Abstract: A laser diode array having a plurality of diode bars bonded by a hard solder to expansion matched spacers and mounted on a gas or liquid cooled heatsink. The spacers are formed of a material such as copper/diamond composite material having a thermal expansion that closely matches that of the laser bars.
Type:
Grant
Filed:
December 28, 2009
Date of Patent:
May 17, 2011
Assignee:
Lasertel, Inc.
Inventors:
Prabhu Thiagarajan, Mark McElhinney, John J. Cahill
Abstract: A laser diode array is formed on a heat sink having an insulating layer in which a plurality of grooves is formed through the ceramic layer and to or into the heat sink. A laser diode stack is soldered to the ceramic layer.
Type:
Grant
Filed:
July 26, 2007
Date of Patent:
January 4, 2011
Assignee:
Lasertel, Inc.
Inventors:
Prabhu Thiagarajan, Mark McElhinney, Jason Helmrich, Feliks Lapinski
Abstract: A laser diode array having a plurality of diode bars bonded by a hard solder to expansion matched spacers and mounted on a gas or liquid cooled heatsink. The spacers are formed of a material such as copper/diamond composite material having a thermal expansion that closely matches that of the laser bars.
Type:
Grant
Filed:
April 17, 2008
Date of Patent:
February 9, 2010
Assignee:
Lasertel, Inc.
Inventors:
Prabhu Thiagarajan, Mark McElhinney, John J. Cahill