Patents Assigned to Lasertel, Inc.
  • Thermal contact for semiconductors and related methods
    Patent number: 10454250
    Abstract: A semiconductor apparatus with improved heat removal and improved heat flow to a heat sink is provided. The semiconductor apparatus includes a p-type semiconductor. An n-p tunnel junction is positioned within an epitaxial structure of the p-type semiconductor. A metal contact layer is connected to the n-p tunnel junction through an alloyed n-type contact interface. The n-p tunnel junction improves heat flow from the semiconductor through an alloyed contact interface formed between the tunnel junction and the metal contact layer which has lower thermal and electrical resistance in comparison to a conventional metallurgically abrupt interface of a p-type contact.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: October 22, 2019
    Assignee: LASERTEL INC.
    Inventors: Devin Earl Crawford, Prabhu Thiagarajan
  • Liquid cooled laser bar arrays incorporating diamond/copper expansion matched materials
    Patent number: 7944955
    Abstract: A laser diode array having a plurality of diode bars bonded by a hard solder to expansion matched spacers and mounted on a gas or liquid cooled heatsink. The spacers are formed of a material such as copper/diamond composite material having a thermal expansion that closely matches that of the laser bars.
    Type: Grant
    Filed: December 28, 2009
    Date of Patent: May 17, 2011
    Assignee: Lasertel, Inc.
    Inventors: Prabhu Thiagarajan, Mark McElhinney, John J. Cahill
  • Method and system for a laser diode bar array assembly
    Patent number: 7864825
    Abstract: A laser diode array is formed on a heat sink having an insulating layer in which a plurality of grooves is formed through the ceramic layer and to or into the heat sink. A laser diode stack is soldered to the ceramic layer.
    Type: Grant
    Filed: July 26, 2007
    Date of Patent: January 4, 2011
    Assignee: Lasertel, Inc.
    Inventors: Prabhu Thiagarajan, Mark McElhinney, Jason Helmrich, Feliks Lapinski
  • Liquid cooled laser bar arrays incorporating diamond/copper expansion matched materials
    Patent number: 7660335
    Abstract: A laser diode array having a plurality of diode bars bonded by a hard solder to expansion matched spacers and mounted on a gas or liquid cooled heatsink. The spacers are formed of a material such as copper/diamond composite material having a thermal expansion that closely matches that of the laser bars.
    Type: Grant
    Filed: April 17, 2008
    Date of Patent: February 9, 2010
    Assignee: Lasertel, Inc.
    Inventors: Prabhu Thiagarajan, Mark McElhinney, John J. Cahill