Patents Assigned to KYOTO SEMICONDUCTOR CO., LTD.
  • Publication number: 20240136451
    Abstract: A light receiving device comprises a condensing lens, a lens holder for mounting the condensing lens, a semiconductor light receiving element, and a lens holder, and the light transmitted through the condensing lens enters the semiconductor light receiving element via the optical path section in the lens holder. The condensing lens is a compound eye lens with a plurality of convex lens surfaces on one side, and the lens holder connects the condensing lens to the semiconductor light receiving element, and has a cylindrical reflective surface facing the optical path section formed in such a way that the diameter and a diameter decreasing rate become smaller as it approaches the semiconductor light receiving element.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Applicant: KYOTO SEMICONDUCTOR CO., LTD.
    Inventors: Takatomo ISOMURA, Etsuji OMURA
  • Publication number: 20240128385
    Abstract: In the light receiving device 1 comprising a condensing lens, a lens holder for fixing the condensing lens, a semiconductor light receiving element, and a base for fixing the semiconductor light receiving element and the lens holder, wherein the light passing through the condensing lens enters the semiconductor light receiving element through the optical path in the lens holder. The condensing lens is a compound eye lens with a plurality of convex lens surfaces on one side, and the lens holder has a cylindrical reflective surface facing the optical path section formed in the shape of a truncated cone, the diameter of which decreases as it approaches the condensing lens. A part of light passing through the condensing lens is reflected by the reflective surface to enter the semiconductor light receiving element.
    Type: Application
    Filed: December 26, 2023
    Publication date: April 18, 2024
    Applicant: KYOTO SEMICONDUCTOR CO., LTD.
    Inventors: Takatomo ISOMURA, Etsuji OMURA
  • Publication number: 20240021748
    Abstract: An optical power supply converter that photoelectrically converts light incident through optical fiber cables is provided with; a reflecting section having a concave reflecting mirror formed with a partially concave surface of an ellipsoid of revolution rotated about a major axis passing through first and second focuses of the ellipse; a light receiving element for photoelectric conversion disposed at the first focus; and an incident portion disposed near the second focus for attaching emitting ends of optical fiber cables that emit light toward the concave reflecting mirror through the second focus.
    Type: Application
    Filed: July 30, 2023
    Publication date: January 18, 2024
    Applicant: KYOTO SEMICONDUCTOR CO., LTD
    Inventors: Takatomo ISOMURA, Etsuji OMURA
  • Patent number: 11843262
    Abstract: An optical power supply converter (1) that photoelectrically converts light from optical fiber cables comprises a reflecting unit (3) including a concave reflecting mirror (6) made of a rotating paraboloid, a light receiving element (2) including a light receiving surface (2a) at the focus of the mirror (6) orthogonal to the rotation axis of the mirror (6), and a plurality of mounting portions (9) for mounting the emitting ends (OE) of the fiber cables. The seperation distance (s), the shift distance (h) and the divergence angle (?) are set appropriately so as to concentrate all reflected light on the light receiving surface (2a).
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: December 12, 2023
    Assignee: Kyoto Semiconductor Co., Ltd.
    Inventors: Takatomo Isomura, Etsuji Omura
  • Publication number: 20230352604
    Abstract: A semiconductor light receiving device (1A, 1B) having a semiconductor substrate (2) transparent to incident light in an infrared region for optical communications, a light receiving portion (6) with a light absorption layer (4) on a first surface (2a) side of the semiconductor substrate (2) to absorb the incident light, and an anti-reflection portion (11, 21) in an irradiation region (10) where incident light transmitted through the light absorption layer (4) reaches on a second surface (2b) side of the semiconductor substrate (2), the anti-reflection portion (11, 21) is formed on the second surface (2b) of the semiconductor substrate (2) by layering a first metal film (12) having a real part and imaginary part of a complex refractive index of 3 or more and 5 or less, respectively, a dielectric film (13) having a refractive index of 2 or less, and a second metal film (14).
    Type: Application
    Filed: July 6, 2023
    Publication date: November 2, 2023
    Applicant: KYOTO SEMICONDUCTOR CO., LTD.
    Inventors: Takatomo ISOMURA, Etsuji Omura
  • Publication number: 20230049438
    Abstract: The end-face incident type semiconductor light receiving device has a first light absorbing region on the main surface side of the semiconductor substrate and causes light incident from the end-face of the semiconductor substrate to enter the first light absorbing region by reflection or refraction, and the first reflective section is provided on the main surface side of the semiconductor substrate to cause light transmitted through the light absorbing region to enter the first light absorbing region, and a single second reflective section is provided on the back surface for causing the light reflected by the first reflective section and transmitted through the first light absorbing region to reflect directly toward the first light absorbing region.
    Type: Application
    Filed: November 3, 2022
    Publication date: February 16, 2023
    Applicant: KYOTO SEMICONDUCTOR CO., LTD.
    Inventors: Takatomo ISOMURA, Etsuji OMURA
  • Patent number: 11356054
    Abstract: In the optical power supply converters (1A to 1C) having a semiconductor light receiving element (2) including a light receiving section (15) on a main surface (10a) side of a semiconductor substrate (10), the semiconductor substrate (10) has at least one inclined end surface (10c) that intersects the main surface (10a) at an acute angle, and the light incident on the inclined end surface (10c) is refracted so as to be incident on the receiving section (15).
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: June 7, 2022
    Assignee: KYOTO SEMICONDUCTOR CO., LTD.
    Inventors: Ken Usui, Etsuji Omura
  • Patent number: 11276791
    Abstract: In an edge incident type semiconductor light receiving device that reflects light incident parallel to the main surface of the semiconductor substrate opaque to the incident light to the light receiving section on the main surface side, a light guide section is formed to expose the light receiving section along the light incident direction from the light incident side end of the semiconductor substrate, and in order to guide the light incident on the light guide section to the light receiving section, a light reflection section having a given crossing angle with the main surface is provided at the end of the light guide section in the light incident direction.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: March 15, 2022
    Assignee: KYOTO SEMICONDUCTOR CO., LTD.
    Inventors: Takatomo Isomura, Etsuji Omura
  • Patent number: 11276790
    Abstract: A semiconductor light receiving element of back-illuminated type comprises a light absorbing portion formed in the vicinity of the main surface of the semiconductor substrate transparent to the incident light, and a first convex lens portion larger than the light absorbing portion and having a radius of curvature R1 formed on a back surface of the semiconductor substrate, a second convex lens portion smaller than the light absorbing portion and having a radius of curvature R2 smaller than the radius of curvature R1; the second convex lens portion formed on the first convex lens portion and having a focal point between the second convex lens portion and the light absorbing portion; light incident on the second convex lens portion is diffused from the focal point toward the light absorbing portion.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: March 15, 2022
    Assignee: KYOTO SEMICONDUCTOR CO., LTD.
    Inventors: Takatomo Isomura, Etsuji Omura
  • Patent number: 11145770
    Abstract: A semiconductor light receiving element comprises a light absorption region formed in the vicinity of the main surface of the semiconductor substrate transparent to the incident light; an incident region set to be concentric with and larger than the light absorption region; and a partially spherical concave reflecting portion formed on a back surface of the semiconductor substrate and capable of reflecting incident light incident on the incident region from the main surface side toward the light absorbing region; wherein, when the radius of curvature of the portion is R, the diameter of the incident region is B, the distance between the light absorbing region and the concave reflecting portion is W, and the diameter of the light absorbing region is P, then the radius of curvature R satisfies a condition of 2 BW/(B?P/2)?R?2BW/(B?P).
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: October 12, 2021
    Assignee: Kyoto Semiconductor Co., Ltd.
    Inventors: Ken Usui, Takatomo Isomura, Etsuji Omura
  • Patent number: 11143827
    Abstract: An edge incident type light receiving element unit capable of receiving optical signals in different wavelength ranges incident from the edge side comprises a first light receiving element for receiving optical signals in a first wavelength range and a second light receiving element for receiving optical signals in a second wavelength range, and configured so that optical signals transmitted through a first light receiving portion formed vertically on a wall portion of a first semiconductor substrate incident via a reflecting portion on a second light receiving portion formed on a second semiconductor substrate fitted on the first semiconductor substrate.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: October 12, 2021
    Assignee: Kyoto Semiconductor Co., Ltd.
    Inventors: Yu Itazaki, Etsuji Omura
  • Patent number: 11145773
    Abstract: The light receiving element unit includes a first light receiving element having a light receiving region on the main surface side of the first semiconductor substrate and a second light receiving element having a light receiving region on the main surface side of the second semiconductor substrate, and a support substrate having wiring for electrically connecting the first light receiving element and the second light receiving element to the outside, one of the first light receiving element and the second light receiving element has a recess formed in a concave shape from the back surface opposite to the light receiving region toward the light receiving region, and the other is accommodated in the recess.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: October 12, 2021
    Assignee: Kyoto Semiconductor Co., Ltd.
    Inventors: Yu Itazaki, Etsuji Omura
  • Publication number: 20210083131
    Abstract: An end surface incident-type light receiving element according to an aspect of the present disclosure is made of a semiconductor material, and includes an upper surface and a lower surface that are opposite to each other in the vertical direction, and an end surface that couples the upper surface and the lower surface and is to be arranged on a light source side, the light source side being a side from which the light source emits light. At least a portion of the end surface is inclined relative to the vertical direction such that the lower surface side is arranged closer to the light source than the upper surface side is. The lower surface is provided with one or more grooves. The inclined surfaces on the end surface side of one or more grooves are arranged so as to reflect incident light that is emitted from the light source and passes through the end surface.
    Type: Application
    Filed: August 31, 2017
    Publication date: March 18, 2021
    Applicant: KYOTO SEMICONDUCTOR CO., LTD.
    Inventors: Etsuji OMURA, Takatomo ISOMURA, Ken USUI