Abstract: Heat sink for a network card of a compute blade, said compute blade comprising a cold plate wherein a cooling liquid circulates, said heat sink comprising a body comprising two main faces of which a so-called “hot” face and a so-called “cold” face, opposite said hot face, said cold face being configured to be interfaced with the cold plate, the hot face comprising at least one housing configured to receive at least one heat generating component of the network card.

Abstract: A liquid-cooled heat sink for a plurality of compute blade connectors, including an elongated shaped body defining on one of its faces a heat collection surface of the plurality of connectors. The heat collection surface includes a plurality of interfacing zones arranged consecutively along the heat collection surface, wherein each interfacing zone is configured to interface with a connector of the plurality of connectors in order to collect the heat, and wherein the heat sink includes at least one stiffener mounted on the body.

Abstract: Cold plate for a supercomputer compute blade, said cold plate delimiting at least one opening configured to receive at least one heat sink configured to cool at least one electronic component, said cold plate comprising a cooling circuit, comprising channels within which is configured to circulate a “cold” heat transfer fluid to supply said at least one heat sink, and a discharge circuit, comprising channels within which a “hot” heat transfer fluid is configured to circulate after heating through the at least one heat sink, said cold plate consists of an assembly of several separate elements, wherein each pair of adjacent elements fluidly connected at a portion of the cooling circuit or of the discharge circuit comprises a sealing member at the interface of said connection.

Abstract: Method for manufacturing a heat sink for liquid cooling system of a compute blade of a supercomputer, comprising in particular a friction-stir welding step of a base plate at a machined central rib and at a machined rim.

Abstract: An outlet heat sink for a liquid cooling system for an electronic board, including a cold inlet connector, a hot inlet connector and a hot outlet connector. An upper part of a cooling block, on the one hand, conveys the flow of heat transfer fluid entering through the cold inlet connector to the lower part of the cooling block so as to collect heat generated by the electronic board by being conveyed to the hot outlet connector, and on the other hand, conveys the flow of heated-up heat transfer fluid received on the hot inlet connector directly to the hot outlet connector.

Abstract: A computing blade for a liquid-cooled supercomputer, comprising as many network cards as there are processors, each network card being associated with a processor, each network card comprising a plug-in end configured to receive a connector, each network card being configured to allow data communication between said processor and another processor, each network card being mounted to the cold plate being connected to the motherboard via a connection system comprising a first connector, connected to the plug-in end of the network card, and a second connector, connected on the one hand to the first connector via a cable and on the other hand to the motherboard.

Abstract: An interlayer heat sink for a liquid cooling system for an electronic card, the interlayer heat sink including a cold inlet connector, a hot inlet connector, a hot outlet connector, and a cold outlet connector. An upper part of the cooling block divides the flow of heat transfer fluid entering through the cold inlet connector into a first flow, which is oriented towards the lower part of the cooling block so as to collect heat generated by the electronic card by being conveyed to the hot outlet connector, and a second flow, oriented directly to the cold outlet connector, to convey the flow of heated-up heat transfer fluid received on the hot inlet connector directly to the hot outlet connector where it fuses with the heated-up flow in the lower part of the cooling block.

Abstract: Inlet heat sink for a liquid cooling system of an electronic board, comprising a “cold” inlet connector, a “hot” outlet connector, a “cold” outlet connector, the upper part of the cooling block being configured to divide the flow of incoming heat transfer fluid by the cold inlet connector into a first flow oriented to collect the heat generated by the electronic board by being routed to the hot outlet connector, and a second flow, oriented directly to the cold outlet connector.