Patents Assigned to Lanner Electronics Inc.
  • Patent number: 12526245
    Abstract: A bypass switch device with indicating function is disclosed. The bypass switch device is for use in a network appliance having at least one Ethernet network module, and comprises N switch units and a microcontroller. The microcontroller is configured to change the switching state of at least two said switch units in case the Ethernet network module fails to work normally, such that at least two RJ45 connectors directly communicate with each other through at least two said switch units. In such case, the microcontroller simultaneously controls one of two LED components included by one said RJ45 connector and one of two LED components included by another one said RJ45 connector, such that the two LED components emit lights for indicating that the Ethernet network module is working in a bypass mode.
    Type: Grant
    Filed: May 25, 2022
    Date of Patent: January 13, 2026
    Assignee: Lanner Electronics Inc.
    Inventors: Chung-Jen Su, Yu-Min Meng, You-Cheng Liao, Lan-Feng Chen, Ming-Ting Ken
  • Publication number: 20260013071
    Abstract: An electronic device with function of internal temperature adjusting is disclosed. The electronic device comprises a housing case, at least one intake fan and a heater, in which the housing case has a mounting hole, at least one first vent hole and at least one second vent hole, the intake fan is embedded in the mounting hole, and the heater is disposed in the housing case for facing to the intake fan. By such arrangements, external cold air would be fed into an internal space of the housing case while the heater and the fan work normally, such that the cold air is then heated by the heater so as to become a warm air. As a result, an internal temperature of the housing case is evenly increased by the warm air, thereby making the electronic device be able to be booted normally.
    Type: Application
    Filed: November 13, 2024
    Publication date: January 8, 2026
    Applicant: LANNER ELECTRONICS INC.
    Inventor: YAO-SHENG HUANG
  • Patent number: 12454964
    Abstract: A case fan system of easy assembly and disassembly is disclosed, wherein comprises a mounting plate and a plurality of fan modules, wherein the mounting plate is disposed in a housing case of an electronic device, and each said fan module consists of a case fan, an enclosing member and at least one fixing member. Specifically, the enclosing member surrounds the case fan, and is attached onto the mounting plate via the at least one fixing member. By such designs, it is able to disassemble the fan module from the mounting plate easily, thereby making the internal of the housing case to free up extra spaces. On the contrary, it is also able to attach, in case of one or more extra electronic chips/modules being added into the housing case, one or more said fan module onto the mounting plate, thereby enhancing the efficiency of hot air discharging.
    Type: Grant
    Filed: May 20, 2025
    Date of Patent: October 28, 2025
    Assignee: LANNER ELECTRONICS INC.
    Inventor: Shih-Tai Hung
  • Publication number: 20250251761
    Abstract: A modularized and expandable computer system is disclosed, which comprises a host electronic device, a first expansion electronic device, a second expansion electronic device, and a third expansion electronic device, wherein the first expansion electronic device has a plurality of storage modules, the second expansion electronic device has a plurality of expansion card modules, and the third expansion electronic device has a plurality of power supply units (PSUs). Moreover, the host electronic device is in communication with the first expansion electronic device and the second expansion electronic device, and the third expansion electronic device generates electric power that is further transmitted to the second expansion electronic device, and then the second expansion electronic device further transmits the electric power to the host electronic device, thereby making the first expansion electronic device receive the electric power thorough the host electronic device.
    Type: Application
    Filed: April 22, 2024
    Publication date: August 7, 2025
    Applicant: LANNER ELECTRONICS INC.
    Inventor: Rui-Xuan Lee
  • Patent number: 12089365
    Abstract: A smart cooling fan system is disclosed, and comprises temperature sensors, a first cooling fan connected to a main processor of an electronic device, a second cooling fan disposed in a housing case of the electronic device, and a microcontroller. The microcontroller is configured to, based on immediate fan rotation speed, find out a first volumetric flow rate and a second volumetric flow rate by looking up a cubic feet per minute (CFM)-RPM lookup table (LUT), a first pulse width modulation (PWM) LUT and a second PWM LUT, the microcontroller controls the first cooling fan to produce a first airflow having the first volumetric flow rate, and also controls the second cooling fan to produce a second airflow having the second volumetric flow rate.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: September 10, 2024
    Assignee: LANNER ELECTRONICS INC.
    Inventors: Yueh-Se Huang, Kuo-Liang Shen
  • Patent number: 11953956
    Abstract: A replaceable frame assembly is disclosed, which comprises: a base plate, a first fixing unit, a second fixing unit, a front panel, at least one first electrical connection interface, a second electrical connection interface, a third electrical connection interface, and a fixation plate. The replaceable frame assembly is adopted for accommodating an expansion card module, and can be disposed in a case of an electronic device. After being disposed in the case, an electrical connection end of the first electrical connection interface is embedded into an electrical slot that is disposed on a main board, such that the expansion card module communicates with the main board through the second electrical connection interface, the third electrical connection interface, the first electrical connection interface, and the electrical slot, thereby making the expansion card module become a functional electronic module of the electronic device.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: April 9, 2024
    Assignee: LANNER ELECTRONICS INC.
    Inventor: Shih-Tai Hung
  • Patent number: 11804655
    Abstract: A Wi-Fi antenna device is disclosed. The Wi-Fi antenna device comprises a ground plane, a plurality of first inverted-F antennas, a plurality of second inverted-F antennas and a plurality of third inverted-F antennas, thereby being capable of transceiving multi-band wireless signals. Particularly, there is an included angle between any two of the first inverted-F antennas. In the same way, any two of the second inverted-F antennas and any two of the third inverted-F antennas are both arranged to have said included angle therebetween. By such an arrangement, an omni radiation pattern can be measured on X-Y plane, X-Z plane and Y-Z plane in case of this novel Wi-Fi antenna device being applied in an environment. Therefore, the Wi-Fi antenna device according to the present invention has a significant potential for replacing the conventional multi-band antenna so as to be applied in a Wi-Fi router.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: October 31, 2023
    Assignee: LANNER ELECTRONICS INC.
    Inventors: Jung-Tai Wu, Yun-Hung Chen
  • Patent number: 11804647
    Abstract: A bridge PCB is disclosed, which comprises: a substrate, a first HF connector, a second HF connector, a first antenna connector, and a first electrical connector, of which a millimeter-wave antenna module is connected with the first antenna connector that is disposed at outside of an electronic device. On the other hand, the first HF connector is coupled to a main board in the electronic device through a first signal transmission cable, and the second HF connector is coupled to the main board through a second signal transmission cable. By such arrangements, the millimeter-wave antenna module is not influenced by the case of an electronic device during the transceiving of millimeter-wave signal. Therefore, there is no need to use a particularly-designed flexible PCB to bridge the mobile communication signal processor and the millimeter-wave antenna module.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: October 31, 2023
    Assignee: LANNER ELECTRONICS INC.
    Inventors: Rui-Xuan Lee, Yun-Hung Chen
  • Publication number: 20230300088
    Abstract: A bypass switch device with indicating function is disclosed. The bypass switch device is for use in a network appliance having at least one Ethernet network module, and comprises N switch units and a microcontroller. The microcontroller is configured to change the switching state of at least two said switch units in case the Ethernet network module fails to work normally, such that at least two RJ45 connectors directly communicate with each other through at least two said switch units. In such case, the microcontroller simultaneously controls one of two LED components included by one said RJ45 connector and one of two LED components included by another one said RJ45 connector, such that the two LED components emit lights for indicating that the Ethernet network module is working in a bypass mode.
    Type: Application
    Filed: May 25, 2022
    Publication date: September 21, 2023
    Applicant: Lanner Electronics Inc.
    Inventors: Chung-Jen Su, Yu-Min Meng, You-Cheng Liao, Lan-Feng Chen, Ming-Ting Ken
  • Publication number: 20230187812
    Abstract: A bridge PCB is disclosed, which comprises: a substrate, a first HF connector, a second HF connector, a first antenna connector, and a first electrical connector, of which a millimeter-wave antenna module is connected with the first antenna connector that is disposed at outside of an electronic device. On the other hand, the first HF connector is coupled to a main board in the electronic device through a first signal transmission cable, and the second HF connector is coupled to the main board through a second signal transmission cable. By such arrangements, the millimeter-wave antenna module is not influenced by the case of an electronic device during the transceiving of millimeter-wave signal. Therefore, there is no need to use a particularly-designed flexible PCB to bridge the mobile communication signal processor and the millimeter-wave antenna module.
    Type: Application
    Filed: June 16, 2022
    Publication date: June 15, 2023
    Applicant: LANNER ELECTRONICS INC.
    Inventors: Rui-Xuan Lee, Yun-Hung Chen
  • Patent number: 11659676
    Abstract: A connection structure for attaching a first electronic device onto a second electronic device is disclosed. The connection structure comprises an action unit and an assist unit, wherein the action unit and the assist unit are particularly designed to be cooperated to each other in case of connecting the first electronic device to the second electronic device. After the first electronic device is attached to the second electronic device through the connection structure, a first electrical connection portion of an electronic card is inserted into an electronic card slot in the first electronic device, and a second electrical connection portion of the electronic card is inserted into an electronic card slot in the second electronic device, thereby making the two electronic devices communicate with to each other through the electronic card. As a result, the function(s) of the first electronic device is expended.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: May 23, 2023
    Assignee: LANNER ELECTRONICS INC.
    Inventor: Cheng-Yen Chung
  • Publication number: 20230100262
    Abstract: A connection structure for attaching a first electronic device onto a second electronic device is disclosed. The connection structure comprises an action unit and an assist unit, wherein the action unit and the assist unit are particularly designed to be cooperated to each other in case of connecting the first electronic device to the second electronic device. After the first electronic device is attached to the second electronic device through the connection structure, a first electrical connection portion of an electronic card is inserted into an electronic card slot in the first electronic device, and a second electrical connection portion of the electronic card is inserted into an electronic card slot in the second electronic device, thereby making the two electronic devices communicate with to each other through the electronic card. As a result, the function(s) of the first electronic device is expended.
    Type: Application
    Filed: May 12, 2022
    Publication date: March 30, 2023
    Applicant: LANNER ELECTRONICS INC.
    Inventors: Cheng-Yen Chung, Kazuhiro Nishikawa
  • Publication number: 20230099973
    Abstract: A replaceable frame assembly is disclosed, which comprises: a base plate, a first fixing unit, a second fixing unit, a front panel, at least one first electrical connection interface, a second electrical connection interface, a third electrical connection interface, and a fixation plate. The replaceable frame assembly is adopted for accommodating an expansion card module, and can be disposed in a case of an electronic device. After being disposed in the case, an electrical connection end of the first electrical connection interface is embedded into an electrical slot that is disposed on a main board, such that the expansion card module communicates with the main board through the second electrical connection interface, the third electrical connection interface, the first electrical connection interface, and the electrical slot, thereby making the expansion card module become a functional electronic module of the electronic device.
    Type: Application
    Filed: April 27, 2022
    Publication date: March 30, 2023
    Applicant: LANNER ELECTRONICS INC.
    Inventor: Shih-Tai Hung
  • Patent number: 11604496
    Abstract: A mobile communication device is disclosed, and is modularized to include an electronic device for performing mobile communication and a frame assembly. The frame assembly comprises a circuit board having an electrical connection interface and a frame having a recess for receiving the electronic device. In addition, a first electrical connector is disposed on a side wall of the recess, and the electronic device has a second electrical connector connected to the first electrical connector, such that the electronic device coupled to the circuit board via the forgoing two electrical connectors. By inserting the mobile communication device into an accommodation space in a casing of a host electronic device, the electrical connection interface is inserted into an electrical slot that is arranged in a printed circuit board in the casing, thereby achieving a function expansion of mobile communication for the host electronic device.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: March 14, 2023
    Assignee: LANNER ELECTRONICS INC.
    Inventors: Shih-Tai Hung, Hsiang-Chun Tseng
  • Publication number: 20230070920
    Abstract: A smart cooling fan system is disclosed, and comprises a first temperature sensor, a second temperature sensor, a first cooling fan connected to a main processor of an electronic device, a second cooling fan disposed in a housing case of the electronic device, and a microcontroller. The microcontroller is configured to, based on immediate fan rotation speed, find out a first volumetric flow rate and a second volumetric flow rate by looking up a CFM-RPM lookup table (LUT), a first PWM LUT and a second PWM LUT, the microcontroller controls the first cooling fan to produce a first airflow having the first volumetric flow rate, and also controls the second cooling fan to produce a second airflow having the second volumetric flow rate. As a result, the operating temperature of the main processor and an ambient temperature of the housing case are therefore immediately reduced.
    Type: Application
    Filed: June 16, 2022
    Publication date: March 9, 2023
    Applicant: LANNER ELECTRONICS INC.
    Inventors: Yueh-Se Huang, Kuo-Liang Shen
  • Publication number: 20230042885
    Abstract: A Wi-Fi antenna device is disclosed. The Wi-Fi antenna device comprises a ground plane, a plurality of first inverted-F antennas, a plurality of second inverted-F antennas and a plurality of third inverted-F antennas, thereby being capable of transceiving multi-band wireless signals. Particularly, there is an included angle between any two of the first inverted-F antennas. In the same way, any two of the second inverted-F antennas and any two of the third inverted-F antennas are both arranged to have said included angle therebetween. By such an arrangement, an omni radiation pattern can be measured on X-Y plane, X-Z plane and Y-Z plane in case of this novel Wi-Fi antenna device being applied in an environment. Therefore, the Wi-Fi antenna device according to the present invention has a significant potential for replacing the conventional multi-band antenna so as to be applied in a Wi-Fi router.
    Type: Application
    Filed: April 27, 2022
    Publication date: February 9, 2023
    Applicant: LANNER ELECTRONICS INC.
    Inventors: Jung-Tai Wu, Yun-Hung Chen
  • Publication number: 20220283613
    Abstract: A mobile communication device is disclosed, and is modularized to include an electronic device for performing mobile communication and a frame assembly. The frame assembly comprises a circuit board having an electrical connection interface and a frame having a recess for receiving the electronic device. In addition, a first electrical connector is disposed on a side wall of the recess, and the electronic device has a second electrical connector connected to the first electrical connector, such that the electronic device coupled to the circuit board via the forgoing two electrical connectors. By inserting the mobile communication device into an accommodation space in a casing of a host electronic device, the electrical connection interface is inserted into an electrical slot that is arranged in a printed circuit board in the casing, thereby achieving a function expansion of mobile communication for the host electronic device.
    Type: Application
    Filed: August 27, 2021
    Publication date: September 8, 2022
    Applicant: LANNER ELECTRONICS INC.
    Inventor: Shih-Tai Hung
  • Patent number: 11395423
    Abstract: A locking mechanism for applying in a computer case is disclosed. The locking mechanism comprises: an actuating unit and a locking member. The actuating unit is pivotally connected to one of two vertically-disposed side plates of the computer case by one end thereof, and comprises a pivot member and a latching member. In the present invention, the actuating unit rotates along a first direction parallel to the vertically-disposed side plate, so as to decrease space required by operating the locking mechanism. Such that the locking mechanism brought advantages of great space-saving, high capacity and low cost of production cost.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: July 19, 2022
    Assignee: LANNER ELECTRONICS INC.
    Inventor: Tse-Min Lin
  • Patent number: 11372748
    Abstract: Disclosures of the present invention describe a method and system for executing compatibility test of operating system. The system is principally a compatibility test management module that comprises a setting unit, a test execution unit, a compatibility determination unit, and a restart aborting unit. During executing a compatibility test for a host electronic device installed with an operating system, the compatibility test management module establishes an agent executor of the test execution unit and an agent executor of the restart aborting unit in the operating system, thereby executing at least one compatibility test for the operating system of the host electronic device during a reboot procedure. Moreover, the reboot aborting unit is configured to stop the agent executor of the test execution unit successively rebooting the host electronic device after the compatibility test is completed.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: June 28, 2022
    Assignee: LANNER ELECTRONICS INC.
    Inventors: Pragati Vithalrao Muley, Yi-Pin Chan
  • Patent number: 11287867
    Abstract: A power sequence monitoring system is disclosed, and comprises: a microprocessor and a control module. The microprocessor comprises a first conversion unit and a second conversion unit. The first conversion unit is used for converting a power-on signal received from a power management chip to a first digital signal, and the second conversion unit is adopted for converting a power-off signal received form the power management chip to a second digital signal. After receiving the first digital signal and the second digital signal from the microprocessor, and the control module outputs a plurality of power monitoring data to an electronic device, such that a user easily knows the power signal state of the host computer by the system of the present invention.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: March 29, 2022
    Assignee: LANNER ELECTRONICS INC.
    Inventors: Pu-Sung Lin, Tseng-Hua Tung, Yi-Hsien Liu, Chien-Hsun Lin, Chang-Ting Liu