Abstract: A polishing pad is provided having a diameter substantially equal to the diameter of a conventional electric floor polishing machine. A center aperture is provided in the pad whereby the pad may be secured to the floor polisher in a well-known manner. A plurality of apertures are provided in the pad eccentrically of the central aperture whereby the surface area of the pad is reduced thereby reducing drag on the machine which results in reduction of the current drawn with the consequent reduction in overheating and the blowing of fuses.