Abstract: Disclosed is a non-contact temperature sensing apparatus. The non-contact temperature sensing apparatus includes a substrate connected to one end portion of a lead frame; the lead frame extended to an upper portion of the substrate; an element for sensing temperature attached to the other end portion of the lead frame; and an element for compensating temperature attached to a lower surface of the substrate, wherein the element for sensing temperature is separated from the substrate, thereby increasing a thermal responsibility.

Abstract: A temperature sensor element consists of a temperature sensing unit including: a temperature-sensing ceramic unit; first and second electrodes respectively positioned on first and second surface of the temperature-sensing ceramic unit, the second surface opposing the first surface; first and second intermediate electrodes respectively connecting to the first and second electrodes; and first and second lead lines connected to the first and second electrodes via the first and intermediate electrodes, respectively; and a protective unit surrounding the temperature sensing unit, wherein each of the first lead line and the second lead line includes a lead line core coated with a second layer, the lead line core and the second layer being different materials. The lead lines consist of the lead line cores of a metallic material cheaper than the platinum-based metal, which reduces the production cost of the lead lines.

Abstract: An ultra-slim sensor device, comprising: a sensor element; lead wires (or lead frames) connected to the sensor element; a support for protecting the sensor element and the lead wires disposed therein; and upper and lower films disposed on upper and lower sides of the sensor element, the lead wires and the support to insulate them, wherein a thickness of the support is greater than that of the sensor element in order to protect the sensor element and the lead wires from external shocks, and the support gradually becomes thin toward the end thereof such that the upper and lower films come into contact with each other in order to remove a space between the upper and lower films.

Abstract: Provided is a distributed constant type filter. In a stacked body formed by stacking a plurality of printed circuit boards, signal line coil patterns on adjacent printed circuit boards face each another and are electrically connected together at both ends, and ground line coil patterns on adjacent printed circuit boards face each other and are electrically connected together at both ends. Accordingly, the distributed constant type filter has an attenuation characteristic superior to conventional distributed constant type filters while having an equivalent circuit completely different to the conventional distributed constant type filters. In addition, attenuation characteristics can be obtained without being greatly affected by a deviation upon a manufacturing process, and a process of manufacturing the filter is simple.