Abstract: In one example, an electroplating system comprises a bath reservoir, a holding device, an anode, a direct current power supply, and a controller. The bath reservoir contains an electrolyte solution. The holding device holds a wafer submerged in the electrolyte solution. The wafer comprises features covered by a cobalt layer. The anode is opposite to the wafer and submerged in the electrolyte solution. The direct current power supply generates a direct current between the holding device and the anode. A combination of forward and reverse pulses is applied between the holding device and the anode to electroplate a copper layer on the cobalt layer of the wafer.
Type:
Grant
Filed:
February 6, 2020
Date of Patent:
November 9, 2021
Assignee:
Lam Research Comporation
Inventors:
Jeyavel Velmurugan, Bryan L. Buckalew, Thomas A. Ponnuswamy