Abstract: The invention relates to a method and a device for the optical inspection of the surface of semi-conductor substrate. An image (1) is captured on the surface of the semi-conductor substrate which is covered with a thin layer. Said image is made of a plurality of pixels having associated colour values and intensities. The frequency distribution of pixels having equal colour co-ordination values is calculated (3,4,5) from the colour values in a colour range (2), said colour range having a colour intensity and colour co-ordinates. The thus calculated frequency distribution is used (7, 9) to compare a second correspondingly calculated frequency distribution or a variable derived therefrom. According to the invention, the colour shift (9) and/or differences (7) in the colour distribution are determined according to fluctuations in the intensity of the illumination.

Abstract: An apparatus for measuring feature widths on masks 1 for the semiconductor industry is disclosed. The apparatus encompasses a carrier plate 16 that is retained in vibrationally decoupled fashion in a base frame 14; a scanning stage 18, arranged on the carrier plate 16, that carries a mask 1 to be measured, the mask 1 defining a surface 4; and an objective 2 arranged opposite the mask 1. A liquid 25 is provided between the objective 2 and the surface 4 of the mask 1.

Abstract: A coordinate measuring instrument includes a horizontally X-Y displaceable measurement stage for receiving a substrate with a feature that is to be measured, an illumination system, and a detector device. The illumination system includes a light source, an optical fiber bundle, a coupling-in optical system before the optical fiber bundle, a coupling-out optical system after the optical fiber bundle, an illuminating optical system for illuminating an image field, and a homogenizing optical system which is arranged between said coupling-out optical system and said illuminating optical system. The homogenizing optical system homogenizes the non-uniform intensity distribution in the image field of the light emerging from the optical fiber bundle. The light of said light source is picked off via said coupling-in optical system with a large numerical entrance aperture, and is coupled into said optical fiber bundle.

Abstract: An apparatus for wafer inspection is described, comprising an incident-light illumination device (5) having an illumination axis and an imaging device (9) having an image axis, both of which are inclined with respect to one another and are directed onto a region to be inspected of the surface (42) of a wafer (2). According to the present invention, the apparatus is characterized in that the incident-light illumination device (5) and the imaging device (9, 19) each have associated with them a polarizing means whose transmission axes are oriented at a predetermined angle to one another.

Abstract: The invention concerns a system operating unit (30) having a column (3) that is attachable by way of at least two supports (9, 10) to different points of a system housing (14). In the preferred embodiment, this column is attached laterally to the housing, the supports serving for attachment to the housing of the system. In addition, a retaining bracket (4) is connected to the column (3) in such a way that a horizontal deflection of the retaining bracket (4) about a vertical axis is possible.

Abstract: A method of determining defects in a plurality of images having essentially the same image contents is disclosed. A comparison operation is carried out once three fully comparable images having essentially the same image contents are present in the intermediate memory. The stored individual images are accessed randomly. A paired comparison operation between the three difference images is carried out.

Abstract: A method for automatically providing data for the focus monitoring of a lithographic exposure process is disclosed. Firstly, the file for a wafer is generated, which holds at least the information of the size of the wafer, the position of a plurality of measurement pattern, the order in which the measurement patterns are captured and registered, and the alignment of the measurement pattern. Secondly, this information is stored in a master grid. Thirdly, images are acquired of the pattern of each position stored in the master grid of the generated file, wherein the image acquisition is carried out according to the order as stored. Finally, names are assigned to the acquired images.

Abstract: The invention discloses a substrate holder (8) that is configured to receive a substrate (20) and can be utilized to determine the thickness deviation of a substrate from the standard thickness of a specific substrate type. The substrate holder (8) comprises a one-piece frame having a flat upper surface (42). An opening (30) that defines a peripheral rim (32) is provided in the substrate holder (8). Receiving elements (34) on which spheres are provided are shaped onto the peripheral rim (32) of the opening (30). A substrate (20) placed into the substrate holder (8) thus comes to rest on the upper surfaces of the spheres. The support elements (34) are arranged on the peripheral rim of the opening (30) in such a way that they lie at the vertices of an equilateral triangle.

Abstract: A DUV-capable dry objective for microscopes comprises lens groups made of quartz glass, fluorite, and in some cases also lithium fluoride. It possesses a DUV focus for a DUV wavelength region ?DUV±??, where ??=8 nm, and additionally a parfocal IR focus for an IR wavelength ?IR, where 760 nm??IR?920 nm. For that purpose, the penultimate element is of concave configuration on both sides, and its object-side outer radius is much smaller than its image-side outer radius. The DUV objective is IR autofocus-capable.

Abstract: The examination of a wafer (10) has until now been implemented by means of wafer-to-wafer comparison of the entire wafer (10). In order to ensure timely detection of defects, or the development of defects, on a wafer (10) wafer-to-wafer comparison is limited to particular comparison regions (22) selected by the user.

Abstract: The present invention relates to an adapter apparatus for a substrate workstation. The substrate workstation comprises at least one substrate carrier that receives from one side in substantially centered fashion, for transport and/or for handling, a substrate to be processed with the substrate workstation. The intention is to allow substrates that permit contamination only in the edge region also to be processed, in the simplest possible fashion, using a substrate workstation embodied for the centered reception of substrates. The adapter apparatus according to the present invention is characterized in that the adapter apparatus is reversibly adaptable to a substrate carrier of the substrate workstation. The adapter apparatus is embodied in such a way that the substrate is receivable only substantially at its edge region by the adapter apparatus. The present invention further relates to a substrate workstation.

Abstract: An inspection microscope (1) having a light source (3) that emits light of a first wavelength below 400 nm for illumination of a specimen (13) to be inspected, and having an objective (11) that is composed of multiple optical components and has a numerical aperture and a focal length, and having a tube optical system (21) and an autofocus device (25) that directs light of a second wavelength onto the specimen (13), is disclosed. The inspection microscope (1) is characterized by the objective (11), which has an optical correction that eliminates the longitudinal chromatic aberrations with respect to the first and the second wavelength and whose optical components are assembled in cement-free fashion, the second wavelength being greater than 400 nm.

Abstract: In a device for examining a specimen with an electron beam, in particular an SEM, TEM, or CSEM, contamination products are often result from the irradiation. To reduce these contamination products, the surface of the object irradiated with the electron beam is simultaneously illuminated with light, in particular with UV light.

Abstract: A method for inspecting a wafer includes acquiring, prior to an application of a layer onto the wafer, a first optical image of a region of the wafer surface to be inspected. After at least partial removal of the layer, a second optical image is acquired. The region of the wafer surface is inspected by comparing the first and the second images.

Abstract: A method for inspecting a wafer includes telecentrically illuminating, with a radiation source, a region of the wafer surface to be inspected. An image of wafer region is acquired using a camera. The wafer region is inspected using the acquired image.

Abstract: An illumination device according to the present invention comprises a light source (1), an optical fiber bundle (4), a coupling-in optical system (3) before and a coupling-out optical system (5) after the fiber bundle (4), and an illuminating optical system (17; 20). A homogenizing optical system (6) between the coupling-out optical system (5) and illuminating optical system (17; 20) brings about a homogenization of the intensity distribution in the image field. The homogenizing optical system (6) advantageously comprises a micro-honeycomb condenser (7) and a lens member (8) which superimpose the exit opening of the fiber bundle (4) in an intermediate image plane (10) to form a homogeneous intermediate image.

Abstract: A measuring instrument for optical inspection of an object includes a light source for illuminating an object; a detector; an illuminating beam path extending from the light source to the object; a detection beam path extending from the object to the detector; an illuminating optics disposed in the illuminating beam path and/or an imaging optics disposed in the detection beam path for imaging the object onto the detector; a position evaluation device for determining a distance between two points of the object; and an optical device for imposing a profile of a continuously monotonic function on an intensity of light from the light source. The optical device is disposed in at least one of a pupil plane of the imaging optics, a pupil plane of the illuminating optics, and a plane in the illuminating or imaging beam path conjugate with the pupil plane of the imaging optics or the pupil plane of the illuminating optics.

Abstract: The invention discloses a contact sensor having a movably arranged impact detection element spaced away from a stationary housing part; and having a detection system that contains a light source with an emission surface as well as a receiving element, defining a receiving surface, arranged opposite the emission surface of the light source wherein the receiving surface and emission surface are of substantially the same size. Furthermore a a high-precision measurement machine and an apparatus for protecting a protruding component are disclosed.

Abstract: An apparatus (2) and a method for the determination of positioning coordinates for at least one semiconductor substrate (6) are disclosed. A digital camera (11) for acquiring an image of the surface (4) of the semiconductor substrate (6) is provided. A computer system is provided, having a display (41) on which the image of the surface (4) of the semiconductor substrate (6) is presentable. By way of an input means (44), a user can mark at least one site (34) of interest on the surface (4) of the semiconductor substrate (6). A measuring machine (24) then automatically travels to the at least one defined site (34) and carries out the desired measurement or examination.

Abstract: Examination devices and methods operating with incident light have hitherto been used for the examination of wafers. To allow these devices also to be used with the transmitted-light method, it is proposed to configure the substrate holder (16) so that an illumination device (38, 40, 42) is integrated into the substrate holder (16) in such a way that transmitted-light illumination of the wafer (18) is possible.