Abstract: A system of interlocking blocks and rods or tubes for rapid assembly of component infrastructures, where one or more of those components have electronics, power or other instrumentalities built into the component during manufacture, such as by 3-D printing, and the components thereof and methods therefor. The rods or tubes, blocks (for interlocking the rods/tubes) and through-holes allow not only structural stability but interconnectivity of electricity, power or other functionalities. The methodology of the present invention provides a paradigm for modeling more costly and complicated systems. Also, product packaging for products made pursuant to the present invention is scaled so as to be usable in the application of the parts.

Abstract: A system of interlocking blocks and rods or tubes for rapid assembly of component infrastructures, where one or more of those components have electronics, power or other instrumentalities built into the component during manufacture, such as by 3-D printing, and the components thereof and methods therefor. The rods or tubes, blocks (for interlocking the rods/tubes) and through-holes allow not only structural stability but interconnectivity of electricity, power or other functionalities. The methodology of the present invention provides a paradigm for modeling more costly and complicated systems. Also, product packaging for products made pursuant to the present invention is scaled so as to be usable in the application of the parts.

Abstract: A system of interlocking blocks and rods or tubes for rapid assembly of component infrastructures, where one or more of those components have electronics, power or other instrumentalities built into the component during manufacture, such as by 3-D printing, and the components thereof and methods therefor. The rods or tubes, blocks (for interlocking the rods/tubes) and through-holes allow not only structural stability but interconnectivity of electricity, power or other functionalities. The methodology of the present invention provides a paradigm for modeling more costly and complicated systems. Also, product packaging for products made pursuant to the present invention is scaled so as to be usable in the application of the parts.