Abstract: A heat dissipation device of server cabinet heat dissipation device of server cabinet, comprising an outer case and a plurality of heat dissipation devices, the outer case is provided with a plurality of vents on one side, and a plurality of fans are installed on the other side, each of the heat dissipation devices is installed in the outer case, and each of the heat dissipation devices has an included angle toward each of the vents or the directions of the fans, so that the wind can pass through continuously after the fans are activated. Each of the heat dissipation devices is directly discharged after that. Since the heat dissipation devices do not overlap on the air circulation path, even if there is more than one heat dissipation device, it can still ensure that there is no temperature difference between each air, so that the heat dissipation effect is better so as the effect of stabilizing the overall heat dissipation temperature.

Abstract: A fast heat-sinking device for evaporators according to the present invention is disclosed, comprising at least one heat-sinking component which is formed by means of conjunctively assembling an outer wall board and an inner wall board; the interior of the outer wall board includes a semi-open first evaporation area; the interior of the inner wall board includes a semi-open second evaporation area, and the inner wall board is concavely configured with a gap; as such, the inner wall board is attached onto one side of the outer wall board thus further being assembled into the heat-sinking component, and the first evaporation area and the second evaporation area are connected in communication at the notch so as to together form an air concentration area, as a heat-sinking structure of the evaporator.

Abstract: A fast heat-sinking, current stabilization and pressure boosting device for condenser is disclosed, comprising a heat exchange module and an outer case. The heat exchange module is further divided into a high pressure area and a low pressure area, and an air in channel is installed in the high pressure area and a water out channel is installed in the low pressure area; also, the heat exchange module is provided with at least one channel, and the heat exchange module is assembled inside the outer case. As such, the pressure difference between the low pressure area and the high pressure area can drive the water in each of the inner channels to flow faster toward the low pressure area.

Abstract: A current stabilization and pressure boosting device for evaporator is disclosed, comprising a heat-sinking module and an outer case, wherein the heat-sinking module is assembled by successively stacking a large number of heat-sinking components, with each of the heat-sinking components having a first board surface, a second board surface and a third board surface, so that the insides of such heat-sinking components form a semi-open inner flow channel, and a fourth board surface is further respectively provided at the two ends of the heat-sinking components opposite to the inner flow channel, and the heat-sinking module is respectively configured with a water injection channel and an air exhausting channel, and the heat-sinking module is installed inside the outer case and the outer lid.

Abstract: A heat-sinking improved structure for evaporators includes at least one heat-sinking component having an outer wall board; an inner wall board extending upwards at the bottom of the outer wall board and dividing the lower portion of the interior of the outer wall board to form two water evaporation areas, and a gas concentration area formed at the top portion of the interior of the outer wall board; then, continuously arranging and combining such a plurality of heat-sinking components in the same direction thereby constituting a heat-sinking module which can be installed and sealed within an outer case in order to operate as a heat-sinking improved structure for the evaporator.

Abstract: An evaporator structure with improved layout of cooling fluid channels includes a heat exchange component, a thermal conductive shell and a top cap. The heat exchange component is accommodated in the thermal conductive shell; the top cap mounted on the thermal conductive shell encloses the heat exchange component; the heat exchange component includes a plurality of transverse channels thereon, two first lengthwise cooling fluid channels near two side edges at the bottom respectively and a plurality of minor second lengthwise cooling fluid channels near the center. When the thermal conductive shell is heated, cooling fluids flowing to first lengthwise cooling fluid channels at both sides through transverse channels are guided into second lengthwise cooling fluid channels via the first lengthwise cooling fluid channels and the transverse channels and distributed throughout heat sources uniformly for full-area heat dissipation.