Patents Assigned to Laser Corporation
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Patent number: 11888285Abstract: A low numerical aperture fiber output diode laser module, which having several independent diode lasers, and collimated and converged the light beam, for the coupling the light to the core optical fiber with a core diameter of 105 um and a numerical aperture of 0.12. Compared with general products with a numerical aperture of 0.22, the light output angle is reduced to 55%, and use a general blue laser diode for verification. Use an optical software for facilitating the design and optimization of the parameters of the optical lens module.Type: GrantFiled: July 27, 2021Date of Patent: January 30, 2024Assignee: Turning Point Lasers CorporationInventors: Chi-Luen Wang, Hung-Sheng Lee, Tai-Ming Chang, Chun-Hui Yu, Yu-Ching Yeh, Sheng-Ping Lai, Shih-Wei Lin, Yuan-He Teng, Li-Chang Tsou, Szutsun Simon Ou
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Publication number: 20230402822Abstract: A manufacturing method of a semiconductor device includes: providing a semiconductor stack layer, wherein the semiconductor stack layer includes a first type semiconductor layer, a quantum well layer, and a second type semiconductor layer stacked in sequence; growing an aluminum nitride layer on the second type semiconductor layer; and annealing the aluminum nitride layer to achieve quantum well intermixing.Type: ApplicationFiled: November 9, 2022Publication date: December 14, 2023Applicants: National Tsing Hua University, Turning Point Lasers CorporationInventors: Ci-Ling Pan, Chi-Luen Wang, Hung-Sheng Lee, Li-Chang Tsou, Tzu-Neng Lin
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Publication number: 20200132274Abstract: A wavelength division multiplexing module adapted to combine a plurality of light beams to a mixed light beam is provided. The wavelength division multiplexing module includes a housing, a plurality of light emitting elements, an optical division element, and a plurality of reflectors. The light emitting elements are adapted to provide light beams. The optical division element is disposed on a transmission path of the light beams. The reflectors are disposed on the transmission path of the light beams. The optical division element has a reflection region and a light transmission region on one side opposite to the light emitting elements. The reflection region is adapted to reflect a portion of the light beams, and the light transmission region is adapted to allow the mixed light beam to pass through. At least two of the light emitting elements are arranged in an extending direction of the housing.Type: ApplicationFiled: March 11, 2019Publication date: April 30, 2020Applicant: ELITE ADVANCED LASER CORPORATIONInventors: Chu-Liang Cheng, Chi-Hua Wang
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Patent number: 10615883Abstract: A wavelength division multiplexing module adapted to combine a plurality of light beams to a mixed light beam is provided. The wavelength division multiplexing module includes a housing, a plurality of light emitting elements, an optical division element, and a plurality of reflectors. The light emitting elements are adapted to provide light beams. The optical division element is disposed on a transmission path of the light beams. The reflectors are disposed on the transmission path of the light beams. The optical division element has a reflection region and a light transmission region on one side opposite to the light emitting elements. The reflection region is adapted to reflect a portion of the light beams, and the light transmission region is adapted to allow the mixed light beam to pass through. At least two of the light emitting elements are arranged in an extending direction of the housing.Type: GrantFiled: March 11, 2019Date of Patent: April 7, 2020Assignee: ELITE ADVANCED LASER CORPORATIONInventors: Chu-Liang Cheng, Chi-Hua Wang
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Patent number: 10418240Abstract: A nitride semiconductor structure includes a substrate, a nitride semiconductor layer, and a buffer stack layer between the substrate and the nitride semiconductor layer. The buffer stack layer includes a plurality of metal nitride multilayers repeatedly stacked, wherein each of the metal nitride multilayers consists of a first, a second, and a third metal nitride thin films in sequence, or consists of the first, the third, the second, and the third metal nitride thin films in sequence. The aluminum concentration of the first metal nitride thin film is higher than that of the third metal nitride thin film, and the aluminum concentration of the third metal nitride thin film is higher than that of the second metal nitride thin film.Type: GrantFiled: January 12, 2018Date of Patent: September 17, 2019Assignee: ELITE ADVANCED LASER CORPORATIONInventors: Kun-Chuan Lin, Jin-Hsiang Liu, Yu-Lin Hsiao
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Publication number: 20190157080Abstract: A nitride semiconductor structure includes a substrate, a nitride semiconductor layer, and a buffer stack layer between the substrate and the nitride semiconductor layer. The buffer stack layer includes a plurality of metal nitride multilayers repeatedly stacked, wherein each of the metal nitride multilayers consists of a first, a second, and a third metal nitride thin films in sequence, or consists of the first, the third, the second, and the third metal nitride thin films in sequence. The aluminum concentration of the first metal nitride thin film is higher than that of the third metal nitride thin film, and the aluminum concentration of the third metal nitride thin film is higher than that of the second metal nitride thin film.Type: ApplicationFiled: January 12, 2018Publication date: May 23, 2019Applicant: ELITE ADVANCED LASER CORPORATIONInventors: Kun-Chuan Lin, Jin-Hsiang Liu, Yu-Lin Hsiao
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Publication number: 20130248501Abstract: A laser wire stripping apparatus having a collet having a passageway for receiving a wire therein along an axis of insertion. The collet being fixed in position relative to the axis of insertion. A laser source for producing a laser beam. An optical assembly, the optical assembly moving relative to the collet and the axis of insertion for directing a laser beam along an axis of insertion of said wire.Type: ApplicationFiled: March 14, 2013Publication date: September 26, 2013Applicant: Control Laser CorporationInventor: Gregory B. Anderson
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Patent number: 8265436Abstract: A bonding system and a bonding method for alignment are provided. An optical semiconductor includes a light source and a plurality of protruded elements on a surface thereof. A semiconductor bench includes a light receiving element and a plurality of recess elements on a surface thereof. A sidewall of the protruded elements or a sidewall of the recess elements is slanted. A first metallized layer is disposed on a bonding surface of each protruded element and a second metallized layer is disposed on a bottom surface of each recess element, wherein the first metallized layer is used for bonding with the second metallized layer.Type: GrantFiled: May 12, 2010Date of Patent: September 11, 2012Assignees: Industrial Technology Research Institute, Elite Advanced Laser CorporationInventors: Chih-Tsung Shih, Chien-Jen Sun, Jerry Chien, Chu-Liang Cheng, Yi-Jen Chan
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Patent number: 8172412Abstract: An adjustable optical mount adapted for use with an optical table defining a reference plane includes a hollow housing with openings in the side walls to allow passage of an optical beam therethrough, a gimbal base fixed on the top of the housing, a gimbal plate adjustably mounted under the gimbal base, and a carrier bracket fixed to the gimbal plate for holding preselected optical elements within the housing along the path of the beam. Adjustment mechanisms are provided to tilt and rotate the gimbal plate so as to align the optical element on a selected axis relative to the reference plane.Type: GrantFiled: October 31, 2009Date of Patent: May 8, 2012Assignee: Lenox Laser CorporationInventors: Gregory Solyar, Walter Blumenfeld, Joseph D'Etremont
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Patent number: 8097888Abstract: A package carrier suitable for carrying at least one light emitting device and at least one light receiving device includes a carrier substrate and a metal sheet. The carrier substrate includes a first carrying area and a second carrying area. The light emitting device is disposed in the first carrying area and the light receiving device is disposed in the second carrying area. The metal sheet is disposed in the carrier substrate and located between the first carrying area and the second carrier area, for blocking optical signal transmission between the light emitting device and the light receiving device.Type: GrantFiled: October 12, 2009Date of Patent: January 17, 2012Assignee: Elite Advanced Laser CorporationInventors: Chu-Liang Cheng, Chi-Hua Wang
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Publication number: 20110280511Abstract: A bonding system and a bonding method for alignment are provided. An optical semiconductor includes a light source and a plurality of protruded elements on a surface thereof. A semiconductor bench includes a light receiving element and a plurality of recess elements on a surface thereof. A sidewall of the protruded elements or a sidewall of the recess elements is slanted. A first metallized layer is disposed on a bonding surface of each protruded element and a second metallized layer is disposed on a bottom surface of each recess element, wherein the first metallized layer is used for bonding with the second metallized layer.Type: ApplicationFiled: May 12, 2010Publication date: November 17, 2011Applicants: ELITE ADVANCED LASER CORPORATION, INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Tsung Shih, Chien-Jen Sun, Jerry Chien, Chu-Liang Cheng, Yi-Jen Chan
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Patent number: 7927935Abstract: Laser beams emitted by a plurality of laser sources are divided into a plurality of sub-beams, which are irradiated onto selected portions of an amorphous semiconductor on a substrate to crystallize the amorphous semiconductor. A difference in diverging angles between the laser beams is corrected by a beam expander. The apparatus includes a sub-beam selective irradiating system including a sub-beam dividing assembly and a sub-beam focussing assembly. Also, the apparatus includes laser sources, a focussing optical system, and a combining optical system. A stage for supporting a substrate includes a plurality of first stage members, a second stage member disposed above the first stage members, and a third stage member 38C, rotatably disposed above the second stage to support an amorphous semiconductor.Type: GrantFiled: June 8, 2005Date of Patent: April 19, 2011Assignees: Sharp Kabushiki Kaisha, Japan Laser CorporationInventors: Nobuo Sasaki, Tatsuya Uzuka
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Publication number: 20110071425Abstract: Apparatus and methods in which very small volumes of biological fluid-borne material, particularly large molecules such as proteins, may be selectively extracted from or delivered to interstitial fluid (in vivo or in vitro) by means of intra-parenchymal micro-probes inserted in the brain. The primary use of the micro-probe is in neuroscience research, clinical diagnostics or treatment of epilepsy and other neurological conditions; it may also be applied to other organs and biological systems. Eventual human clinical applications may include neurosurgical monitoring, functional tracking of devices or materials introduced in a surgical procedure, or cerebro-spinal fluid sampling.Type: ApplicationFiled: September 21, 2009Publication date: March 24, 2011Applicant: Lenox Laser CorporationInventors: Nandor Ludvig, Walter Blumenfeld, Geza Medveczky
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Publication number: 20110057203Abstract: A package carrier suitable for carrying at least one light emitting device and at least one light receiving device includes a carrier substrate and a metal sheet. The carrier substrate includes a first carrying area and a second carrying area. The light emitting device is disposed in the first carrying area and the light receiving device is disposed in the second carrying area. The metal sheet is disposed in the carrier substrate and located between the first carrying area and the second carrier area, for blocking optical signal transmission between the light emitting device and the light receiving device.Type: ApplicationFiled: October 12, 2009Publication date: March 10, 2011Applicant: ELITE ADVANCED LASER CORPORATIONInventors: Chu-Liang Cheng, Chi-Hua Wang
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Patent number: 7801193Abstract: A laser diode module with an adjustable monitoring current, wherein the photo diodes monitoring the light-emitting power of the laser diode are arranged in array, and wherein a programmed photo diode is formed by the photo diodes in match of a memory and switch control unit. In this way, the problem of an inconstant monitoring current of the prior art is avoided. Meanwhile, an adjustable monitoring current is achieved.Type: GrantFiled: February 20, 2008Date of Patent: September 21, 2010Assignee: Arima Lasers CorporationInventor: Hsien-Cheng Yen
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Publication number: 20100084382Abstract: A first portion of a continuous material strip is indexed through a stamping press and the stamping press is cycled so as to undertake a stamping operation on a section of the material strip during each cycle. A length of the continuous strip is accumulated in an accumulator either upstream or downstream of the stamping press. A second portion of the strip is continuously fed at a non-zero speed through a laser micromachining station positioned such that the accumulator is between the stamping press and the laser micromachining station. The speed of the second portion of said strip is controlled so that this speed is constant for at least a portion of each cycle of the stamping press and so that the average speed of the first portion of said strip through the stamping press is equal to the average speed of the second portion of the strip through the laser micromachining station.Type: ApplicationFiled: December 12, 2007Publication date: April 8, 2010Applicant: Claire Lasers CorporationInventor: Denis Julien Gendron
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Patent number: 7660042Abstract: Laser beams emitted by a plurality of laser sources are divided into a plurality of sub-beams, which are irradiated onto selected portions of an amorphous semiconductor on a substrate to crystallize the amorphous semiconductor. A difference in diverging angles between the laser beams is corrected by a beam expander. The apparatus includes a sub-beam selective irradiating system including a sub-beam dividing assembly and a sub-beam focussing assembly. Also, the apparatus includes laser sources, a focussing optical system, and a combining optical system. A stage for supporting a substrate includes a plurality of first stage members, a second stage member disposed above the first stage members, and a third stage member 38C, rotatably disposed above the second stage to support an amorphous semiconductor.Type: GrantFiled: June 8, 2005Date of Patent: February 9, 2010Assignees: Sharp Kabushiki Kaisha, Japan Laser CorporationInventors: Nobuo Sasaki, Koichi Ohki
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Patent number: 7535150Abstract: Disclosed is a centrifugal turbine gas blower with foil bearings for use with a fast axial flow laser. The blower utilizes variable components in order to operate at different speeds for multiple applications. In addition, a bypass load has been incorporated to avoid a surge condition. The blower utilizes foil bearings that are self-lubricating in order to achieve improved efficiency and maximized speeds during operation. The bearings are designed with a bump layer that provides damping for pre-load. Additionally, the backplate of the thrust assembly contains holes in order to reduce the thrust load and to balance the force on the impeller.Type: GrantFiled: May 8, 2006Date of Patent: May 19, 2009Assignee: PRC Laser CorporationInventor: Walter Wilson
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Patent number: 7528023Abstract: Laser beams emitted by a plurality of laser sources are divided into a plurality of sub-beams, which are irradiated onto selected portions of an amorphous semiconductor on a substrate to crystallize the amorphous semiconductor. A difference in diverging angles between the laser beams is corrected by a beam expander. The apparatus includes a sub-beam selective irradiating system including a sub-beam dividing assembly and a sub-beam focussing assembly. Also, the apparatus includes laser sources, a focussing optical system, and a combining optical system. A stage for supporting a substrate includes a plurality of first stage members, a second stage member disposed above the first stage members, and a third stage member 38C, rotatably disposed above the second stage to support an amorphous semiconductor.Type: GrantFiled: October 30, 2007Date of Patent: May 5, 2009Assignees: Sharp Kabushiki Kaisha, Japan Laser CorporationInventors: Nobuo Sasaki, Koichi Ohki
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Patent number: D596637Type: GrantFiled: November 9, 2006Date of Patent: July 21, 2009Assignee: Elite Advanced Laser CorporationInventors: Chu-Liang Cheng, Chi-Hua Wang, Ying-Tien Shen