Abstract: An apparatus for noncontact sensing of a voltage response characteristic and/or maximum open-circuit voltage (MOCV) of photovoltaic semiconductor specimens includes a high intensity wide spectrum light source adapted to emit light through a conductive probe tip; the conductive probe tip is situated in spatial relationship with a vacuum chuck to form a capacitive specimen wafer interrogation space upon which specimen wafers are located; the high intensity light source emits light through the conductive probe tip, said light impinges a specimen wafer located within the interrogation space, and voltage response across the probe tip, wafer interrogation space, and vacuum chuck is amplified and recorded.

Abstract: An apparatus (10) for contactless measurement of sheet charge density and mobility includes a microwave source (16), a circular waveguide (50) for transmitting microwave power to a sample (59), such as a semiconductor wafer or panel for flat panel displays, at a measurement location, a first detector (18) for detecting the forward microwave power, a second detector (23) for detecting the microwave power reflected from the sample, and a third detector (95) for detecting the Hall effect power. An automatic positioning subsystem (700) is also provided for allowing automatic positioning of a wafer (59) within the test apparatus (10). The positioning system (700) includes a first end effector (706) and a rotator-lifter (704).

Abstract: An apparatus (10) for contactless measurement of sheet charge density and mobility includes a microwave source (16), a circular waveguide (50) for transmitting microwave power to a sample (59), such as a semiconductor wafer or panel for flat panel displays, at a measurement location, a first detector (18) for detecting the forward microwave power, a second detector (23) for detecting the microwave power reflected from the sample, and a third detector (95) for detecting the Hall effect power. An automatic positioning subsystem (700) is also provided for allowing automatic positioning of a wafer (59) within the test apparatus (10). The positioning system (700) includes a first end effector (706) and a rotator-lifter (704).

Abstract: An apparatus for contactless measurement of sheet charge density and mobility includes a microwave source, waveguide, first, second and third detectors, and an eccentric bore mount for adjusting the sample. A circular waveguide, carrying the TE11 mode, terminates by the sample behind which a short is located. A magnetic field is applied perpendicular to the plane of the sample, and an incident TE11 wave causes an ordinary reflected wave and a reflected wave caused by the Hall effect. A first detector measures the ordinary reflected wave, which has the same polarization as the incident wave. A seperate probe measures the reflected wave caused by the Hall effect, whose polarization is perpendicular to the former. This reflected wave is detected, and the output combined with an attenuated; phase shifted, portion of the forward power at a single detector, to eliminate by destructive interference any spurious incident signal at said detector.

Abstract: An apparatus for contactless measurement of carrier concentration and mobility includes a microwave source, a circular waveguide for transmitting microwave radiation to a sample, such as a semiconductor wafer or panel for flat panel displays, at a measurement location, a first detector for detecting the forward microwave power, a second detector for detecting the microwave power reflected from the sample, and a third detector for detecting the Hall effect power. A circular waveguide, carrying only the TE11 mode, is terminated by the sample behind which a short is located. Perpendicular to the plane of the sample (and along the axis of the circular waveguide), a magnetic field is applied. In this configuration, a given incident TE11 wave will cause two reflected waves. One is the ordinary reflected wave in the same polarization as the incident one. A detector is provided to measure this reflected radiation. The other reflected wave is caused by the Hall effect.

Abstract: An apparatus for testing of electrical, mechanical, physical and/or chemical properties of material in sheet form includes a cassette for holding of sheets and sensors rigidly mounted relative to the cassette. The sensors may be mounted adjacent a test location exterior to the cassette. The cassette and the sensors may be so configured and positioned that a suitable end effector may move sheets of material between storage locations in the cassette and test locations adjacent the sensors. A method for testing sheet material includes the steps of placing the sheet material in a cassette, and conducting tests employing one or more sensors rigidly mounted with respect to the cassette. The method may include employing an end effector to remove the sheet from the cassette, to position the sheet stepwise in several positions relative to the sensors, and to replace the sheet in the cassette upon completion of testing.

Abstract: An apparatus for testing of electrical, mechanical, physical and/or chemical properties of material in sheet form includes a cassette for holding of sheets and sensors rigidly mounted relative to the cassette. The sensors may be mounted adjacent a test location exterior to the cassette. The cassette and the sensors may be so configured and positioned that a suitable end effector may move sheets of material between storage locations in the cassette and test locations adjacent the sensors. A method for testing sheet material includes the steps of placing the sheet material in a cassette, and conducting tests employing one or more sensors rigidly mounted with respect to the cassette. The method may include employing an end effector to remove the sheet from the cassette, to position the sheet stepwise in several positions relative to the sensors, and to replace the sheet in the cassette upon completion of testing.

Abstract: An apparatus for testing of electrical, mechanical, physical and/or chemical properties of material in sheet form includes sensors which may be positioned adjacent to a surface of material in sheet form located in a cassette and supports positioned to reduce sag of the material. A method for testing sheet material includes the steps of placing the sheet material in a cassette, and testing the sheet material while in the cassette. A cassette includes shelves having defined therein test heads for testing properties of material in sheet form. Shelves may have test heads or sensors mounted in a lower surface thereof, which test heads or sensors cooperate with test heads or sensors mounted in the upper surface of the next lower shelf. Shelves may include test points that have multiple sensors that cooperate, such as by inductive coupling, to test the material.

Abstract: An apparatus for testing of electrical, mechanical, physical and/or chemical properties of material in sheet form includes a cassette for holding of sheets and sensors rigidly mounted relative to the cassette. The sensors may be mounted adjacent a test location exterior to the cassette. The cassette and the sensors may be so configured and positioned that a suitable end effector may move sheets of material between storage locations in the cassette and test locations adjacent the sensors. A method for testing sheet material includes the steps of placing the sheet material in a cassette, and conducting tests employing one or more sensors rigidly mounted with respect to the cassette. The method may include employing an end effector to remove the sheet from the cassette, to position the sheet stepwise in several positions relative to the sensors, and to replace the sheet in the cassette upon completion of testing.

Abstract: An electrical contact assembly for use as a component of an automated system for testing electronic devices, such as silicon chips. The contact assembly comprises a ring element, a plurality of spring loaded contact probes, an elastic retaining band and alignment pins. The ring element has a plurality of holes that extend through the element from the top to the bottom surfaces, and a groove that encircles the ring element, extending inwardly from its outer peripheral surface, and connects through a small window with each hole. A spring loaded contact probe is positioned in each hole and has a small portion of its surface projecting into the groove through the window associated with each hole. An elastic retaining band is placed in the groove, and partially grasps a portion of the surface of each spring-loaded contact probe, where the surface thereof projects into the groove.