Abstract: The present invention relates to an electrically conductive adhesive composition including: a conductive powder (A) and a curable component (B) which has a content of 20 5 parts by mass or more when an amount of the conductive powder (A) is 100 parts by mass; and a phosphoric acid-containing curable component (C) having a general formula of formula (1) or (2), and having a molecular weight within a range of 150 to 1000, in which the phosphoric acid-containing curable component (C) has a content of 0.01 parts by mass or more and 5 parts by mass or less when a total amount of the conductive powder (A) and the 10 curable component (B) is 100 parts by mass.

Abstract: A conductive paste composition includes a conductive powder (A) and a resin component (B). A silver-based powder containing at least silver is used as the conductive powder (A), at least one of a thermosetting resin and a thermoplastic resin is used as the resin component (B). The conductive paste composition further contains a specific ester-based compound (C) having a molecular weight within a range of 150 to 2000 or a specific ether/amine-based compound (D) having a molecular weight within the range of from 150 to 30,000.

Abstract: A conductive paste composition includes a conductive powder (A) and a resin component (B). A silver-based powder containing at least silver is used as the conductive powder (A), at least one of a thermosetting resin and a thermoplastic resin is used as the resin component (B). The conductive paste composition further contains a specific ester-based compound (C) having a molecular weight within a range of 150 to 2000 or a specific ether/amine-based compound (D) having a molecular weight within the range of from 150 to 30,000.

Abstract: A thermosetting electroconductive paste composition includes an electroconductive powder (A) containing at least one of a silver-coated metal powder (A-1) and a powder of either copper or an alloy thereof (A-2), a thermosetting ingredient (B) containing at least one of an epoxy resin (B-1) and a blocked polyisocyanate compound (B-2), a hardener (C), and an alkyl- or alkenylsuccinic acid compound (D) which is a succinic acid or derivative thereof having an alkyl or alkenyl group having a carbon number of from 8 to 24 introduced into an ?-position. An amount of the alkyl- or alkenylsuccinic acid compound is 0.01 to 1.8 parts by mass per 100 parts by mass of a sum of the electroconductive powder (A) and the thermosetting ingredient (B).

Abstract: A thermosetting electroconductive paste composition includes an electroconductive powder (A) containing at least one of a silver-coated metal powder (A-1) and a powder of either copper or an alloy thereof (A-2), a thermosetting ingredient (B) containing at least one of an epoxy resin (B-1) and a blocked polyisocyanate compound (B-2), a hardener (C), and an alkyl- or alkenylsuccinic acid compound (D) which is a succinic acid or derivative thereof having an alkyl or alkenyl group having a carbon number of from 8 to 24 introduced into an ?-position. An amount of the alkyl- or alkenylsuccinic acid compound is 0.01 to 1.8 parts by mass per 100 parts by mass of a sum of the electroconductive powder (A) and the thermosetting ingredient (B).

Abstract: Disclosed herein is a conductive paste for forming a conductive film, including: (A) a conductive powder; (B) as a first additive, at least one selected from a first group consisting of Se, Te, a compound containing Se, and a compound containing Te; (C) as a second additive, a compound containing at least one element selected from a second group consisting of V, Nb, Ta, Sb, Bi, Mn, Ge, Si, and W; (D) glass frit; (E) an organic binder; and (F) a solvent.

Abstract: In order to provide an electro-conductive paste bringing no increase of the contact resistance for forming an electrode of a solar cell device, the electro-conductive paste is characterized by containing an electro-conductive particle, an organic binder, a solvent, a glass frit, and an organic compound including alkaline earth metal, a metal with a low melting point or a compound affiliated with a metal with a low melting point.

Abstract: Disclosed herein is a conductive paste for forming a conductive film, including: (A) a conductive powder; (B) as a first additive, at least one selected from a first group consisting of Se, Te, a compound containing Se, and a compound containing Te; (C) as a second additive, a compound containing at least one element selected from a second group consisting of V, Nb, Ta, Sb, Bi, Mn, Ge, Si, and W; (D) glass frit; (E) an organic binder; and (F) a solvent.

Abstract: In order to provide an electro-conductive paste bringing no increase of the contact resistance for forming an electrode of a solar cell device, the electro-conductive paste is characterized by containing an electro-conductive particle, an organic binder, a solvent, a glass frit, and an organic compound including alkaline earth metal, a metal with a low melting point or a compound affiliated with a metal with a low melting point.

Abstract: A wiring board includes a plurality of wirings laid via an insulating resin layer, and a via-hole conductor provided for electrically connecting the wirings. The via-hole conductor includes metal and resin portions. The metal portion includes a region made of copper particles, a first metal region mainly composed of tin, a tin-copper alloy, or a tin-copper intermetallic compound, and a second metal region mainly composed of bismuth, and has Cu/Sn of from 1.59 to 21.43. The copper particles are in contact with one another, thereby electrically connecting the wirings, and at least part of the first metal region covers around and extends over the portions where the copper particles are in plane contact with one another.

Abstract: Disclosed is a multilayer wiring board having via-hole conductors, the via-hole conductor including a metal portion and a resin portion. The metal portion includes a first metal region which includes a link of copper particles forming a path electrically connecting a first wiring and a second wiring; a second metal region mainly composed of a metal selected from the group consisting of tin, a tin-copper alloy, and a tin-copper intermetallic compound; a third metal region mainly composed of bismuth; and a fourth metal region composed of tin-bismuth solder particles. The link has plane-to-plane contact portions where the copper particles are in plane-to-plane contact with one another. At least a part of the second metal region is in contact with the first metal region. The tin-bismuth solder particles, each surrounded by the resin portion, are interspersed in the via-hole conductor.

Abstract: In order to provide an electro-conductive paste bringing no increase of the contact resistance for forming an electrode of a solar cell device, the electro-conductive paste is characterized by containing an electro-conductive particle, an organic binder, a solvent, a glass frit, and an organic compound including alkaline earth metal, a metal with a low melting point or a compound affiliated with a metal with a low melting point.

Abstract: A conductive paste composition, which is superior in electrical connection reliability and has properties required for a via-filling conductive paste composition is disclosed. The via-filling conductive paste composition contains a solvent in an amount of not more than 5 parts by weight per 100 parts by weight of the total amount of components A to D:A: 86 to 95 parts by weight of silver-coated copper particles made by coating surfaces of copper particles having an average particle diameter of 1 to 10 .mu.m with silver, a proportion of silver to the total amount of copper particles and coated silver being from 0.5 to 20% by weight,B: 2 to 8 parts by weight of a liquid epoxy resin having two or more epoxy groups,C: 2 to 8 parts by weight of a resol-type phenol resin, andD: 0.5 to 5 parts by weight of a curing agent for an epoxy resin, wherein the composition has a viscosity not more than 1000 Pa.multidot.s.