Abstract: An optical beam homogenizer includes a first hexagonal microlens array having a plurality of hexagonal lenslets. Each lenslet has a hexagonal clear aperture. A second hexagonal microlens array is spaced away from the first hexagonal microlens array at a focal length of the first hexagonal microlens array and has a plurality of hexagonal lenslets. Each lenslet in the second hexagonal microlens array has a non-hexagonal clear aperture.

Abstract: An apparatus, system, and method for deployment of an electronic warfare (EW) asset are provided. The system includes a projectile launching device capable of launching a projectile round. An EW asset is detachably carried by the projectile round. A deployable parachute is attached to the EW asset, wherein the EW asset is configured to be suspended from the parachute when the EW asset is detached from the projectile round. The related method is used for suppression or obscuration of enemy counterfire radar (CFR) system by initiating an EW effect by the EW asset as the EW asset floats towards a ground surface.

Abstract: A coherent beam coupled laser diode array includes an array of laser diodes. Each diode emits a beam propagating along a beam path. An array of collimation optics is included. Each of the collimation optics collimates one beam. A first lenslet array is included. Each lenslet refracts a portion of one beam and a portion of a different beam from the array. A partially reflecting mirror is included. A first portion of each beam propagates through the partially reflecting mirror and a second portion of each beam is reflected back toward the first lenslet array. The second portion of each beam reflected propagates back through the first lenslet array and the collimation optics and into one of the diodes in the array of laser diodes, thereby creating an optical cross coupling. A second lenslet array collimates each beam propagating through each lenslet to form a single laser beam.

Abstract: A laser diode apparatus has a first waveguide layer including a gain region connected in series with a second waveguide layer with a second gain region. A tunnel junction is positioned between the first and second guide layers. A single collimator is positioned in an output path of laser beams emitted from the first and second waveguide layers. The optical beam from the single collimator may be coupled into an optical fiber.

Abstract: A metal-core printed circuit board (MCPCB) and method of generating an ultra-narrow, high-current pulse driver with a MCPCB is provided. The MCPCB includes a rigid, metal heat sink layer and at least one electrically conductive top layer. At least one electrically insulating dielectric layer is positioned between the conductive top layer and rigid, metal heat sink layer, wherein the dielectric layer has a thickness of less than 0.007 inches.

Abstract: A divergence reshaping apparatus for laser diodes having a fast axis and a slow axis includes a fast axis collimator element having positive optical power in the fast axis and no optical power in the slow axis. A slow axis magnifier element has no optical power in the fast axis and positive optical power in the slow axis. An objective element has positive optical power in the fast axis and no optical power in the slow axis. A slow axis collimator element has negative optical power in the fast axis and positive optical power in the slow axis. Every element is optically aligned down an optical axis, and wherein a beam traveling through every element is collimated, compressed and shifted in the fast axis and expanded and collimated in the slow axis.

Abstract: An epoxy-free laser assembly includes at least one laser array and at least one optics assembly positioned within an optical path of at least one laser array. The laser array and the optics assembly are epoxy-free. In one example, the optics assembly has a beam shaping optic and a wavelength stabilization optic, wherein the wavelength stabilization optic is connected to beam shaping optic with at least one tab and solder. In another example, a plurality of optics assemblies is included within the laser assembly, whereby the laser array and all of the plurality of optics assemblies fit within a footprint of the heatsink. Methods of manufacturing the same are also provided.

Abstract: A laser diode apparatus has a first waveguide layer including a gain region connected in series with a second waveguide layer with a second gain region. A tunnel junction is positioned between the first and second guide layers. A single collimator is positioned in an output path of laser beams emitted from the first and second waveguide layers. The optical beam from the single collimator may be coupled into an optical fiber.