Abstract: The disclosed angled modular edge patching system is configured to be mounted to a ceiling, furniture or wall, facilitate cable management functions and enhance space utilization. The disclosed angled modular edge patching system including a patch panel element and a base, which are configured to be releasably engaged.
Type:
Grant
Filed:
June 7, 2022
Date of Patent:
February 13, 2024
Assignee:
Legrand DPC, LLC
Inventors:
Michael J. Moldoch, Jason Finnegan, Yann Morvan, Kenneth A. Cupples, Dylan Petruskevicius, Frank B. Ruotolo
Abstract: Disclosed are power distribution systems and methods in which a power distribution unit (PDU) is provided with an overcurrent protection device and per-outlet current sensing at each of the multiple electrical outlets of the PDU. The described embodiments enable the identification of the electronic device connected to a specific outlet or electronic device that may have caused the overcurrent protection device to trip. The methods of outlet identification in a PDU having multiple electrical outlets includes detecting whether either a peak current or a half-cycle root mean square (RMS) current at each outlet has exceeded a selected threshold prior to the occurrence of the trip event associated with the overcurrent protection device.
Type:
Grant
Filed:
January 17, 2023
Date of Patent:
November 28, 2023
Assignee:
LEGRAND DPC, LLC
Inventors:
Christian Krause, Danny Baumann, Michael Suchoff, James P. Maskaly, Paul Mott
Abstract: An example single-board computer cartridge is provided that includes a housing, a single-board computer, a Power-over-Ethernet receptacle, and a power conversion circuit board. The housing includes a front surface and a rear surface on opposing sides of the housing. The single-board computer is disposed within the housing and includes at least one data output port, the at least one data output port oriented to face the front surface of the housing. The Power-over-Ethernet receptacle is disposed within the housing and is oriented to face the rear surface of the housing. The power conversion circuit board is disposed within the housing. The power conversion circuit board is electrically connected to the single-board computer and the Power-over-Ethernet receptacle such that power and data input are provided to the single-board computer from the Power-over-Ethernet receptacle.