Abstract: A retaining and heat dissipating structure for electronic equipments installed aboard space, air or land vehicles comprises a ceramic powder (7), possibly mixed with a lightening material (8), placed with a certain degree of compression inside a container housing the printed circuit boards (1) carrying the equipment components (2).
Type:
Grant
Filed:
May 7, 2003
Date of Patent:
August 29, 2006
Assignees:
Negesat di Boer Fabrizio & C. S.N.C., Laben S.P.A.