Patents Assigned to Lediamond Opto Corporation
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Patent number: 9677745Abstract: In a LED lamp structure and an illuminating module thereof, the illuminating module includes a circuit board, a flat plate LED, an electrical pin and a packaging colloid. The circuit board has a length, a first and a second side formed at two sides of the length. The flat plate LED is fixed and electrically connected with the circuit board, bulges at the first side, and includes a substrate and at least one LED grain assembled on the substrate. The flat plate LED can emit omnidirectional light because the substrate is made of transparent material. The electrical pin is fixed and electrically connected with the circuit board and bulges at the second side. The packaging colloid covers the circuit board and the flat plate LED and has a rectangular plastic block. Thereby, the LED lamp structure can remain traditional appearance of a halogen lamp, for collecting and focusing light.Type: GrantFiled: December 7, 2015Date of Patent: June 13, 2017Assignee: LEDIAMOND OPTO CORPORATIONInventors: Peng-Yu Chen, Chung-Ting Tseng, Hsuan-Hsien Lee
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Patent number: 9345073Abstract: A light emitting diode bulb includes a driving circuit board, a lighting unit, and a housing. The driving circuit board has one or more extending parts formed on one side, and a group of electrically connecting pins are disposed on the other side. An electrode is attached to one surface of each of the extending parts. The lighting unit is electrically connected to the electrodes. The housing packages the driving circuit board and the lighting unit, the electrically connected pins extend beyond the housing. The light emitting bulb has advantages of easy manufacture and low cost since the driving circuit board is electrically connected to the lighting unit directly and the housing then packages the driving circuit board and the lighting unit.Type: GrantFiled: January 29, 2015Date of Patent: May 17, 2016Assignee: LEDIAMOND OPTO CORPORATIONInventors: Chung-Ting Tseng, Hsuan-Hsien Lee, Peng-Yu Chen
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Patent number: 9328911Abstract: A LED lamp includes an LED module and thermo-conductive members. The LED module has a transparent base, a plurality of LEDs mounted on the transparent base and a transparent film covering the LEDs. The transparent base has thermo-conductive sections and electro-conductive sections. The thermo-conductive members are attached on the thermo-conductive sections. Thereby, the invention can omnidirectionally emit light and has great effect of heat dissipation.Type: GrantFiled: January 29, 2014Date of Patent: May 3, 2016Assignee: LEDIAMOND OPTO CORPORATIONInventors: Peng-Yu Chen, Chung-Ting Tseng, Hsuan-Hsien Lee, Mu-Yin Lu
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Patent number: 9307589Abstract: A lighting module includes a main circuit board, a plurality of lighting units, and a driving unit. The main circuit board forms a plurality of through holes. Each lighting unit includes a transparent substrate, a circuit layer, a plurality of light emitting diode (LED) dies, and a transparent resin layer. The transparent substrates are arranged on the main circuit board, and then a predetermined angle spans between a first surface of each transparent substrate and the main circuit board. The circuit layer and the LED dies are placed on the first surface, and the LED dies are electrically connected to the circuit layer. The transparent resin layer covers the LED dies. The driving unit includes a driving circuit board including a plurality of protrusions. The protrusions are respectively inserted into the through holes such that the driving circuit board is substantially perpendicular to the main board.Type: GrantFiled: December 20, 2013Date of Patent: April 5, 2016Assignee: Lediamond Opto CorporationInventors: Peng-Yu Chen, Chung-Ting Tseng, Hsuan-Hsien Lee
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Patent number: 9228726Abstract: A globular illuminant device includes a hemispherical carrier, a circuit layer, a plurality of LED dies, an enclosure resin, and a hemispherical cover. The hemispherical carrier includes a carrying surface, a first cambered surface, and a first protrusion including a first surface. The circuit layer is placed on the first surface and the carrying surface. The LED dies are electrically connected to the circuit layer. The enclosure resin covers the LED dies. The hemispherical cover includes a joining surface, a second cambered surface, and a recess formed on the joining surface and concave toward second cambered surface. The hemispherical cover is assembled with the hemispherical carrier such that the joining surface is in contacted with the carrying surface while the LED dies and the enclosure resin are disposed within the recess.Type: GrantFiled: November 13, 2013Date of Patent: January 5, 2016Assignee: LEDIAMOND OPTO CORPORATIONInventors: Peng-Yu Chen, Chung-Ting Tseng
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Publication number: 20150181657Abstract: A lighting module includes a main circuit board, a plurality of lighting units, and a driving unit. The main circuit board forms a plurality of through holes. Each lighting unit includes a transparent substrate, a circuit layer, a plurality of light emitting diode (LED) dies, and a transparent resin layer. The transparent substrates are arranged on the main circuit board, and then a predetermined angle spans between a first surface of each transparent substrate and the main circuit board. The circuit layer and the LED dies are placed on the first surface, and the LED dies are electrically connected to the circuit layer. The transparent resin layer covers the LED dies. The driving unit includes a driving circuit board including a plurality of protrusions. The protrusions are respectively inserted into the through holes such that the driving circuit board is substantially perpendicular to the main board.Type: ApplicationFiled: December 20, 2013Publication date: June 25, 2015Applicant: Lediamond Opto CorporationInventors: Peng-Yu CHEN, Chung-Ting TSENG, Hsuan-Hsien LEE
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Publication number: 20150131278Abstract: A globular illuminant device includes a hemispherical carrier, a circuit layer, a plurality of LED dies, an enclosure resin, and a hemispherical cover. The hemispherical carrier includes a carrying surface, a first cambered surface, and a first protrusion including a first surface. The circuit layer is placed on the first surface and the carrying surface. The LED dies are electrically connected to the circuit layer. The enclosure resin covers the LED dies. The hemispherical cover includes a joining surface, a second cambered surface, and a recess formed on the joining surface and concave toward second cambered surface. The hemispherical cover is assembled with the hemispherical carrier such that the joining surface is in contacted with the carrying surface while the LED dies and the enclosure resin are disposed within the recess.Type: ApplicationFiled: November 13, 2013Publication date: May 14, 2015Applicant: Lediamond Opto CorporationInventors: Peng-Yu CHEN, Chung-Ting TSENG
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Publication number: 20150062895Abstract: A LED lamp includes an LED module and thermo-conductive members. The LED module has a transparent base, a plurality of LEDs mounted on the transparent base and a transparent film covering the LEDs. The transparent base has thermo-conductive sections and electro-conductive sections. The thermo-conductive members are attached on the thermo-conductive sections. Thereby, the invention can omnidirectionally emit light and has great effect of heat dissipation.Type: ApplicationFiled: January 29, 2014Publication date: March 5, 2015Applicant: Lediamond Opto CorporationInventors: Peng-Yu CHEN, Chung-Ting TSENG, Hsuan-Hsien LEE, Mu-Yin LU
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Publication number: 20150009689Abstract: A lamp holder includes an insulating lamp base, a pair of lead frames and an LED strip assembly. The insulating lamp base has two spaced apart through holes. The pair of lead frames is separately inserted in the two through holes. Each lead frame includes a heat conducting section and a supporting section. One end of the heat conducting section is inserted in the through hole, and the other end of the heat conducting section is connected with the supporting section. The two heat conducting sections are extended from the insulating lamp base to separate the two supporting sections from a surface of the insulating lamp base with a distance. The LED strip assembly includes a transparent carrier board, a plural of LED chips and a first transparent glue layer .The transparent carrier board is disposed crossing the two supporting sections.Type: ApplicationFiled: January 30, 2014Publication date: January 8, 2015Applicant: Lediamond Opto CorporationInventors: Peng-Yu CHEN, Chung-Ting TSENG
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Patent number: D719109Type: GrantFiled: September 18, 2013Date of Patent: December 9, 2014Assignee: Lediamond Opto CorporationInventors: Peng-Yu Chen, Chung-Ting Tseng, Hsuan-Hsien Lee
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Patent number: D719110Type: GrantFiled: October 4, 2013Date of Patent: December 9, 2014Assignee: Lediamond Opto CorporationInventors: Peng-Yu Chen, Chung-Ting Tseng, Hsuan-Hsien Lee
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Patent number: D736426Type: GrantFiled: March 13, 2014Date of Patent: August 11, 2015Assignee: LEDIAMOND OPTO CORPORATIONInventors: Peng-Yu Chen, Chung-Ting Tseng, Mu-Yin Lu, Hsuan-Hsien Lee