Abstract: A thermoformed structural foamed plastic container for electrical circuit boards and the like is provided with a conductive outer surface to dissipate electrostatic charges which can adversely affect the circuit elements disposed within the container. The container is preferably formed of integrally joined clamshell sections which are connected by an integral hinge and are provided with suitable support bosses and the like for securing an electrical circuit element within the package interior. The entire exterior or interior surface of the container is provided with a spray or brush deposited or vacuum applied conductive coating comprising carbon or other metallic substances. The container may be formed in two separate sections joined together with interlocking tabs and slots which provide electrically conductive engagement between the container sections.

Abstract: A shipping pad is provided which has three dimensional shock resistant characteristics. The component parts of the shipping pad may be fabricated from a single sheet of plastic foam material, thus facilitating storage of the unit prior to assembly. After the component parts are removed from the sheet of foam material, they may be assembled into a shipping pad configuration with interlocking cross bars. No adhesive or other fastening means foreign to the foam material need be used.