Abstract: A lighting device includes a base, at least one light emitting chip, at least one optical member covering the light emitting chip, and a thermally conductive adhesive layer. The thermally conductive adhesive layer has opposite sides directly contacting the light emitting chip and the base, respectively.

Abstract: In one embodiment, a light emitting device comprises two linear arrays of light emitting diodes positioned on opposite sides of a linear heat conducting member. In one embodiment, a light emitting device comprises a heat conducting member linear in a first linear direction with a first surface and a second surface opposite the first surface; a first linear array of light emitting diodes thermally coupled to the first surface; a second linear array of light emitting diodes thermally coupled to the second surface; a first light transmitting cover positioned to receive and transmit light from the first linear array of light emitting diodes; and a second light transmitting cover positioned to receive and transmit light from the second linear array of light emitting diodes. In another embodiment, a method of manufacturing a light emitting device comprises snapping or sliding extensions of the light transmitting covers into the grooves.