Patents Assigned to Lamina Ceramics, Inc.
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Publication number: 20070268694Abstract: The present invention provides a multicolor LED assembly packaged with improved and controlled color mixing to create a more uniform color mixture. The assembly includes at least one lens overlying an encapsulant which encapsulates a plurality of LED dies. The lens includes a top surface and a bottom surface with the contour of the bottom surface designed to redirect light from each of the LED dies in different directions towards the top surface of the lens. The contoured shaped of the bottom surface of the lens redirects light from each of the plurality of LED dies such that illuminance and luminous intensity distributions of the plurality of LED dies substantially overlap, wherein the deviation from complete overlap is less than a predetermined amount which is substantially imperceptible to the average human eye.Type: ApplicationFiled: April 18, 2007Publication date: November 22, 2007Applicant: LAMINA CERAMICS, INC.Inventors: Edward Bailey, Shane Harrah
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Patent number: 7252408Abstract: A packaged LED array for high temperature operation comprises a metal base, the metal base including an underlying thermal connection pad. One or more layers of ceramic overly the metal base. The array includes a plurality of LED dice, each LED die having electrodes. And, the LED thermally coupled to the metal base. A driver circuit is electrically connected to the LED die electrodes and controls the LED array current. An LED driver is mounted within the LED array package, and thermally coupled to the metal base. In a second embodiment, one or more of the LED dice can be switched from the driver to a measurement circuit and used as a photodetector to measure the light output of the LED array. The measured photodetector signal can further be used as a feedback signal to control the LED array light output.Type: GrantFiled: July 19, 2004Date of Patent: August 7, 2007Assignee: Lamina Ceramics, Inc.Inventors: Joseph Mazzochette, Greg E. Blonder
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Patent number: 7183640Abstract: A multilayer ceramic circuit board comprises a core of high conductivity material such as metal and an overlying layer of electrically insulating ceramic having an outer surface. In accordance with the invention, a circuit board for receiving a high power component is provided with a thermal spreading layer on or near the outer surface and one or more thermal vias through the ceramic to thermally couple the spreading layer to the core. The vias and the spreading layer comprise electrically insulating thermally conductive materials. The resulting structure provides rapid heat dissipation for a high power component formed or mounted on or near the spreading layer.Type: GrantFiled: November 6, 2003Date of Patent: February 27, 2007Assignee: Lamina Ceramics, Inc.Inventors: Joseph Mazzochette, Ellen Schwartz Tormey, Barry Jay Thaler
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Patent number: 7176502Abstract: In accordance with the invention, an LED packaged for high temperature operation comprises a metal base including an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer, and a LED die mounted overlying the metal base. The LED is thermally coupled through the metal base to the thermal connection pad, and the electrodes are electrically connected to the underlying electrical connection pads. A low thermal resistance insulating layer can electrically insulate other areas of die from the base while permitting heat passage. Heat flow can be enhanced by thermal vias to the thermal connector pad. Ceramic layers formed overlying the base can add circuitry and assist in distributing emitted light. The novel package can operate at temperatures as high as 250° C.Type: GrantFiled: March 18, 2005Date of Patent: February 13, 2007Assignee: Lamina Ceramics, Inc.Inventors: Joseph Mazzochette, Greg Blonder
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Patent number: 7098483Abstract: In accordance with the invention, an LED packaged for high temperature operation comprises a metal base including an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer, and a LED die mounted overlying the metal base. The LED is thermally coupled through the metal base to the thermal connection pad, and the electrodes are electrically connected to the underlying electrical connection pads. A low thermal resistance insulating layer can electrically insulate other areas of die from the base while permitting heat passage. Heat flow can be enhanced by thermal vias to the thermal connector pad. Ceramic layers formed overlying the base can add circuitry and assist in distributing emitted light. The novel package can operate at temperatures as high as 250° C.Type: GrantFiled: September 2, 2004Date of Patent: August 29, 2006Assignee: Lamina Ceramics, Inc.Inventors: Joseph Mazzochette, Greg Blonder
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Patent number: 7095053Abstract: In accordance with the invention, an LED packaged for high temperature operation comprises a metal base including an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer, and a LED die mounted overlying the metal base. The LED is thermally coupled through the metal base to the thermal connection pad, and the electrodes are electrically connected to the underlying electrical connection pads. A low thermal resistance insulating layer can electrically insulate other areas of die from the base while permitting heat passage. Heat flow can be enhanced by thermal vias to the thermal connector pad. Ceramic layers formed overlying the base can add circuitry and assist in distributing emitted light. The novel package can operate at temperatures as high as 250° C.Type: GrantFiled: August 11, 2003Date of Patent: August 22, 2006Assignee: Lamina Ceramics, Inc.Inventors: Joseph Mazzochette, Greg Blonder
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Patent number: 7026891Abstract: In accordance with the invention, a delay line comprises a spirally coiled strip transmission line encapsulated within conductive ground discs. In an advantageous embodiment the delay line is a monolithic ceramic structure produced by forming the stripline on green ceramic tape, spirally rolling the green stripline, encasing the rolled stripline in green ceramic encapsulating discs and cofiring the green assembly into a monolithic compact disc.Type: GrantFiled: January 8, 2002Date of Patent: April 11, 2006Assignee: Lamina Ceramics, Inc.Inventor: Joseph Mazzochette
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Patent number: 7011725Abstract: Embedded, coupled, shaped waveguide resonators having conductive walls sandwiched between two fired green tape stacks, said conductive walls having apertures therein whose size and location determine the degree of coupling. These waveguides are made by forming openings in a first green tape stack, defining walls and apertures therein, mounting a second green tape stack having a conductive layer thereon thereover and firing the assembly. E-plane probes are inserted in openings in the second green tape stack and connected to microstrip transmission lines on an external surface pf this green tape stack.Type: GrantFiled: May 24, 2005Date of Patent: March 14, 2006Assignee: Lamina Ceramics, Inc.Inventors: Bernard Dov Geller, Aly Eid Fathy, Michael James Liberatore, Attiganal Narayanswamy Sreeram, Barry Jay Thaler
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Publication number: 20060006405Abstract: Light emitting diode (LED) assemblies packaged for high temperature operation and surface mounting. In particular, the LED assemblies according to the present invention are constructed to include a thermally conducting base and an optically efficient cavity that provides protection for the LED assembly and maximizes light extraction. The LED assemblies are particularly adapted for easy and efficient surface mounting or bolt down assembly mounting in high temperature environments.Type: ApplicationFiled: July 12, 2005Publication date: January 12, 2006Applicant: Lamina Ceramics, Inc.Inventor: Joseph Mazzochette
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Publication number: 20050217786Abstract: Embedded, coupled, shaped waveguide resonators having conductive walls sandwiched between two fired green tape stacks, said conductive walls having apertures therein whose size and location determine the degree of coupling. These waveguides are made by forming openings in a first green tape stack, defining walls and apertures therein, mounting a second green tape stack having a conductive layer thereon thereover and firing the assembly. E-plane probes are inserted in openings in the second green tape stack and connected to microstrip transmission lines on an external surface pf this green tape stack.Type: ApplicationFiled: May 24, 2005Publication date: October 6, 2005Applicant: Lamina Ceramics, Inc.Inventors: Bernard Geller, Aly Fathy, Michael Liberatdore, Attiganal Sreeram, Barry Thaler
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Patent number: 6914501Abstract: Embedded, coupled, shaped waveguide resonators having conductive walls sandwiched between two fired green tape stacks, said conductive walls having apertures therein whose size and location determine the degree of coupling. These waveguides are made by forming openings in a first green tape stack, defining walls and apertures therein, mounting a second green tape stack having a conductive layer thereon thereover and firing the assembly. E-plane probes are inserted in openings in the second green tape stack and connected to microstrip transmission lines on an external surface pf this green tape stack.Type: GrantFiled: October 29, 1999Date of Patent: July 5, 2005Assignee: Lamina Ceramics, Inc.Inventors: Bernard Dov Geller, Michael James Liberatore, Attiganal Narayanswamy Sreeram, Barry Jay Thaler, Aly Eid Fathy
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Patent number: 6759940Abstract: In accordance with the invention, a temperature compensating device comprises one or more integrated sheet thermistors. Because the sheet thermistors are relatively thick and integral with the substrate, they are less susceptible to changes in air temperature and to temperature gradients. Moreover, the sheet thermistors can be made smaller in area, permitting more compact, less expensive devices that exhibit improved high frequency performance. The devices can advantageously be fabricated using the low temperature co-fired ceramic (LTCC) process.Type: GrantFiled: January 10, 2002Date of Patent: July 6, 2004Assignee: Lamina Ceramics, Inc.Inventor: Joseph Mazzochette
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Publication number: 20040124002Abstract: A multilayer ceramic circuit board comprises a core of high conductivity material such as metal and an overlying layer of electrically insulating ceramic having an outer surface. In accordance with the invention, a circuit board for receiving a high power component is provided with a thermal spreading layer on or near the outer surface and one or more thermal vias through the ceramic to thermally couple the spreading layer to the core. The vias and the spreading layer comprise electrically insulating thermally conductive materials. The resulting structure provides rapid heat dissipation for a high power component formed or mounted on or near the spreading layer.Type: ApplicationFiled: November 6, 2003Publication date: July 1, 2004Applicant: LAMINA CERAMICS, INC.Inventors: Joseph Mazzochette, Ellen Schwartz Tormey, Barry Jay Thaler
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Patent number: 6739047Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.Type: GrantFiled: October 30, 2002Date of Patent: May 25, 2004Assignee: Lamina Ceramics, Inc.Inventors: Mark Stuart Hammond, Ellen Schwartz Tormey, Barry Jay Thaler, Leszek Hozer, Hung-tse Daniel Chen, Bernard Dov Geller, Gerard Frederickson
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Patent number: 6720859Abstract: A temperature compensating device comprises one or more columnar thermistors embedded within a substrate. Because the thermistors are substantially covered by the substrate, they are less susceptible to changes in air temperature and to temperature gradients. Moreover, within the substrate the thermistors can be made thicker and smaller in lateral area, permitting more compact, less expensive devices that exhibit improved high frequency performance. The devices can advantageously be fabricated using the low temperature co-fired ceramic (LTCC) process.Type: GrantFiled: January 10, 2002Date of Patent: April 13, 2004Assignee: Lamina Ceramics, Inc.Inventor: Joseph Mazzochette
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Patent number: 6709749Abstract: A method of controlling shrinkage in aligned green tape stacks during firing comprises providing a topmost layer of a ceramic material having a sintering temperature higher than that of the ceramic used to make the green tapes and firing above the sintering temperature of the green tape ceramic but below the sintering temperature of the topmost layer ceramic. The method of the invention provides improved shrinkage control for green tape stacks on a support substrate.Type: GrantFiled: September 3, 1998Date of Patent: March 23, 2004Assignee: Lamina Ceramics, Inc.Inventors: Ananda Hosakere Kumar, Barry Jay Thaler, Ashok Narayan Prabhu
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Publication number: 20030062185Abstract: A package for an electronic component includes a metal support substrate having a pattern of openings therethrough and a body of an insulating material, such as glass or ceramic, on and bonded to the surface of the support substrate. The body is formed from a plurality of layers of an insulating material, and conductive vias extending through the plurality of layers to the support substrate; said insulating body having an opening therein, an electronic component directly mounted in said opening to the patterned base plate. The base plate can be cut into one or more modules and directly soldered to a motherboard having additional devices mounted thereon.Type: ApplicationFiled: October 30, 2002Publication date: April 3, 2003Applicant: Lamina Ceramics, Inc.Inventors: Mark Stuart Hammond, Ellen Schwartz Tormey, Barry Jay Thaler, Leszek Hozer, Hung-tse Daniel Chen, Bernard Dov Geller, Gerard Frederickson
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Patent number: 6455930Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.Type: GrantFiled: September 18, 2000Date of Patent: September 24, 2002Assignee: Lamina Ceramics, Inc.Inventors: Ponnuswamy Palanisamy, Attiganal Narayanaswamy Sreeram, Ellen Schwartz Tormey, Barry Jay Thaler, John Connolly, Ramon Ubaldo Martinelli, Ashok Narayan Prabhu, Mark Stuart Hammond