Patents Assigned to Lam Research Corportion
  • Patent number: 11211253
    Abstract: Methods and apparatuses for critical dimension (CD) control of substrate features using integrated atomic layer deposition (ALD) and etch processes are described herein. Methods include etching to form a mask pattern of features on a substrate having a width that is less than a desired width of structures to be subsequently formed by the mask pattern of features, conformally depositing a passivation layer by ALD that increases the width of the mask pattern of features to the desired width, and etching a layer of the substrate to a desired depth to form the plurality of structures having the desired width.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: December 28, 2021
    Assignee: Lam Research Corportation
    Inventors: Xiang Zhou, Yoshie Kimura, Duming Zhang, Chen Xu, Ganesh Upadhyaya, Mitchell Brooks
  • Publication number: 20030032379
    Abstract: An apparatus for improving performance of a wafer polishing apparatus is described. The apparatus includes a platen in a support assembly having a plurality of fluid channels and at least one region of altered topography positioned on a portion of the platen surface.
    Type: Application
    Filed: August 8, 2001
    Publication date: February 13, 2003
    Applicant: Lam Research Corportion
    Inventors: Travis R. Taylor, Cangshan Xu, Kevin T. Crofton, Eugene Yuexing Zhao