Abstract: The subject of this invention is the development of new alloys along with new processing approaches for the utilization of the alloys. A particular class of alloys comprises at least one noble metal selected from the group comprising gold, palladium, silver and copper and an amount of between about 0.20 weight percent and about 0.80 weight percent of at least one metalloid selected from the group of metalloids consisting of boron, phosphorous, silicon and lithium. Rapid solidification technology in powder fabrication and the addition of metalloids have been combined to produce a new class of palladium based alloys. The metalloid additions greatly increase the hardness, enhance the fine grain structure and aid sintering densification. Net-shape forming is a benefit derived from the characteristics of the new alloys.

Abstract: The present invention provides a process for the electroless plating of easily reducible metals onto ultrafine, usually inert, particles. Such plating is achieved through careful and accurate control of such parameters as the feed rates of the various solutions, the control of pH of the solution, the temperature, pressure and the rate of agitation of the solution in which the plating is taking place. The plated ultrafine composite particles and the powders made from the particles produced by the process are also a part of the invention. There is also provided a metal article of manufacture consisting of a metla such as copper, silver, gold, ruthenium, rhodium, palladium, osmium and platinum with a plurality of shperical shaped ultrafine particles with a diameter of less than about 10 microns dispersed substantially evenly through the metal article.