Abstract: An optical auxiliary unit includes a housing frame, an optical filter and an actuator structure. The housing frame is temporarily placed on a temporary auxiliary carrying substrate, and the housing frame has a bottom opening enclosed by the temporary auxiliary carrying substrate and a top opening opposite to the bottom opening. The optical filter is fixed on the housing frame, and the top opening of the housing frame is enclosed by the optical filter. The actuator structure is fixed on the housing frame to cover the optical filter, and the actuator structure includes a lens holder fixed on the housing frame and a movable lens assembly movably disposed inside the lens holder and above the optical filter.

Abstract: An image sensor module is provided. The image sensor module includes a circuit board, a flat material, an image sensing chip, a holder and a covering plate. The flat material disposed on an assembling surface of the circuit board has a supporting surface and a bottom surface opposite thereto. The image sensing chip with its base surface facing to the supporting surface is configured on the supporting surface. The holder is disposed on the flat material, and the bottom plane of the holder faces to the supporting surface. The supporting surface is used to make the base surface parallel to the bottom plane. The covering plate is arranged on the holder to seal the image sensing chip.

Abstract: An image capturing module includes an image sensing unit and an actuator unit. The image sensing unit includes a circuit substrate and an image sensing chip disposed on the circuit substrate. The actuator unit includes a housing frame disposed on the circuit substrate and a movable lens assembly movably disposed inside the housing frame. The image sensing chip includes an image sensing area having a first geometric center line and a first geometric center point, and the movable lens assembly has a second geometric center line and a second geometric center point. Whereby, when the predetermined energy is provided for the actuator unit to shift the movable lens assembly, the second geometric center line (or the second geometric center point) of the movable lens assembly can be accurately aligned with the first geometric center line (or the first geometric center point) of the image sensing area.

Abstract: An image capturing module includes an image sensing unit and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate. The actuator structure includes a first actuator unit and a second actuator unit. The first actuator unit includes a first housing frame and a first movable assembly movably disposed inside the first housing frame and above the image sensing unit. The second actuator unit includes a second housing frame and a second movable assembly movably disposed inside the second housing frame and above the image sensing unit, and the second movable assembly includes a second movable casing movably disposed in the second housing frame, a microlens array substrate disposed in the second movable casing, and a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability.

Abstract: An image capturing module for reducing assembly tilt angle includes an image sensing unit, an optical auxiliary unit and a leveling auxiliary unit. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The optical auxiliary unit includes a housing frame disposed on the carrier substrate to cover the image sensing chip and a lens assembly disposed inside the housing frame and above the image sensing chip. The leveling auxiliary unit includes a plurality of adhesive materials disposed on the image sensing chip and a light-transmitting leveling substrate supported above the image sensing chip by the adhesive materials. The housing frame directly contacts and downwardly abuts against the light-transmitting leveling substrate, and each adhesive material is formed by mixing adhesive glue and a plurality of micro support bodies.

Abstract: An image capturing module includes an image sensing unit and an optical auxiliary unit. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The optical auxiliary unit includes a housing frame for covering the image sensing chip and a movable lens assembly movably disposed in the housing frame. The movable lens assembly includes a movable casing movably disposed in the housing frame, at least one optical lens group disposed in the movable casing, a microlens array substrate disposed in the movable casing, and a nonconductive photosensitive film layer disposed on the microlens array substrate for increasing the light absorption capability.