Abstract: A transfer method of transferring an object to a target substrate by using a deformable film is provided. The method includes: a first process of forming an object on a source substrate, a second process of placing a deformable film on the source substrate on which the object is formed, a third process of embedding the object into the deformable film, a fourth process of separating an object, which is to be transferred, from the source substrate, integrating the transfer object in or on a surface of the deformable film, and separating deformable film, in which the transfer object is integrated, from the source substrate, and a fifth process of transferring the object integrated into the deformable film to a target substrate.
Type:
Grant
Filed:
June 22, 2020
Date of Patent:
March 15, 2022
Assignee:
LC SQUARE CO., LTD.
Inventors:
Je Hyuk Choi, Chang Wan Kim, Chan Soo Shin, Hyeong Ho Park, Shin Keun Kim
Abstract: A transfer method of transferring an object to a target substrate by using a deformable film is provided. The method includes: a first process of forming an object on a source substrate, a second process of placing a deformable film on the source substrate on which the object is formed, a third process of embedding the object into the deformable film, a fourth process of separating an object, which is to be transferred, from the source substrate, integrating the transfer object in or on a surface of the deformable film, and separating deformable film, in which the transfer object is integrated, from the source substrate, and a fifth process of transferring the object integrated into the deformable film to a target substrate.
Type:
Application
Filed:
June 22, 2020
Publication date:
October 8, 2020
Applicant:
LC SQUARE CO., LTD.
Inventors:
Je Hyuk CHOI, Chang Wan KIM, Chan Soo SHIN, Hyeong Ho PARK, Shin Keun KIM