Patents Assigned to Leeno Ind. Inc.
  • Patent number: 8228086
    Abstract: A socket for testing a semiconductor chip includes a base cover, a conductive sheet, upper plungers, a housing, lower plungers and a support plate. The base cover has a coupling opening in the central portion thereof, and the conductive sheet is fitted into the coupling opening of the base cover and includes conductive parts and an insulation part. The upper plungers are seated onto upper ends of the conductive parts and come into contact with corresponding terminals of the semiconductor chip. The housing has insert holes at positions corresponding to the upper plungers and fastens the upper plungers to the corresponding conductive parts. The lower plungers are provided under lower ends of the conductive parts and come into contact with corresponding terminals of a PCB to electrically connect the conductive parts to the PCB.
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: July 24, 2012
    Assignee: Leeno Ind. Inc.
    Inventor: Chae Yoon Lee