Abstract: Embodiments of the present invention generally relate to an LED lamp having a heat dissipating means as well as a headlamp (to be mounted e.g. to the front of a vehicle such as e.g. a car or a truck) comprising said LED lamp. Embodiments of the present invention also generally relate to a method for dissipating heat from an LED lamp.

Abstract: An LED module comprises a platform having a recession, wherein the recession presents a center section with a bottom and an enlarged section surrounding the center portion. An LED chip is arranged on the bottom of the center section. A bond wire leads from the LED chip to the bottom of the enlarged section in order to contact a first electrode of the LED chip. In one embodiment the bond wire is electrically connected to the back side of the platform by means of a through contact leading from the bottom of the enlarged section through the platform to the backside of the platform. In another embodiment a first conducting path leads from a first electrode of the LED chip across the side wall of the recession to the surface of the platform and from there across a lateral wall of the platform to the back side of the platform.

Abstract: The invention relates to an LED assembly comprising a carrier (T, T?), at least one LED chip (2, 102) which is arranged on the carrier (T, T?), the LED chip (2, 102) being connected to at least one bonding wire (3, 103), a transparent layer (8, 108) applied over the LED chip (2, 102) and a frame (4, 104) which surrounds the at least one LED chip (2, 102). The frame (4, 104) comprises at least one web (5, 105) so as to divide the frame (4, 104) into at least a first frame region (6, 106), which comprises the at least one LED chip (2, 102), and at least a second frame region (7, 107). The first frame region (6, 106) laterally delimits the layer (8, 108) and the second frame region (7, 107) forms a protective region for the at least one bonding wire (3, 103). By means of the assembly according to the invention, an LED assembly can be achieved which is of simple construction, can be easily assembled and also effectively protects the bonding wires against mechanical influences.

Abstract: The invention relates to a method of manufacturing a rare-earth doped alkaline-earth silicon nitride phosphor of a stoichiometric composition. Said method comprising the step of selecting one or more compounds each comprising at least one element of the group comprising the rare-earth elements (RE), the alkaline-earth elements (AE), silicon (Si) and nitrogen (N) and together comprising the necessary elements to form the rare-earth doped alkaline-earth silicon nitride phosphor (AE2Si5N8:RE). The method further comprises the step of bringing the compounds at an elevated temperature in reaction for forming the rare-earth doped alkaline-earth silicon nitride phosphor (AE2Si5N8:RE). In such a method normally a small amount of oxygen, whether intentionally or not-intentionally added, will be incorporated in the rare-earth doped alkaline-earth silicon nitride phosphor (AE2Si5N8:RE).

Abstract: An LED module comprises at least one LED chip emitting monochromatic light having a first spectrum, a platform on which the LED chip is mounted, a reflecting wall that is separate from or integrated into the platform and surrounds the LED chip on all sides, and a dispensed layer applied above the LED chip. The dispensed layer extends in a dome-shaped manner beyond the reflecting wall such that the following equation is satisfied: 0.1*b?h?0.5*b where h is the height of the dome-shaped dispensed layer, measured from the topmost point of the reflecting wall to the apex of the dome, and b is the diameter of the depression formed by the reflecting wall, measured as the distance from the central axis of the wall.

Abstract: A light emitting device and a method for manufacturing a light emitting device, wherein the light emitting device comprises a light emitting diode (LED) emitting light in a first emission spectrum, and a composition comprising at least two components and being adapted to absorb at least a part of the light in the first emission spectrum and upon absorption to emit an up-converted light in a second emission spectrum, wherein the light in said second emission spectrum has a wavelength range lower than the wavelength range of the light in the first emission spectrum, whereby the light emitted by the light emitting device comprises a mixture at least of light in the first emission spectrum and of light in the second emission spectrum.

Abstract: The invention relates to a device and a method for controlling the light emission (i) of at least three light sources (21, 22, 23), wherein the light emitted by the light sources (21, 22, 23) is detected in a sequence of measuring periods during a calibration phase, and calculated on the basis of the information on the brightness of each individual light source (21, 22, 23) obtained during the measuring periods. In at least one of the measuring periods, the detected light comes from a plurality of the light sources (21, 22, 23).

Abstract: A lighting system (20) comprises a plurality of light units (1, 6, 10, 11), each light unit (1, 6, 10, 11) including a photo sensor (2, 7), a light source (4, 9) and a control unit (3, 8) adapted to operate the light source (4, 9) and to modulate the light emitted by the light source (4, 9) so as to transmit data, wherein the light units (1, 6, 10, 11) are arranged according to a ring topology.

Abstract: An LED module having an LED semiconductor chip mounted directly or indirectly on a platform. The platform is made from silicon and is extends laterally beyond the LED semiconductor chip having an active light emitting layer and a substrate. At least one electronic component that is part of the control circuitry for the LED semiconductor chip is integrated in the silicon platform.

Abstract: An LED module comprises an LED chip mounted on a substrate, a lens, and a metal holder mechanically holding the lens and being soldered on the substrate. The holder can be designed such that it holds the lens such that there is an air gap between the light exit surface of the LED chip and the bottom face of the lens.

Abstract: An LED module with a blue LED chip, over which is arranged a conversion layer, which has a luminous material mixture mixing a further proportion of greater wavelength into the blue light, so that a reddish or greenish or yellowish white light is emitted from the LED module, the emitted light of the LED module having a peak or secondary peak in the red or green or yellow range.

Abstract: An LED module comprises a platform having a recession, wherein the recession presents a center section with a bottom and an enlarged section surrounding the center portion. An LED chip is arranged on the bottom of the center section. A bond wire leads from the LED chip to the bottom of the enlarged section in order to contact a first electrode of the LED chip. In one embodiment the bond wire is electrically connected to the back side of the platform by means of a through contact leading from the bottom of the enlarged section through the platform to the backside of the platform. In another embodiment a first conducting path leads from a first electrode of the LED chip across the side wall of the recession to the surface of the platform and from there across a lateral wall of the platform to the back side of the platform.

Abstract: The invention relates to an LED assembly comprising a carrier (T, T?), at least one LED chip (2, 102) which is arranged on the carrier (T, T?), the LED chip (2, 102) being connected to at least one bonding wire (3, 103), a transparent layer (8, 108) applied over the LED chip (2, 102) and a frame (4, 104) which surrounds the at least one LED chip (2, 102). The frame (4, 104) comprises at least one web (5, 105) so as to divide the frame (4, 104) into at least a first frame region (6, 106), which comprises the at least one LED chip (2, 102), and at least a second frame region (7, 107). The first frame region (6, 106) laterally delimits the layer (8, 108) and the second frame region (7, 107) forms a protective region for the at least one bonding wire (3, 103). By means of the assembly according to the invention, an LED assembly can be achieved which is of simple construction, can be easily assembled and also effectively protects the bonding wires against mechanical influences.

Abstract: A method for operating a controlled illumination apparatus, the illumination apparatus comprising at least one pulse-width modulation (PWM)-controlled LED, the method comprising carrying out a duty cycle sweep of the PWM signal driving the LED while sensing at least one parameter indicative of the power consumption of the LED to compute a curve reflecting the duty-cycle dependency of the power efficiency of the LED.

Abstract: A light emitting device and a method for manufacturing a light emitting device, wherein the light emitting device comprises a light emitting diode (LED) emitting light in a first emission spectrum, and a composition comprising at least two components and being adapted to absorb at least a part of the light in the first emission spectrum and upon absorption to emit an up-converted light in a second emission spectrum, wherein the light in said second emission spectrum has a wavelength range lower than the wavelength range of the light in the first emission spectrum, whereby the light emitted by the light emitting device comprises a mixture at least of light in the first emission spectrum and of light in the second emission spectrum.

Abstract: An LED module comprises at least one LED chip (4) emitting monochromatic light having a first spectrum, a platform (2) on which the LED chip is mounted, a reflecting wall (9) that is separate from or integrated into the platform and surrounds the LED chip on all sides, and a dispensed layer (11) applied above the LED chip. The dispensed layer extends in a dome-shaped manner beyond the reflecting wall such that the following equation is satisfied: 0.1*b?h?0.5*b, where h is the height of the dome-shaped dispensed layer, measured from the topmost point of the reflecting wall to the apex of the dome, and b is the diameter of the depression formed by the reflecting wall, measured as the distance from the central axis of the wall.

Abstract: An LED module comprising an LED chip, with an active gallium nitride layer and a silicon platform on which the LED chip is arranged, wherein the silicon platform has two electrodes on the side facing away from the LED chip which are electrically connected to the LED chip and wherein the thickness of the gallium nitride layer of the LED chip is between 2 ?m and 10 ?m, preferably 1 ?m to 5 ?m.

Abstract: The invention relates to an LED module comprising at least one blue LED and a color conversion layer that is applied thereto and emits a mixed light of the blue light of the LED and the convened spectrum of the color conversion layer. The color conversion layer has at least three different phosphors which at least partially convert the light of the blue LED into red, green, and yellow or yellowish-green light. The phosphor for conversion into red light is a doped nitride compound, preferably a nitridosilicate.