Abstract: In the present invention, junction capacitance is increased by stabilizing the junction capacitance of rotating electrodes such that a short circuit does not occur between the electrodes.
Type:
Grant
Filed:
August 29, 2018
Date of Patent:
March 29, 2022
Assignees:
ExH Corporation, KYOEI ELECTRIC CO., Ltd.
Abstract: Provided is a bending rigid printed wiring board which facilitate the mounting of electric parts (realization of a high producibility and high assemblability substrate circuit) and enables spaces to be saved and which can be easily manufactured. That is, provided is a bending rigid printed wiring board, which is characterized in that a heat resistant resin layer is laminated on a front surface of a hard core material provided so as to contain a gap portion and also on a top surface of the gap portion, in that a heat resistant resin layer is laminated on a rear surface of the core material except the gap portion, in that a conductor layer is laminated and firmly fixed via the heat resistant resin layers and in that the conductor layer is etched, whereby a circuit is formed.
Type:
Grant
Filed:
July 28, 2006
Date of Patent:
January 10, 2012
Assignees:
Fujikura Ltd., Kyoei Electric Co., Ltd.