Patents Assigned to Lediamond Opto Corporation
  • Patent number: 9677745
    Abstract: In a LED lamp structure and an illuminating module thereof, the illuminating module includes a circuit board, a flat plate LED, an electrical pin and a packaging colloid. The circuit board has a length, a first and a second side formed at two sides of the length. The flat plate LED is fixed and electrically connected with the circuit board, bulges at the first side, and includes a substrate and at least one LED grain assembled on the substrate. The flat plate LED can emit omnidirectional light because the substrate is made of transparent material. The electrical pin is fixed and electrically connected with the circuit board and bulges at the second side. The packaging colloid covers the circuit board and the flat plate LED and has a rectangular plastic block. Thereby, the LED lamp structure can remain traditional appearance of a halogen lamp, for collecting and focusing light.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: June 13, 2017
    Assignee: LEDIAMOND OPTO CORPORATION
    Inventors: Peng-Yu Chen, Chung-Ting Tseng, Hsuan-Hsien Lee
  • Patent number: 9345073
    Abstract: A light emitting diode bulb includes a driving circuit board, a lighting unit, and a housing. The driving circuit board has one or more extending parts formed on one side, and a group of electrically connecting pins are disposed on the other side. An electrode is attached to one surface of each of the extending parts. The lighting unit is electrically connected to the electrodes. The housing packages the driving circuit board and the lighting unit, the electrically connected pins extend beyond the housing. The light emitting bulb has advantages of easy manufacture and low cost since the driving circuit board is electrically connected to the lighting unit directly and the housing then packages the driving circuit board and the lighting unit.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: May 17, 2016
    Assignee: LEDIAMOND OPTO CORPORATION
    Inventors: Chung-Ting Tseng, Hsuan-Hsien Lee, Peng-Yu Chen
  • Patent number: 9328911
    Abstract: A LED lamp includes an LED module and thermo-conductive members. The LED module has a transparent base, a plurality of LEDs mounted on the transparent base and a transparent film covering the LEDs. The transparent base has thermo-conductive sections and electro-conductive sections. The thermo-conductive members are attached on the thermo-conductive sections. Thereby, the invention can omnidirectionally emit light and has great effect of heat dissipation.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: May 3, 2016
    Assignee: LEDIAMOND OPTO CORPORATION
    Inventors: Peng-Yu Chen, Chung-Ting Tseng, Hsuan-Hsien Lee, Mu-Yin Lu
  • Patent number: 9307589
    Abstract: A lighting module includes a main circuit board, a plurality of lighting units, and a driving unit. The main circuit board forms a plurality of through holes. Each lighting unit includes a transparent substrate, a circuit layer, a plurality of light emitting diode (LED) dies, and a transparent resin layer. The transparent substrates are arranged on the main circuit board, and then a predetermined angle spans between a first surface of each transparent substrate and the main circuit board. The circuit layer and the LED dies are placed on the first surface, and the LED dies are electrically connected to the circuit layer. The transparent resin layer covers the LED dies. The driving unit includes a driving circuit board including a plurality of protrusions. The protrusions are respectively inserted into the through holes such that the driving circuit board is substantially perpendicular to the main board.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: April 5, 2016
    Assignee: Lediamond Opto Corporation
    Inventors: Peng-Yu Chen, Chung-Ting Tseng, Hsuan-Hsien Lee
  • Patent number: 9228726
    Abstract: A globular illuminant device includes a hemispherical carrier, a circuit layer, a plurality of LED dies, an enclosure resin, and a hemispherical cover. The hemispherical carrier includes a carrying surface, a first cambered surface, and a first protrusion including a first surface. The circuit layer is placed on the first surface and the carrying surface. The LED dies are electrically connected to the circuit layer. The enclosure resin covers the LED dies. The hemispherical cover includes a joining surface, a second cambered surface, and a recess formed on the joining surface and concave toward second cambered surface. The hemispherical cover is assembled with the hemispherical carrier such that the joining surface is in contacted with the carrying surface while the LED dies and the enclosure resin are disposed within the recess.
    Type: Grant
    Filed: November 13, 2013
    Date of Patent: January 5, 2016
    Assignee: LEDIAMOND OPTO CORPORATION
    Inventors: Peng-Yu Chen, Chung-Ting Tseng
  • Publication number: 20150181657
    Abstract: A lighting module includes a main circuit board, a plurality of lighting units, and a driving unit. The main circuit board forms a plurality of through holes. Each lighting unit includes a transparent substrate, a circuit layer, a plurality of light emitting diode (LED) dies, and a transparent resin layer. The transparent substrates are arranged on the main circuit board, and then a predetermined angle spans between a first surface of each transparent substrate and the main circuit board. The circuit layer and the LED dies are placed on the first surface, and the LED dies are electrically connected to the circuit layer. The transparent resin layer covers the LED dies. The driving unit includes a driving circuit board including a plurality of protrusions. The protrusions are respectively inserted into the through holes such that the driving circuit board is substantially perpendicular to the main board.
    Type: Application
    Filed: December 20, 2013
    Publication date: June 25, 2015
    Applicant: Lediamond Opto Corporation
    Inventors: Peng-Yu CHEN, Chung-Ting TSENG, Hsuan-Hsien LEE
  • Publication number: 20150131278
    Abstract: A globular illuminant device includes a hemispherical carrier, a circuit layer, a plurality of LED dies, an enclosure resin, and a hemispherical cover. The hemispherical carrier includes a carrying surface, a first cambered surface, and a first protrusion including a first surface. The circuit layer is placed on the first surface and the carrying surface. The LED dies are electrically connected to the circuit layer. The enclosure resin covers the LED dies. The hemispherical cover includes a joining surface, a second cambered surface, and a recess formed on the joining surface and concave toward second cambered surface. The hemispherical cover is assembled with the hemispherical carrier such that the joining surface is in contacted with the carrying surface while the LED dies and the enclosure resin are disposed within the recess.
    Type: Application
    Filed: November 13, 2013
    Publication date: May 14, 2015
    Applicant: Lediamond Opto Corporation
    Inventors: Peng-Yu CHEN, Chung-Ting TSENG
  • Publication number: 20150062895
    Abstract: A LED lamp includes an LED module and thermo-conductive members. The LED module has a transparent base, a plurality of LEDs mounted on the transparent base and a transparent film covering the LEDs. The transparent base has thermo-conductive sections and electro-conductive sections. The thermo-conductive members are attached on the thermo-conductive sections. Thereby, the invention can omnidirectionally emit light and has great effect of heat dissipation.
    Type: Application
    Filed: January 29, 2014
    Publication date: March 5, 2015
    Applicant: Lediamond Opto Corporation
    Inventors: Peng-Yu CHEN, Chung-Ting TSENG, Hsuan-Hsien LEE, Mu-Yin LU
  • Publication number: 20150009689
    Abstract: A lamp holder includes an insulating lamp base, a pair of lead frames and an LED strip assembly. The insulating lamp base has two spaced apart through holes. The pair of lead frames is separately inserted in the two through holes. Each lead frame includes a heat conducting section and a supporting section. One end of the heat conducting section is inserted in the through hole, and the other end of the heat conducting section is connected with the supporting section. The two heat conducting sections are extended from the insulating lamp base to separate the two supporting sections from a surface of the insulating lamp base with a distance. The LED strip assembly includes a transparent carrier board, a plural of LED chips and a first transparent glue layer .The transparent carrier board is disposed crossing the two supporting sections.
    Type: Application
    Filed: January 30, 2014
    Publication date: January 8, 2015
    Applicant: Lediamond Opto Corporation
    Inventors: Peng-Yu CHEN, Chung-Ting TSENG
  • Patent number: D719109
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: December 9, 2014
    Assignee: Lediamond Opto Corporation
    Inventors: Peng-Yu Chen, Chung-Ting Tseng, Hsuan-Hsien Lee
  • Patent number: D719110
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: December 9, 2014
    Assignee: Lediamond Opto Corporation
    Inventors: Peng-Yu Chen, Chung-Ting Tseng, Hsuan-Hsien Lee
  • Patent number: D736426
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: August 11, 2015
    Assignee: LEDIAMOND OPTO CORPORATION
    Inventors: Peng-Yu Chen, Chung-Ting Tseng, Mu-Yin Lu, Hsuan-Hsien Lee