<y/t<0.097F+0.36.

Abstract: An electronic device and a glass sealing method used therefor, with which a sufficient joint strength can be acquired only with the use of a glass sealing material without using an activated brazing material is provided. A crystal device includes an element loading member, lid member, a crystal vibration element, and a glass sealing material. The glass sealing material is provided in a ring-like form between the fringe of the lid member on a main surface side and the fringe of the element loading member on a main surface side, and keeps a space in vacuum.

Abstract: The crystal device has a rectangular substrate, a frame which is provided along the outer circumferential edge of the upper surface of the substrate, an electrode pad which is provided on the upper surface of the substrate, a wiring pattern which is electrically connected to the electrode pad and is provided on the upper surface of the substrate, a crystal element which is mounted on the electrode pad, and a lid for air-tight sealing the crystal element. The thickness of the electrode pad in the vertical direction differs from the thickness of the wiring pattern in the vertical direction.

Abstract: A crystal device has a crystal blank, a first excitation electrode part which is provided on an upper surface of the crystal blank, a first wiring part which extends from the first excitation electrode part to an edge part of the upper surface, a first lead-out terminal which is provided at the edge part of the upper surface of the crystal blank, a first mounting terminal which is provided at a position facing the first lead-out terminal, a first connection part which is provided so that one end is superimposed on the first lead-out terminal and the other end is superimposed on the first mounting terminal, a substrate having a mounting pad which is provided on its upper surface, a conductive adhesive which is provided between the mounting pad and the first mounting terminal, and a lid which is bonded to the upper surface of the substrate.

Abstract: A tuning fork type crystal blank includes a base part, a pair of vibrating parts which extend from the base part parallel with each other, an auxiliary part including a support part located on one side of an alignment direction of the pair of vibrating parts relative to the base part and pair of vibrating parts and extending parallel with the pair of vibrating parts, and a holding part which is located on the opposite side to the pair of vibrating parts relative to the base part and connects the base part and the support part. When viewed in a planar view direction perpendicular to the alignment direction and to the direction in which the pair of vibrating parts extend, cut away part is formed in a side surface of the auxiliary part.

Abstract: A method uses a first mask which is comprised of an X-shaped arm, a pattern portion which is a crossed part of the X-shape and is formed in a polygon shape or a circle shape, and a frame member which is connected to the pattern portion, and a second mask which is comprised of a cross-shaped arm, a pattern portion which is a crossed part of the cross shape and is formed in a polygon shape or a circle shape, and a frame member which is connected to the pattern portion; and includes a first transparent member wafer metal film-forming step of superimposing the first mask on one transparent member wafer between two transparent member wafers and forming a metal film between the pattern portions and the frame members, a second transparent member wafer metal film-forming step of superimposing the second mask on the other transparent member wafer.

Abstract: The crystal device has a rectangular substrate, a frame which is provided along the outer circumferential edge of the upper surface of the substrate, an electrode pad which is provided on the upper surface of the substrate, a wiring pattern which is electrically connected to the electrode pad and is provided on the upper surface of the substrate, a crystal element which is mounted on the electrode pad, and a lid for air-tight sealing the crystal element. The thickness of the electrode pad in the vertical direction differs from the thickness of the wiring pattern in the vertical direction.

Abstract: The temperature compensated crystal oscillator has a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along an outer circumferential edge of the upper surface and which is provided on a lower surface of the substrate by bonding of joining terminals which are provided along the outer circumferential edge of the lower surface of the substrate and the joining pads, a crystal element which is mounted on an electrode pad which is provided on the upper surface of the substrate in a region surrounded by the frame, an integrated circuit element which has a temperature sensor and which is mounted on a connection pad which is provided on the lower surface of the substrate in a region surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame.

Abstract: An etalon has a pair of transparent components; a ring-shaped piezoelectric member which is provided between the pair of transparent components, which is bonded to the pair of transparent components, and which is provided with metal films on the surfaces which face the transparent component sides; and the external connecting terminals which are provided on the transparent components and which are connected to the metal films.

Abstract: The temperature compensated crystal oscillator has a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along an outer circumferential edge of the upper surface and which is provided on a lower surface of the substrate by bonding of joining terminals which are provided along the outer circumferential edge of the lower surface of the substrate and the joining pads, a crystal element which is mounted on an electrode pad which is provided on the upper surface of the substrate in a region surrounded by the frame, an integrated circuit element which has a temperature sensor and which is mounted on a connection pad which is provided on the lower surface of the substrate in a region surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame.

Abstract: The temperature compensated crystal oscillator has a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along an outer circumferential edge of the upper surface and which is provided on a lower surface of the substrate by bonding of joining terminals which are provided along the outer circumferential edge of the lower surface of the substrate and the joining pads, a crystal element which is mounted on an electrode pad which is provided on the upper surface of the substrate in a region surrounded by the frame, an integrated circuit element which has a temperature sensor and which is mounted on a connection pad which is provided on the lower surface of the substrate in a region surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame.

Abstract: A crystal device has a crystal blank, a first excitation electrode part which is provided on an upper surface of the crystal blank, a first wiring part which extends from the first excitation electrode part to an edge part of the upper surface, a first lead-out terminal which is provided at the edge part of the upper surface of the crystal blank, a first mounting terminal which is provided at a position facing the first lead-out terminal, a first connection part which is provided so that one end is superimposed on the first lead-out terminal and the other end is superimposed on the first mounting terminal, a substrate having a mounting pad which is provided on its upper surface, a conductive adhesive which is provided between the mounting pad and the first mounting terminal, and a lid which is bonded to the upper surface of the substrate.

Abstract: The temperature compensated crystal oscillator has a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along an outer circumferential edge of the upper surface and which is provided on a lower surface of the substrate by bonding of joining terminals which are provided along the outer circumferential edge of the lower surface of the substrate and the joining pads, a crystal element which is mounted on an electrode pad which is provided on the upper surface of the substrate in a region surrounded by the frame, an integrated circuit element which has a temperature sensor and which is mounted on a connection pad which is provided on the lower surface of the substrate in a region surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame.

Abstract: A crystal unit is provided with a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along the outer circumferential edge of the upper surface and which is provided on the lower surface of the substrate by joining terminals provided along the outer circumferential edge of the lower surface of the substrate and its joining pads, a crystal element which is mounted on electrode pads which are provided on the upper surface of the substrate in a region surrounded by the frame, a thermosensitivel element which is mounted on connection pads which are provided on the lower surface of the substrate in a region surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame.

Abstract: A piezoelectric device 100 is provided with an element-mounting member 110, a piezoelectric element 120 mounted on the element-mounting member 110, a metal pattern 118 which is formed at the surface of the element-mounting member 110 and includes an element-mounting region 118a and a lead region 118b, and an integrated circuit element 130 which is electrically connected to the element-mounting region 118a of the metal pattern 118 by solder bump 132, wherein the metal pattern 118 has a projecting part 119 which is provided between the element-mounting region 118a and the lead region 118b, and at least the surface portion of the projecting part 119 is made of a metal oxide.

Abstract: The etalon has a first light transmission body which causes a positive change in a light path length with respect to a temperature increase change, a second light transmission body which causes a negative change in a light path length with respect to a temperature increase change, a first reflection film which covers a first outer surface, a first anti-reflection film which covers a first inner surface, a second anti-reflection film which cover a second inner surface, and a second reflection film which covers a second outer surface. The first inner surface and the second inner surface face each other across a gap there between.

Abstract: A method uses a first mask which is comprised of an X-shaped arm, a pattern portion which is a crossed part of the X-shape and is formed in a polygon shape or a circle shape, and a frame member which is connected to the pattern portion, and a second mask which is comprised of a cross-shaped arm, a pattern portion which is a crossed part of the cross shape and is formed in a polygon shape or a circle shape, and a frame member which is connected to the pattern portion; and includes a first transparent member wafer metal film-forming step of superimposing the first mask on one transparent member wafer between two transparent member wafers and forming a metal film between the pattern portions and the frame members, a second transparent member wafer metal film-forming step of superimposing the second mask on the other transparent member wafer.