Abstract: An apparatus for improving performance of a wafer polishing apparatus is described. The apparatus includes a platen in a support assembly having a plurality of fluid channels and at least one region of altered topography positioned on a portion of the platen surface.
Type:
Application
Filed:
August 8, 2001
Publication date:
February 13, 2003
Applicant:
Lam Research Corportion
Inventors:
Travis R. Taylor, Cangshan Xu, Kevin T. Crofton, Eugene Yuexing Zhao