Patents Assigned to LEOPLE, Inc.
  • Patent number: 10458113
    Abstract: A building assembly structure comprises a coupling block fixed on the ground or to a frame so as to fix and extend the frame. The coupling block comprises a body has a first through-hole passing through upper and lower portions thereof, a connection member coupled to a lower portion of the first through-hole, and having a second through-hole formed therein, a fixing plate coupled to the connection member so as to be located on the lower portion of the body, and having a fixing protrusion protruding from a side thereof, and a vibration-proof pad coupled to the upper portion of the body in order to absorb load and shocks applied from above.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: October 29, 2019
    Assignee: LEOPLE, Inc.
    Inventors: Cheol Jin Kwon, Ji Hye Kim
  • Publication number: 20170191515
    Abstract: A building assembly structure comprises a coupling block fixed on the ground or to a frame so as to fix and extend the frame. The coupling block comprises a body has a first through-hole passing through upper and lower portions thereof, a connection member coupled to a lower portion of the first through-hole, and having a second through-hole formed therein, a fixing plate coupled to the connection member so as to be located on the lower portion of the body, and having a fixing protrusion protruding from a side thereof, and a vibration-proof pad coupled to the upper portion of the body in order to absorb load and shocks applied from above.
    Type: Application
    Filed: June 29, 2015
    Publication date: July 6, 2017
    Applicant: LEOPLE, Inc.
    Inventors: Cheol Jin KWON, Ji Hye KIM