Patents Assigned to Lanner Electronics Inc.
  • Patent number: 11953956
    Abstract: A replaceable frame assembly is disclosed, which comprises: a base plate, a first fixing unit, a second fixing unit, a front panel, at least one first electrical connection interface, a second electrical connection interface, a third electrical connection interface, and a fixation plate. The replaceable frame assembly is adopted for accommodating an expansion card module, and can be disposed in a case of an electronic device. After being disposed in the case, an electrical connection end of the first electrical connection interface is embedded into an electrical slot that is disposed on a main board, such that the expansion card module communicates with the main board through the second electrical connection interface, the third electrical connection interface, the first electrical connection interface, and the electrical slot, thereby making the expansion card module become a functional electronic module of the electronic device.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: April 9, 2024
    Assignee: LANNER ELECTRONICS INC.
    Inventor: Shih-Tai Hung
  • Patent number: 11804647
    Abstract: A bridge PCB is disclosed, which comprises: a substrate, a first HF connector, a second HF connector, a first antenna connector, and a first electrical connector, of which a millimeter-wave antenna module is connected with the first antenna connector that is disposed at outside of an electronic device. On the other hand, the first HF connector is coupled to a main board in the electronic device through a first signal transmission cable, and the second HF connector is coupled to the main board through a second signal transmission cable. By such arrangements, the millimeter-wave antenna module is not influenced by the case of an electronic device during the transceiving of millimeter-wave signal. Therefore, there is no need to use a particularly-designed flexible PCB to bridge the mobile communication signal processor and the millimeter-wave antenna module.
    Type: Grant
    Filed: June 16, 2022
    Date of Patent: October 31, 2023
    Assignee: LANNER ELECTRONICS INC.
    Inventors: Rui-Xuan Lee, Yun-Hung Chen
  • Patent number: 11804655
    Abstract: A Wi-Fi antenna device is disclosed. The Wi-Fi antenna device comprises a ground plane, a plurality of first inverted-F antennas, a plurality of second inverted-F antennas and a plurality of third inverted-F antennas, thereby being capable of transceiving multi-band wireless signals. Particularly, there is an included angle between any two of the first inverted-F antennas. In the same way, any two of the second inverted-F antennas and any two of the third inverted-F antennas are both arranged to have said included angle therebetween. By such an arrangement, an omni radiation pattern can be measured on X-Y plane, X-Z plane and Y-Z plane in case of this novel Wi-Fi antenna device being applied in an environment. Therefore, the Wi-Fi antenna device according to the present invention has a significant potential for replacing the conventional multi-band antenna so as to be applied in a Wi-Fi router.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: October 31, 2023
    Assignee: LANNER ELECTRONICS INC.
    Inventors: Jung-Tai Wu, Yun-Hung Chen
  • Publication number: 20230300088
    Abstract: A bypass switch device with indicating function is disclosed. The bypass switch device is for use in a network appliance having at least one Ethernet network module, and comprises N switch units and a microcontroller. The microcontroller is configured to change the switching state of at least two said switch units in case the Ethernet network module fails to work normally, such that at least two RJ45 connectors directly communicate with each other through at least two said switch units. In such case, the microcontroller simultaneously controls one of two LED components included by one said RJ45 connector and one of two LED components included by another one said RJ45 connector, such that the two LED components emit lights for indicating that the Ethernet network module is working in a bypass mode.
    Type: Application
    Filed: May 25, 2022
    Publication date: September 21, 2023
    Applicant: Lanner Electronics Inc.
    Inventors: Chung-Jen Su, Yu-Min Meng, You-Cheng Liao, Lan-Feng Chen, Ming-Ting Ken
  • Publication number: 20230187812
    Abstract: A bridge PCB is disclosed, which comprises: a substrate, a first HF connector, a second HF connector, a first antenna connector, and a first electrical connector, of which a millimeter-wave antenna module is connected with the first antenna connector that is disposed at outside of an electronic device. On the other hand, the first HF connector is coupled to a main board in the electronic device through a first signal transmission cable, and the second HF connector is coupled to the main board through a second signal transmission cable. By such arrangements, the millimeter-wave antenna module is not influenced by the case of an electronic device during the transceiving of millimeter-wave signal. Therefore, there is no need to use a particularly-designed flexible PCB to bridge the mobile communication signal processor and the millimeter-wave antenna module.
    Type: Application
    Filed: June 16, 2022
    Publication date: June 15, 2023
    Applicant: LANNER ELECTRONICS INC.
    Inventors: Rui-Xuan Lee, Yun-Hung Chen
  • Patent number: 11659676
    Abstract: A connection structure for attaching a first electronic device onto a second electronic device is disclosed. The connection structure comprises an action unit and an assist unit, wherein the action unit and the assist unit are particularly designed to be cooperated to each other in case of connecting the first electronic device to the second electronic device. After the first electronic device is attached to the second electronic device through the connection structure, a first electrical connection portion of an electronic card is inserted into an electronic card slot in the first electronic device, and a second electrical connection portion of the electronic card is inserted into an electronic card slot in the second electronic device, thereby making the two electronic devices communicate with to each other through the electronic card. As a result, the function(s) of the first electronic device is expended.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: May 23, 2023
    Assignee: LANNER ELECTRONICS INC.
    Inventor: Cheng-Yen Chung
  • Publication number: 20230099973
    Abstract: A replaceable frame assembly is disclosed, which comprises: a base plate, a first fixing unit, a second fixing unit, a front panel, at least one first electrical connection interface, a second electrical connection interface, a third electrical connection interface, and a fixation plate. The replaceable frame assembly is adopted for accommodating an expansion card module, and can be disposed in a case of an electronic device. After being disposed in the case, an electrical connection end of the first electrical connection interface is embedded into an electrical slot that is disposed on a main board, such that the expansion card module communicates with the main board through the second electrical connection interface, the third electrical connection interface, the first electrical connection interface, and the electrical slot, thereby making the expansion card module become a functional electronic module of the electronic device.
    Type: Application
    Filed: April 27, 2022
    Publication date: March 30, 2023
    Applicant: LANNER ELECTRONICS INC.
    Inventor: Shih-Tai Hung
  • Publication number: 20230100262
    Abstract: A connection structure for attaching a first electronic device onto a second electronic device is disclosed. The connection structure comprises an action unit and an assist unit, wherein the action unit and the assist unit are particularly designed to be cooperated to each other in case of connecting the first electronic device to the second electronic device. After the first electronic device is attached to the second electronic device through the connection structure, a first electrical connection portion of an electronic card is inserted into an electronic card slot in the first electronic device, and a second electrical connection portion of the electronic card is inserted into an electronic card slot in the second electronic device, thereby making the two electronic devices communicate with to each other through the electronic card. As a result, the function(s) of the first electronic device is expended.
    Type: Application
    Filed: May 12, 2022
    Publication date: March 30, 2023
    Applicant: LANNER ELECTRONICS INC.
    Inventors: Cheng-Yen Chung, Kazuhiro Nishikawa
  • Patent number: 11604496
    Abstract: A mobile communication device is disclosed, and is modularized to include an electronic device for performing mobile communication and a frame assembly. The frame assembly comprises a circuit board having an electrical connection interface and a frame having a recess for receiving the electronic device. In addition, a first electrical connector is disposed on a side wall of the recess, and the electronic device has a second electrical connector connected to the first electrical connector, such that the electronic device coupled to the circuit board via the forgoing two electrical connectors. By inserting the mobile communication device into an accommodation space in a casing of a host electronic device, the electrical connection interface is inserted into an electrical slot that is arranged in a printed circuit board in the casing, thereby achieving a function expansion of mobile communication for the host electronic device.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: March 14, 2023
    Assignee: LANNER ELECTRONICS INC.
    Inventors: Shih-Tai Hung, Hsiang-Chun Tseng
  • Publication number: 20230070920
    Abstract: A smart cooling fan system is disclosed, and comprises a first temperature sensor, a second temperature sensor, a first cooling fan connected to a main processor of an electronic device, a second cooling fan disposed in a housing case of the electronic device, and a microcontroller. The microcontroller is configured to, based on immediate fan rotation speed, find out a first volumetric flow rate and a second volumetric flow rate by looking up a CFM-RPM lookup table (LUT), a first PWM LUT and a second PWM LUT, the microcontroller controls the first cooling fan to produce a first airflow having the first volumetric flow rate, and also controls the second cooling fan to produce a second airflow having the second volumetric flow rate. As a result, the operating temperature of the main processor and an ambient temperature of the housing case are therefore immediately reduced.
    Type: Application
    Filed: June 16, 2022
    Publication date: March 9, 2023
    Applicant: LANNER ELECTRONICS INC.
    Inventors: Yueh-Se Huang, Kuo-Liang Shen
  • Publication number: 20230042885
    Abstract: A Wi-Fi antenna device is disclosed. The Wi-Fi antenna device comprises a ground plane, a plurality of first inverted-F antennas, a plurality of second inverted-F antennas and a plurality of third inverted-F antennas, thereby being capable of transceiving multi-band wireless signals. Particularly, there is an included angle between any two of the first inverted-F antennas. In the same way, any two of the second inverted-F antennas and any two of the third inverted-F antennas are both arranged to have said included angle therebetween. By such an arrangement, an omni radiation pattern can be measured on X-Y plane, X-Z plane and Y-Z plane in case of this novel Wi-Fi antenna device being applied in an environment. Therefore, the Wi-Fi antenna device according to the present invention has a significant potential for replacing the conventional multi-band antenna so as to be applied in a Wi-Fi router.
    Type: Application
    Filed: April 27, 2022
    Publication date: February 9, 2023
    Applicant: LANNER ELECTRONICS INC.
    Inventors: Jung-Tai Wu, Yun-Hung Chen
  • Publication number: 20220283613
    Abstract: A mobile communication device is disclosed, and is modularized to include an electronic device for performing mobile communication and a frame assembly. The frame assembly comprises a circuit board having an electrical connection interface and a frame having a recess for receiving the electronic device. In addition, a first electrical connector is disposed on a side wall of the recess, and the electronic device has a second electrical connector connected to the first electrical connector, such that the electronic device coupled to the circuit board via the forgoing two electrical connectors. By inserting the mobile communication device into an accommodation space in a casing of a host electronic device, the electrical connection interface is inserted into an electrical slot that is arranged in a printed circuit board in the casing, thereby achieving a function expansion of mobile communication for the host electronic device.
    Type: Application
    Filed: August 27, 2021
    Publication date: September 8, 2022
    Applicant: LANNER ELECTRONICS INC.
    Inventor: Shih-Tai Hung
  • Patent number: 11395423
    Abstract: A locking mechanism for applying in a computer case is disclosed. The locking mechanism comprises: an actuating unit and a locking member. The actuating unit is pivotally connected to one of two vertically-disposed side plates of the computer case by one end thereof, and comprises a pivot member and a latching member. In the present invention, the actuating unit rotates along a first direction parallel to the vertically-disposed side plate, so as to decrease space required by operating the locking mechanism. Such that the locking mechanism brought advantages of great space-saving, high capacity and low cost of production cost.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: July 19, 2022
    Assignee: LANNER ELECTRONICS INC.
    Inventor: Tse-Min Lin
  • Patent number: 11372748
    Abstract: Disclosures of the present invention describe a method and system for executing compatibility test of operating system. The system is principally a compatibility test management module that comprises a setting unit, a test execution unit, a compatibility determination unit, and a restart aborting unit. During executing a compatibility test for a host electronic device installed with an operating system, the compatibility test management module establishes an agent executor of the test execution unit and an agent executor of the restart aborting unit in the operating system, thereby executing at least one compatibility test for the operating system of the host electronic device during a reboot procedure. Moreover, the reboot aborting unit is configured to stop the agent executor of the test execution unit successively rebooting the host electronic device after the compatibility test is completed.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: June 28, 2022
    Assignee: LANNER ELECTRONICS INC.
    Inventors: Pragati Vithalrao Muley, Yi-Pin Chan
  • Patent number: 11287867
    Abstract: A power sequence monitoring system is disclosed, and comprises: a microprocessor and a control module. The microprocessor comprises a first conversion unit and a second conversion unit. The first conversion unit is used for converting a power-on signal received from a power management chip to a first digital signal, and the second conversion unit is adopted for converting a power-off signal received form the power management chip to a second digital signal. After receiving the first digital signal and the second digital signal from the microprocessor, and the control module outputs a plurality of power monitoring data to an electronic device, such that a user easily knows the power signal state of the host computer by the system of the present invention.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: March 29, 2022
    Assignee: LANNER ELECTRONICS INC.
    Inventors: Pu-Sung Lin, Tseng-Hua Tung, Yi-Hsien Liu, Chien-Hsun Lin, Chang-Ting Liu
  • Patent number: 11224142
    Abstract: A cooling fan module includes a fan unit and an air flow blocking unit. The air flow blocking unit includes a left-side plate, a left-side support pole, a left-side air flow blocking plate, a right-side plate, a right-side support pole, a right-side air flow blocking plate, and a stop member. The left-side air flow blocking plate and the right-side air flow blocking plate are blown by an air flow flowing from outside environment into a case through the fan unit that is in a malfunction state, thereby rotating by respectively taking the left-side support pole and the left-side support pole as a rotary center thereof. Consequently, the left-side air flow blocking plate and the right-side air flow blocking plate are stopped rotating by the stop member, such that the air flow is blocked, by the two air flow blocking plates, from being entering the case.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: January 11, 2022
    Assignee: LANNER ELECTRONICS INC.
    Inventor: Sheng-Han Chiu
  • Patent number: 11202383
    Abstract: A hard drive enclosure with functionality of quick-release, is for application in a host computer, and comprises: an accommodating unit, a plurality of removable units, a connection inter face module, and a connection module. Wherein the accommodating unit has an accommodating space and a receiving opening. And the plurality of removable units is inserted into the accommodating space through the receiving opening, and each of the plurality of removable units carries with a storage device. In the present invention, according to particular design of electrical connectors constituted by printed circuit board assembly, so as to improve insufficient space for electrical routing. In other words, the hard drive enclosure of the present invention includes advantages of decreasing assembly time and low production cost.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: December 14, 2021
    Assignee: LANNER ELECTRONICS INC.
    Inventor: Tse-Min Lin
  • Patent number: 10490896
    Abstract: Disclosures of the present invention describe an antenna device by forming a HF conductive section, a ground electrode, two first LF conductive sections, two first bending conductive sections, two second LF conductive sections, and a second bending conductive section on one surface of a substrate as well as disposing a cover electrode on the other surface of the same substrate. The HF conductive section is designed to have an area extending portion for making a horizontal electrical coupling occur between the area extending portion and the two LF conductive sections. Moreover, the cover electrode covers a portion of the second bending conductive section, all of the ground electrode, a portion of the signal inputting portion, and a portion of the two LF conductive sections, such that a vertical electrical coupling is achieved for enhancing the efficiency of the antenna device during the transmission of LF signal.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: November 26, 2019
    Assignee: LANNER ELECTRONIC INC.
    Inventor: Jung-Tai Wu
  • Patent number: 9363927
    Abstract: The present invention is an electrical signal computing module capable of accommodating printed circuit board, able to lead the exterior air into the main case body, exchange heat with the printed circuit boards, without accumulation of heat and damage of the printed circuit board. The present invention has a main case body with a bottom case and an internal board set, and four accommodating areas are formed by the internal board set and a transmission circuit board, in addition, numerous flow holes disposed at specific position are designed for air flowing in, exchanging heat produced by printed circuit boards as well.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: June 7, 2016
    Assignee: LANNER ELECTRONIC INC.
    Inventors: Tse-Min Lin, Wen-Lung Lee
  • Patent number: 9271425
    Abstract: The present invention relates to an industrial server system, comprising a housing, a backplane, at least one rear board, a first front board, a second front board, and a power supply, wherein the backplane and the power supply are disposed in the housing, and the rear board, the first front board, and the second front board are coupled and configured to the backplane. Four connected blocks are disposed on the backplane, which makes that at least one rear board, the first front board, and the second front board are able to communicate to each other by a plurality of data connecting units disposed on the backplane. The rear board, the first front board, and the second front board of the present invention can achieve a great transmission efficiency by a specific configuration of connected block on the backplane.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: February 23, 2016
    Assignee: LANNER ELECTRONIC INC.
    Inventor: Tse-Min Lin