Patents Assigned to Kyowa Engineering Yugen Kaisha
  • Patent number: 5692869
    Abstract: An apparatus for transferring in a lump a plurality of semiconductor silicon wafers (3) from a first cassette (4), which contains the wafers inserted therein, to a second cassette (5), which comprises: a push-rod (10), a wafer loading device (11 or 19), a holding mechanism (12) and a cassette replacing mechanism (14). The push-rod (10) pushes out in a lump the wafers (3) upward from the first cassette (4), and inserts in a lump the wafers (3) thus pushed out upward into the second cassette (5). The wafer loading device (11 or 19) is releasably fitted to the uppermost end (10a) of the push-rod (10), and has a plurality of parallel grooves (11a or 20c) for receiving the wafers (3). The holding mechanism (12) grips the wafer loading device (11 or 19) without coming into contact with the wafers (3) so as to hold the wafers (3) at a prescribed position through the wafer loading device (11 or 19).
    Type: Grant
    Filed: May 20, 1996
    Date of Patent: December 2, 1997
    Assignees: Nakajima M.F.G. Inc., Kyowa Engineering Yugen Kaisha
    Inventor: Chiaki Kumagai