Abstract: A process for the electrolytic or electroless deposition of a coating of nickel on an aluminum or aluminum alloy substrate which comprises immersing the substrate in a hydroxide solution having a pH of about 12 or above, a nickel or cobalt compound soluble therein and a non-cyanide complexing agent for the nickel or cobalt compound capable of maintaining the nickel or cobalt metal in solution at a pH of about 12 or above, and electrolytically or electrolessly coating a layer of nickel thereon.

Abstract: Gold base alloys containing copper and cadmium are deposited from aqueous plating baths comprising an aqueous alkaline bath containing soluble gold and copper cyanide compounds, a cadmium compound, free cyanide, and an effective amount of a chelating agent capable of chelating cadmium in the presence of free cyanide. The aqueous plating baths can also advantageously contain water soluble polyoxyalkylene compounds that act as brighteners in the above gold-copper-cadmium plating baths. The water soluble polyoxyalkylene compounds also act as brighteners in the gold-copper-cadmium baths in the absence of a chelating agent.

Abstract: A bath for the electrodeposition of bright tin-lead alloys which comprises an aqueous acidic bath containing at least one soluble tin compound and one soluble lead compound to which there has been added:A. a lower alkylene oxide condensation product, andB. an effective amount of at least one pyridine or quinoline compound having the structure ##STR1## wherein the substituents R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.5 each is a hydrogen or halogen atom, a lower alkyl radical containing a hydroxyl group, an alkenyl radical, the radical (C.sub.n H.sub.2n --CO.sub.2 H in which n has a value from 0 to 6 or a carbamide radical or R.sub.4 and R.sub.5 combined form a divalent radical to provide a compound having the structure ##STR2## in which R.sub.6 is nothing or a hydroxyl radical; Z is nothing, 0.sup.- or a quaternary ammonium forming hydrocarbon radical provided that when Z is nothing, at least one of the substituents R.sub.1, R.sub.2, R.sub.3, R.sub.4 and R.sub.

Abstract: Water soluble quarternized pyridine salts are used in amounts from about 0.001 g/l up to their solubility limit of about 10 g/l in aqueous palladium electrolyte plating baths to greatly enhance brightness even to the point of brilliance.

Abstract: The method of preventing or inhibiting diffusion of a base metal into an electrodeposited gold layer on said base metal which comprises electrodepositing a barrier layer on the base metal comprising a tungsten-cobalt alloy or a tungsten-nickel alloy and subsequently electrodepositing gold on the alloy barrier layer. The invention also includes the use of chelating agents in tungsten-cobalt and tungsten-nickel plating baths.